SCHEMBL822546

SCHEMBL822546

CCC1(COCCCCO)COC1

nearest known ligand 0.38

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
EPHX1 P07099 1/20 0.33
MEN1 O00255 1/20 0.33
THRB P10828 1/20 0.33
HTT P42858 1/20 0.33
KMT2A Q03164 1/20 0.33
MAPT P10636 1/20 0.33
TSHR P16473 2/20 0.32
CYP4F2 P78329 1/20 0.32
CYP4A11 Q02928 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2221245 0.98 MEN1 (0.36) EPHX1MEN1THRBHTTKMT2A
SCHEMBL3003545 0.98 MEN1 (0.36) EPHX1MEN1THRBHTTKMT2A
SCHEMBL2223475 0.95 EPHX1 (0.34) EPHX1MEN1THRBHTTKMT2A
SCHEMBL35991 0.91 TSHR (0.33) EPHX1TSHR
SCHEMBL12677034 0.89 ALDH1A1 (0.33) TSHR
SCHEMBL1594114 0.89 ALDH1A1 (0.33) TSHR
SCHEMBL14655776 0.89 ALDH1A1 (0.33) TSHR
SCHEMBL213891 0.89 ALDH1A1 (0.33) TSHR
SCHEMBL1582321 0.89 ALDH1A1 (0.33) TSHR
SCHEMBL7087398 0.89 ALDH1A1 (0.33) TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 329 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12378425-B2 Thermosetting compositions and forming three-dimensional objects therefrom STRATASYS, INC. (US) 2025-08-05 US claimed
US-12297331-B2 Hard coating film LG CHEM, LTD. (KR) 2025-05-13 US claimed
CN-119463769-A Adhesive composition, wafer-level packaging structure, preparation method of wafer-level packaging structure and semiconductor device 上海玟昕科技有限公司 2025-02-18 CN claimed
US-11999861-B2 Thermosetting compositions and forming three-dimensionalobjects therefrom STRATASYS, INC. (US) 2024-06-04 US claimed
CN-111788269-B Compositions and methods for high temperature jetting of viscous thermoset materials to create solid articles via additive manufacturing 科思创(荷兰)有限公司 2023-10-20 CN claimed
US-11709294-B2 Optical laminate LG CHEM, LTD. (KR) 2023-07-25 US claimed
CN-112390973-B Optical laminate and flexible display device including the same 株式会社LG化学 2023-06-20 CN claimed
CN-112055654-B Optical laminate 株式会社LG化学 2023-04-18 CN claimed
US-20230056681-A1 THERMOSETTING COMPOSITIONS AND FORMING THREE-DIMENSIONALOBJECTS THEREFROM STRATASYS INC. 2023-02-23 US claimed
CN-111788260-B Hard coating film 株式会社LG化学 2023-02-17 CN claimed
EP-3532518-A1 THERMOSETTING COMPOSITIONS AND FORMING THREE-DIMENSIONAL OBJECTS THEREFROM DSM IP Assets B.V. (NL) 2019-09-04 EP claimed
US-20190249018-A1 THERMOSETTING COMPOSITIONS AND FORMING THREE-DIMENSIONALOBJECTS THEREFROM STRATASYS INC. 2019-08-15 US claimed
WO-2019117723-A1 COMPOSITIONS AND METHODS FOR HIGH-TEMPERATURE JETTING OF VISCOUS THERMOSETS TO CREATE SOLID ARTICLES VIA ADDITIVE FABRICATION DSM IP ASSETS B.V. (NL) 2019-06-20 WO claimed
US-20180334589-A1 HARD COATING RESIN COMPOSITION KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY (KR) 2018-11-22 US claimed
WO-2018078160-A1 THERMOSETTING COMPOSITIONS AND FORMING THREE-DIMENSIONAL OBJECTS THEREFROM DSM IP ASSETS B.V. (NL) 2018-05-03 WO claimed
EP-3315522-A1 THERMOSETTING COMPOSITIONS AND FORMING THREE-DIMENSIONAL OBJECTS THEREFROM DSM IP Assets B.V. (NL) 2018-05-02 EP claimed
US-20170145253-A1 SILOXANE HARD-COATING RESIN COMPOSITION KOREA ADVANCED INST SCI & TECH (KR) 2017-05-25 US claimed
EP-2860230-A1 SILOXANE HARD COATING RESIN COMPOSITION Korea Advanced Institute of Science and Technology (KR) 2015-04-15 EP claimed
US-20150093585-A1 SILOXANE HARD-COATING RESIN COMPOSITION KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (KR) 2015-04-02 US claimed
US-8293448-B2 Resin composition for stereolithography CMET INC. (JP) 2012-10-23 US claimed