SCHEMBL825720

SCHEMBL825720

CCCCS(=O)(=O)OC(F)(F)F

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
FAAH O00519 7/20 0.38
NPC1 O15118 1/20 0.37
S1PR2 O95136 1/20 0.37
S1PR4 O95977 1/20 0.37
ALDH1A1 P00352 1/20 0.37
LMNA P02545 1/20 0.37
TP53 P04637 1/20 0.37
POLB P06746 1/20 0.37
MAPT P10636 1/20 0.37
HPGD P15428 1/20 0.37
XBP1 P17861 1/20 0.37
S1PR1 P21453 1/20 0.37
MAPK1 P28482 1/20 0.37
AGTR1 P30556 1/20 0.37
HTT P42858 1/20 0.37
RAB9A P51151 1/20 0.37
SMN1; SMN2 Q16637 1/20 0.37
NPSR1 Q6W5P4 1/20 0.37
HSD17B10 Q99714 1/20 0.37
CES1 P23141 5/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29172568 0.98 FAAH (0.37) FAAHNPC1S1PR2S1PR4ALDH1A1
SCHEMBL27643155 0.98 FAAH (0.37) FAAHNPC1S1PR2S1PR4ALDH1A1
SCHEMBL27914222 0.94 FAAH (0.34) FAAHNPC1S1PR2S1PR4ALDH1A1
SCHEMBL3635073 0.91 FAAH (0.50) FAAHCES1CES2EPHX1CA2
SCHEMBL27806187 0.91 FAAH (0.50) FAAHCES1CES2EPHX1CA2
SCHEMBL22588843 0.86 FAAH (0.31) FAAHCES1CES2
Ammonia Solution, Strong SCHEMBL28876376 0.84 FAAH (0.30) FAAH
SCHEMBL30612761 0.80 CA1 (0.31) CA2CA1CA9
SCHEMBL27466383 0.79 CA2 (0.38) FAAHNPC1S1PR2S1PR4ALDH1A1
SCHEMBL1500555 0.78

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-102250460-A Halogen-free inflaming-retarding conductive PC resin composition, and preparation method thereof Milestone corp 2011-11-23 CN claimed
US-12319798-B2 Water-soluble film and packaging KURARAY CO., LTD. (JP) 2025-06-03 US disclosed
CN-113874426-B Water-soluble film and package 株式会社可乐丽 2025-03-28 CN disclosed
CN-111989369-B Resin composition, method for producing resin composition, and method for producing resin molded article 索尼公司 2023-07-18 CN disclosed
EP-3960798-A1 WATER-SOLUBLE FILM AND PACKAGING Kuraray Co., Ltd. (JP) 2022-03-02 EP disclosed
US-20220041824-A1 WATER-SOLUBLE FILM AND PACKAGING KURARAY CO., LTD. (JP) 2022-02-10 US disclosed
CN-113874426-A Water-soluble film and package 株式会社可乐丽 2021-12-31 CN disclosed
WO-2020218321-A1 WATER-SOLUBLE FILM AND PACKAGING 株式会社クラレ 2020-10-29 WO disclosed
CN-108286054-A A kind of diaphragm of electrolyzer and methods for using them of electrolysis carbon dioxide carbon monoxide 昆明理工大学 2018-07-17 CN disclosed
US-8338513-B2 Polycarbonate resin composition, polycarbonate resin molded article, and method for producing the same IDEMITSU KOSAN CO., LTD. (JP) 2012-12-25 US disclosed
US-8143330-B2 Polycarbonate resin composition, molded polycarbonate resin article, and method for production of the molded polycarbonate resin article IDEMITSU KOSAN CO., LTD. (JP) 2012-03-27 US disclosed
CN-102250460-A Halogen-free inflaming-retarding conductive PC resin composition, and preparation method thereof Milestone corp 2011-11-23 CN disclosed
US-8013105-B2 Flame-retardant polycarbonate resin composition, polycarbonate resin molded article, and method for producing the polycarbonate resin molded article IDEMITSU KOSAN CO., LTD. (JP) 2011-09-06 US disclosed
US-20110021678-A1 POLYCARBONATE RESIN COMPOSITION, MOLDED POLYCARBONATE RESIN, AND PROCESS FOR PRODUCING THE SAME IDEMITSU KOSAN CO., LTD. (JP) 2011-01-27 US disclosed
CN-1712199-B Method for recycling recovered discs, flame retardant resin composition and flame retardant resin molded products SONY CORP 2010-12-08 CN disclosed
US-20100267880-A1 POLYCARBONATE RESIN COMPOSITION, MOLDED POLYCARBONATE RESIN ARTICLE, AND METHOD FOR PRODUCTION OF THE MOLDED POLYCARBONATE RESIN ARTICLE IDEMITSU KOSAN CO., LTD. (JP) 2010-10-21 US disclosed
US-20100256279-A1 POLYCARBONATE RESIN COMPOSITION, POLYCARBONATE RESIN MOLDED ARTICLE, AND METHOD FOR PRODUCING THE SAME IDEMITSU KOSAN CO., LTD (JP) 2010-10-07 US disclosed
EP-2221341-A1 POLYCARBONATE RESIN COMPOSITION, MOLDED POLYCARBONATE RESIN ARTICLE, AND METHOD FOR PRODUCTION OF THE MOLDED POLYCARBONATE RESIN ARTICLE Idemitsu Kosan Co., Ltd. (JP) 2010-08-25 EP disclosed
US-20100028640-A1 FLAME-RETARDANT POLYCARBONATE RESIN COMPOSITION, POLYCARBONATE RESIN MOLDED ARTICLE, AND METHOD FOR PRODUCING THE POLYCARBONATE RESIN MOLDED ARTICLE IDEMITSU KOSAN CO., LTD. (JP) 2010-02-04 US disclosed
CN-1712199-A Method for recycling recovered discs, flame retardant resin composition and flame retardant resin molded products SONY CORP (JP) 2005-12-28 CN disclosed