Predicted protein targets (top 19)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAPT | P10636 | 4/20 | 0.50 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.50 |
| ▸ | KCNH3 | Q9ULD8 | 3/20 | 0.39 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.37 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.35 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.35 |
| ▸ | CYP2C19 | P33261 | 2/20 | 0.35 |
| ▸ | GAA | P10253 | 1/20 | 0.34 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.34 |
| ▸ | NPC1 | O15118 | 1/20 | 0.34 |
| ▸ | USP2 | O75604 | 1/20 | 0.34 |
| ▸ | TP53 | P04637 | 1/20 | 0.34 |
| ▸ | RAB9A | P51151 | 1/20 | 0.34 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.34 |
| ▸ | MTNR1A | P48039 | 1/20 | 0.33 |
| ▸ | MTNR1B | P49286 | 1/20 | 0.33 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.33 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.33 |
| ▸ | HTT | P42858 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL31687264 | 0.94 | MAPT (0.47) | MAPTALDH1A1KCNH3L3MBTL1CYP1A2 | |
| SCHEMBL15643137 | 0.88 | MAPT (0.47) | MAPTALDH1A1KCNH3L3MBTL1CYP1A2 | |
| SCHEMBL3183033 | 0.85 | MAPT (0.52) | MAPTALDH1A1KCNH3L3MBTL1CYP1A2 | |
| SCHEMBL15643351 | 0.85 | KCNH3 (0.45) | MAPTALDH1A1KCNH3CYP3A4GAA | |
| SCHEMBL134305 | 0.83 | ALDH1A1 (0.53) | MAPTALDH1A1KCNH3L3MBTL1CYP1A2 | |
| SCHEMBL3188632 | 0.83 | GAA (0.59) | MAPTALDH1A1L3MBTL1GAANPSR1 | |
| SCHEMBL722358 | 0.82 | ALDH1A1 (0.52) | MAPTALDH1A1KCNH3L3MBTL1CYP1A2 | |
| Hydrochloric Acid SCHEMBL29522911 | 0.82 | ALDH1A1 (0.52) | MAPTALDH1A1KCNH3L3MBTL1CYP1A2 | |
| SCHEMBL976197 | 0.82 | ALDH1A1 (0.52) | MAPTALDH1A1KCNH3L3MBTL1CYP1A2 | |
| SCHEMBL15643077 | 0.81 | MAPT (0.47) | MAPTALDH1A1KCNH3L3MBTL1CYP1A2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 72 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-122037138-A | Modified epoxy resin, preparation method thereof, epoxy plastic package material and application | 深圳先进电子材料国际创新研究院 | 2026-05-15 | — | — | CN | claimed |
| CN-117487309-A | Epoxy plastic package material and preparation method and application thereof | 深圳先进电子材料国际创新研究院 | 2024-02-02 | — | — | CN | claimed |
| CN-116970260-B | Epoxy plastic package material and preparation method and application thereof | 深圳先进电子材料国际创新研究院 | 2024-01-23 | — | — | CN | claimed |
| CN-116970256-A | High-flame-retardance epoxy plastic package material and preparation method and application thereof | 深圳先进电子材料国际创新研究院 | 2023-10-31 | — | — | CN | claimed |
| CN-116444942-A | Self-repairing epoxy plastic packaging material and preparation method and application thereof | 深圳先进电子材料国际创新研究院 | 2023-07-18 | — | — | CN | claimed |
| CN-106459362-B | Silylated polyurethanes | 亨茨曼国际有限公司 | 2020-10-13 | — | — | CN | claimed |
| US-10351656-B2 | Silylated polyurethanes | HUNTSMAN INTERNATIONAL LLC (US) | 2019-07-16 | — | — | US | claimed |
| EP-3157970-B1 | SILYLATED POLYURETHANES | HUNTSMAN INT LLC (US) | 2019-02-06 | — | — | EP | claimed |
| US-20170198084-A1 | SILYLATED POLYURETHANES | HUNTSMAN INTERNATIONAL LLC | 2017-07-13 | — | — | US | claimed |
| EP-3157970-A1 | SILYLATED POLYURETHANES | Huntsman International LLC (US) | 2017-04-26 | — | — | EP | claimed |
| EP-2957582-A1 | Isocyanate-based prepolymers | HUNTSMAN INTERNATIONAL LLC (US) | 2015-12-23 | — | — | EP | claimed |
| WO-2015193146-A1 | SILYLATED POLYURETHANES | HUNTSMAN INTERNATIONAL LLC (US) | 2015-12-23 | — | — | WO | claimed |
| US-7544727-B2 | molding materials; fluidity; semiconductor chip arranged on a thin, multi-pin, long wire, narrow-pad-pitch, or a mounted substrate; free of molding defects, wire sweep, voids; | HITACHI CHEMICAL CO., LTD. (JP) | 2009-06-09 | — | — | US | claimed |
| CN-122037138-A | Modified epoxy resin, preparation method thereof, epoxy plastic package material and application | 深圳先进电子材料国际创新研究院 | 2026-05-15 | — | — | CN | disclosed |
| CN-119735918-A | Epoxy resin composition and packaging material | 深圳先进电子材料国际创新研究院 | 2025-04-01 | — | — | CN | disclosed |
| CN-117487309-A | Epoxy plastic package material and preparation method and application thereof | 深圳先进电子材料国际创新研究院 | 2024-02-02 | — | — | CN | disclosed |
| US-20050222300-A1 | Encapsulating epoxy resin composition, and electronic parts device using the same | HITACHI CHEMICAL CO., LTD. (JP) | 2005-10-06 | — | — | US | disclosed |
| US-20050165202-A1 | Curing accelerator for curing resin, curing resin composition and electronic component device | HITACHI CHEMICAL CO., LTD. (JP) | 2005-07-28 | — | — | US | disclosed |
| US-20030201548-A1 | Epoxy resin molding material for sealing | IKEZAWA RYOICHI (JP) | 2003-10-30 | — | — | US | disclosed |
| WO-2003072655-A1 | ENCAPSULATING EPOXY RESIN COMPOSITION, AND ELECTRONIC PARTS DEVICE USING THE SAME | HITACHI CHEMICAL CO., LTD. (JP) | 2003-09-04 | — | — | WO | disclosed |