SCHEMBL82665

SCHEMBL82665

CCCc1c[nH]c(C)n1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27935093 0.92 NOS3 (0.35)
SCHEMBL1532157 0.87 NOS2 (0.43)
Bromide SCHEMBL28138959 0.85 NOS2 (0.42)
Iodide SCHEMBL28121383 0.85 NOS2 (0.42)
Hydrochloric Acid SCHEMBL6123019 0.85 NOS2 (0.42)
SCHEMBL29569302 0.85 NOS2 (0.42)
SCHEMBL29569048 0.85 NOS2 (0.42)
SCHEMBL7701413 0.85 KCNH2 (0.47)
Fluoride SCHEMBL28843855 0.85 NOS2 (0.42)
SCHEMBL30586310 0.84 SMN1; SMN2 (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 140 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3344676-A1 CYANATE ESTER DUAL CURE RESINS FOR ADDITIVE MANUFACTURING CARBON, INC. (US) 2018-07-11 EP claimed
WO-2017040883-A1 CYANATE ESTER DUAL CURE RESINS FOR ADDITIVE MANUFACTURING CARBON, INC. (US) 2017-03-09 WO claimed
JP-4718070-B2 2011-07-06 JP claimed
US-20110070486-A1 IONIC LIQUID NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY (JP) 2011-03-24 US claimed
EP-1802707-A1 APROTIC POLYMER/MOLTEN SALT TERNARY MIXTURE SOLVENT, METHOD FOR THE PRODUCTION AND USE THEREOF IN ELECTROCHEMICAL SYSTEMS HYDRO-QUEBEC (CA) 2007-07-04 EP claimed
WO-2006039795-A1 APROTIC POLYMER/MOLTEN SALT TERNARY MIXTURE SOLVENT, METHOD FOR THE PRODUCTION AND USE THEREOF IN ELECTROCHEMICAL SYSTEMS HYDRO-QUEBEC (CA) 2006-04-20 WO claimed
EP-1565536-A1 B-STAGEABLE DIE ATTACH ADHESIVES Henkel Corporation (US) 2005-08-24 EP claimed
WO-2004048491-A1 B-STAGEABLE DIE ATTACH ADHESIVES HENKEL CORPORATION (US) 2004-06-10 WO claimed
EP-1339524-A1 FLUXING UNDERFILL COMPOSITIONS Henkel Loctite Corporation (US) 2003-09-03 EP claimed
WO-2003044089-A1 THERMOSETTING RESIN COMPOSITIONS USEFUL AS UNDERFILL SEALANTS HENKEL CORPORATION (US) 2003-05-30 WO claimed
JP-2003502484-A 2003-01-21 JP claimed
JP-2002540235-A 2002-11-26 JP claimed
WO-2002070191-A1 FLUXING UNDERFILL COMPOSITIONS HENKEL LOCTITE CORPORATION (US) 2002-09-12 WO claimed
EP-1194953-A4 CONTROLLABLY DEGRADABLE COMPOSITION OF HETEROATOM CARBOCYCLIC OR EPOXY RESIN AND CURING AGENT LOCTITE CORP (US) 2002-09-04 EP claimed
WO-2002028849-A1 REWORKABLE EPOXIDIZED 1-(CYCLO)ALKENYL ETHER/POLYCARBOXYLIC ACID PRODUCT HENKEL LOCTITE CORPORATION (US) 2002-04-11 WO claimed
EP-1194953-A1 CONTROLLABLY DEGRADABLE COMPOSITION OF HETEROATOM CARBOCYCLIC OR EPOXY RESIN AND CURING AGENT LOCTITE CORPORATION (US) 2002-04-10 EP claimed
EP-1090057-A1 REWORKABLE THERMOSETTING RESIN COMPOSITIONS LOCTITE CORPORATION (US) 2001-04-11 EP claimed
WO-2000079582-A9 CONTROLLABLY DEGRADABLE COMPOSITION OF HETEROATOM CARBOCYCLIC OR EPOXY RESIN AND CURING AGENT LOCTITE CORP (US) 2001-03-15 WO claimed
WO-2000079582-A1 CONTROLLABLY DEGRADABLE COMPOSITION OF HETEROATOM CARBOCYCLIC OR EPOXY RESIN AND CURING AGENT LOCTITE CORPORATION (US) 2000-12-28 WO claimed
WO-2000056799-A1 REWORKABLE THERMOSETTING RESIN COMPOSITIONS LOCTITE CORPORATION (US) 2000-09-28 WO claimed