SCHEMBL825263

SCHEMBL825263

CCCCC(C(=O)[O-])=C(CCCC)C(=O)[O-].CCCC[Sn+2]CCCC

nearest known ligand 0.52

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
CA1 P00915 1/20 0.46
CES1 P23141 6/20 0.46
CES2 O00748 5/20 0.46
ALDH1A1 P00352 2/20 0.38
TP53 P04637 1/20 0.38
FABP3 P05413 3/20 0.36
FFAR3 O14843 2/20 0.36
HDAC3 O15379 2/20 0.36
HDAC1 Q13547 2/20 0.36
HDAC2 Q92769 2/20 0.36
HDAC8 Q9BY41 2/20 0.36
THRB P10828 1/20 0.34
FNTA P49354 1/20 0.34
FNTB P49356 1/20 0.34
PGGT1B P53609 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL477352 1.00 CA1 (0.46) CA1CES1CES2ALDH1A1TP53
SCHEMBL385243 0.92 CES2 (0.50) CES1CES2ALDH1A1FABP3THRB
SCHEMBL385245 0.92 CES2 (0.50) CES1CES2ALDH1A1FABP3THRB
SCHEMBL809604 0.92 CES2 (0.50) CES1CES2ALDH1A1FABP3THRB
SCHEMBL8778133 0.92 CES2 (0.45) CA1CES1CES2ALDH1A1FABP3
SCHEMBL1140586 0.92 CES2 (0.50) CES1CES2ALDH1A1FABP3THRB
SCHEMBL5266753 0.88 CES2 (0.50) CES1CES2ALDH1A1FABP3THRB
SCHEMBL383230 0.88 CES2 (0.50) CES1CES2ALDH1A1FABP3THRB
SCHEMBL383228 0.88 CES2 (0.50) CES1CES2ALDH1A1FABP3THRB
SCHEMBL5266747 0.88 CES2 (0.50) CES1CES2ALDH1A1FABP3THRB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 292 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4741462-A1 PLASTICIZER COMPOSITION Kao Corporation (JP) 2026-05-13 EP disclosed
EP-4720168-A1 METHOD OF PREPARING A MOISTURE CURABLE RESIN COMPOSITION Kaneka Americas Holding, Inc. (US) 2026-04-08 EP disclosed
US-12448479-B2 Radiation curable and printable composition HENKEL AG & CO. KGAA (DE) 2025-10-21 US disclosed
EP-3931237-B1 MOISTURE CURABLE ADHESIVE COMPOSITIONS KANEKA AMERICAS HOLDING INC (US) 2025-08-20 EP disclosed
US-12391853-B2 Adhesive formulations for roofing applications and related methods BMIC LLC (US) 2025-08-19 US disclosed
US-20250179272-A1 REMOVABLE ADHESIVE AND SEALANT COMPOSITION HENKEL AG & CO. KGAA (DE) 2025-06-05 US disclosed
WO-2025111365-A1 METHOD OF PREPARING A MOISTURE CURABLE RESIN COMPOSITION WITH A NON-TIN CATALYST KANEKA AMERICAS HOLDING, INC. (US) 2025-05-30 WO disclosed
EP-4324892-B1 REMOVABLE ADHESIVE AND SEALANT COMPOSITION HENKEL AG & CO KGAA (DE) 2025-04-16 EP disclosed
CN-114127156-B Moisture curable adhesive composition 钟化美洲控股公司 2025-01-21 CN disclosed
WO-2025009512-A1 PLASTICIZER COMPOSITION 花王株式会社 2025-01-09 WO disclosed
US-6451439-B2 A PRIMER COMPRISES, AS COMPONENT, A SATURATED HYDROCARBON POLYMER HAVING ATLEAST ONE-SILICON CONTAINING GROUP WHICH HAS A HYDROXY GROUP OR HYDROLYZABLE GROUP BOUND TO SILICON ATOM AND IS CAPABLE OF CROSSLINKING KANEKA CORPORATION (JP) 2002-09-17 US disclosed
US-20020013427-A1 Method of producing crosslinkable silyl group-containing polyoxyalkylene polymers KANEKA CORPORATION (JP) 2002-01-31 US disclosed
US-20010047056-A1 Primer composition and method of effecting adhesion for sealing compositions KANEKA CORPORATION (JP) 2001-11-29 US disclosed
EP-1146062-A1 Method of producing crosslinkable silyl group-containing polyoxyalkylene polymers Kaneka Corporation (JP) 2001-10-17 EP disclosed
EP-0627472-B1 Curable composition KANEGAFUCHI CHEMICAL IND (JP) 2000-03-08 EP disclosed
US-6025445-A CROSSLINKABLE; POLYSILOXANES; DIALKYLTIN DIALKOXIDE AND HYDRATED METAL SALT CURING AGENT; STORAGE STABILITY KANEKA CORPORATION (JP) 2000-02-15 US disclosed
EP-0931821-A2 Primer composition and method of effecting adhesion for sealing compositions KANEKA CORPORATION (JP) 1999-07-28 EP disclosed
EP-0839872-A2 Curable polymer having reactive silicon-containing functional groups KANEKA CORPORATION (JP) 1998-05-06 EP disclosed
US-5399601-A Overcoatings KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1995-03-21 US disclosed
EP-0627472-A2 Curable composition KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1994-12-07 EP disclosed