Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ELANE | P08246 | 15/20 | 0.71 |
| ▸ | PPARA | Q07869 | 1/20 | 0.54 |
| ▸ | GAA | P10253 | 1/20 | 0.47 |
| ▸ | PPARG | P37231 | 1/20 | 0.47 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15071417 | 0.91 | ELANE (0.58) | ELANEPPARA | |
| SCHEMBL10483750 | 0.88 | ELANE (0.88) | ELANEPPARAGAAPPARG | |
| SCHEMBL825503 | 0.88 | MAPT (0.62) | ELANE | |
| SCHEMBL131278 | 0.87 | ELANE (0.51) | ELANEPPARA | |
| SCHEMBL825546 | 0.87 | ELANE (0.54) | ELANEPPARA | |
| SCHEMBL825366 | 0.86 | MAPT (0.56) | ELANE | |
| SCHEMBL11964033 | 0.85 | ELANE (0.59) | ELANE | |
| SCHEMBL19888151 | 0.85 | ELANE (0.57) | ELANEPPARA | |
| SCHEMBL14015404 | 0.84 | ELANE (0.58) | ELANE | |
| SCHEMBL683318 | 0.84 | ELANE (0.50) | ELANEGAA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 66 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9915870-B2 | Pattern forming method, composition kit and resist film, and method for producing electronic device using them, and electronic device | FUJIFILM CORPORATION (JP) | 2018-03-13 | — | — | US | disclosed |
| US-9904168-B2 | Actinic ray-sensitive or radiation-sensitive resin composition, actinic ray-sensitive or radiation-sensitive film, mask blank provided with actinic ray-sensitive or radiation-sensitive film, pattern forming method, method for manufacturing electronic device, and electronic device | FUJIFILM CORPORATION (JP) | 2018-02-27 | — | — | US | disclosed |
| US-9651863-B2 | Pattern forming method, active light sensitive or radiation sensitive resin composition, resist film, method for manufacturing electronic device, and electronic device | FUJIFILM CORPORATION (JP) | 2017-05-16 | — | — | US | disclosed |
| US-9632410-B2 | Actinic ray-sensitive or radiation-sensitive resin composition, resist film, resist-coated mask blank, photomask and pattern forming method, and method for producing electronic device using them, and electronic device | FUJIFILM CORPORATION (JP) | 2017-04-25 | — | — | US | disclosed |
| US-9612535-B2 | Pattern forming method, electron beam- or extreme ultraviolet-sensitive resin composition, resist film using the same, method of manufacturing electronic device, and electronic device | FUJIFILM CORPORATION (JP) | 2017-04-04 | — | — | US | disclosed |
| US-9557643-B2 | Pattern forming method, actinic ray-sensitive or radiation-sensitive resin composition, resist film, manufacturing method of electronic device using the same and electronic device | FUJIFILM CORPORATION (JP) | 2017-01-31 | — | — | US | disclosed |
| US-9551933-B2 | Actinic ray-sensitive or radiation-sensitive resin composition, resist film, using the same, pattern forming method, manufacturing method of electronic device, and electronic device | FUJIFILM CORPORATION (JP) | 2017-01-24 | — | — | US | disclosed |
| US-9527809-B2 | Compound, actinic ray-sensitive or radiation-sensitive resin composition, resist film, and pattern formation method, and method for manufacturing electronic device using same, and electronic device | FUJIFILM CORPORATION (JP) | 2016-12-27 | — | — | US | disclosed |
| US-20160320700-A1 | ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, MASK BLANK PROVIDED WITH ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2016-11-03 | — | — | US | disclosed |
| US-9470980-B2 | Pattern-forming method, electron beam-sensitive or extreme ultraviolet radiation-sensitive resin composition, resist film, manufacturing method of electronic device using them and electronic device | FUJIFILM CORPORATION (JP) | 2016-10-18 | — | — | US | disclosed |
| US-20100113264-A1 | CONDUCTIVE SUBSTANCE-ADSORBING RESIN FILM, METHOD FOR PRODUCING CONDUCTIVE SUBSTANCE-ADSORBING RESIN FILM, METAL LAYER-COATED RESIN FILM USING THE SAME, AND METHOD FOR PRODUCING METAL LAYER-COATED RESIN FILM | FUJIFILM CORPORATION (JP) | 2010-05-06 | — | — | US | disclosed |
| US-20100071828-A1 | METHOD OF PRODUCING MULTILAYER STRUCTURE | FUJIFILM CORPORATION (JP) | 2010-03-25 | — | — | US | disclosed |
| US-20100003533-A1 | METAL-FILM-COATED MATERIAL AND PROCESS FOR PRODUCING THE SAME, METALLIC-PATTERN-BEARING MATERIAL AND PROCESS FOR PRODUCING THE SAME, COMPOSITION FOR POLYMER LAYER FORMATION, NITRILE GROUP-CONTAINING POLYMER AND METHOD OF SYNTHESIZING THE SAME, COMPOSITION CONTAINING NITRILE GROUP-CONTAINING POLYMER, AND LAMINATE | FUJIFILM CORPORATION (JP) | 2010-01-07 | — | — | US | disclosed |
| US-20090269561-A1 | METHOD OF PRODUCING METAL PLATED MATERIAL, METAL PLATED MATERIAL, METHOD OF PRODUCING METAL PATTERN MATERIAL, AND METAL PATTERN MATERIAL | FUJIFILM CORPORATION (JP) | 2009-10-29 | — | — | US | disclosed |
| US-20090214876-A1 | METAL-FILM-COATED MATERIAL AND PROCESS FOR PRODUCING THE SAME, METALLIC-PATTERN-BEARING MATERIAL AND PROCESS FOR PRODUCING THE SAME, COMPOSITION FOR POLYMER LAYER FORMATION, NITRILE GROUP-CONTAINING POLYMER AND METHOD OF SYNTHESIZING THE SAME, COMPOSITION CONTAINING NITRILE GROUP-CONTAINING POLYMER, AND LAMINATE | FUJIFILM CORPORATION (JP) | 2009-08-27 | — | — | US | disclosed |
| US-20090123642-A1 | EPOXY RESIN COMPOSITION, CONDUCTIVE FILM FORMING METHOD, CONDUCTIVE PATTERN FORMING METHOD, AND MULTILAYERED WIRING BOARD MANUFACTURING METHOD | FUJIFILM CORPORATION (JP) | 2009-05-14 | — | — | US | disclosed |
| US-7445831-B2 | Radiation curable low stress relaxation elastomeric materials | THE PROCTER & GAMBLE COMPANY (US) | 2008-11-04 | — | — | US | disclosed |
| US-20080248419-A1 | POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME | FUJIFILM CORPORATION (JP) | 2008-10-09 | — | — | US | disclosed |
| US-20080241749-A1 | POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE SAME | FUJIFILM CORPORATION (JP) | 2008-10-02 | — | — | US | disclosed |
| US-20070246249-A1 | Metal Pattern Forming Methd, Metal Pattern Obtained by the Same, Printed Wiring Board, Conductive Film Forming Method, and Conductive Film Obtained by the Same | FUJI PHOTO FILM CO., LTD. (JP) | 2007-10-25 | — | — | US | disclosed |