SCHEMBL83434

SCHEMBL83434

CCCCCCCCCCCc1nccn1CCC#N

nearest known ligand 0.62

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
TLR8 Q9NR97 2/20 0.43
ALDH1A1 P00352 1/20 0.41
POLB P06746 1/20 0.41
KMT2A Q03164 1/20 0.41
PDE4A P27815 1/20 0.38
PDE4B Q07343 1/20 0.38
PDE4C Q08493 1/20 0.38
PDE4D Q08499 1/20 0.38
KCNH2 Q12809 4/20 0.38
TLR7 Q9NYK1 2/20 0.36
AGTR1 P30556 1/20 0.36
AGTR2 P50052 1/20 0.36
CSNK2A1 P68400 1/20 0.33
TSHR P16473 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27857586 1.00 TLR8 (0.43) TLR8ALDH1A1POLBKMT2APDE4A
SCHEMBL9231229 1.00 TLR8 (0.43) TLR8ALDH1A1POLBKMT2APDE4A
SCHEMBL10824697 0.98 TLR8 (0.44) TLR8ALDH1A1POLBKMT2APDE4A
SCHEMBL11033149 0.88 PLA2G2A (0.41) ALDH1A1AGTR1AGTR2
SCHEMBL718394 0.88 KCNH2 (0.39) TLR8ALDH1A1POLBKMT2APDE4A
SCHEMBL27899839 0.85 TLR8 (0.41) TLR8ALDH1A1POLBKMT2APDE4A
SCHEMBL5283349 0.84 TLR8 (0.59) TLR8ALDH1A1POLBKMT2AKCNH2
SCHEMBL5303316 0.84 TLR8 (0.59) TLR8ALDH1A1POLBKMT2AKCNH2
SCHEMBL5282914 0.84 TLR8 (0.59) TLR8ALDH1A1POLBKMT2AKCNH2
SCHEMBL5286463 0.84 TLR8 (0.59) TLR8ALDH1A1POLBKMT2AKCNH2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 4068 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119193064-B Comb type poly (arylene ether nitrile) modified epoxy resin adhesive and preparation method thereof 黑龙江省科学院石油化学研究院 2026-05-12 CN claimed
EP-4321541-B1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL CO (JP) 2025-08-06 EP claimed
CN-120005486-A Low dielectric resin composition 南亚塑胶工业股份有限公司 2025-05-16 CN claimed
CN-119505830-A Insulating heat-conducting material, preparation method and application thereof, radiator and power assembly 深圳市汇川技术股份有限公司 2025-02-25 CN claimed
CN-119490771-A Thermosetting insulating adhesive, preparation method and application thereof 杭州福斯特应用材料股份有限公司 2025-02-21 CN claimed
US-12221523-B2 Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-02-11 US claimed
CN-117529509-B Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2025-01-10 CN claimed
CN-119193064-A Comb type poly (arylene ether nitrile) modified epoxy resin adhesive and preparation method thereof 黑龙江省科学院石油化学研究院 2024-12-27 CN claimed
CN-119194858-A Preparation of dipping liquid for fiber surface treatment and green two-bath dipping method 北京化工大学 2024-12-27 CN claimed
US-20240279432-A1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2024-08-22 US claimed
EP-0251760-B1 Rubber composition BRIDGESTONE CORP (JP) 1994-01-26 EP claimed
US-5140055-A Improved high speed grip performance BRIDGESTONE CORPORATION (JP) 1992-08-18 US claimed
US-4966928-A REACTION PRODUCT OF DICYCLOPENTADIENE AND MALEIC ANHYDRIDE, CURE ACCELERATOR, FILLER, IMPACT MODIFIER, SURFACE SMOOTHING AGENT SOMAR CORPORATION (JP) 1990-10-30 US claimed
US-4658009-A Novel 2-substituted-4,6-diamino-s-triazine/isocyanuric acid adduct, process for synthesis of said adduct and process for curing polyepoxy resin with said adduct SHIKOKU CHEMICALS CORPORATION (JP) 1987-04-14 US claimed
US-4575479-A HIGH SPEED; PHOTO-FIXING ABILITY RICOH COMPANY, LTD. (JP) 1986-03-11 US claimed
US-4370467-A CYANATE, PEROXIDE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1983-01-25 US claimed
US-4304818-A POLYISOCYANURATE-OXAZOLIDONES FROM POLYISOCYANATE AND POLYEPOXIDE HITACHI, LTD. (JP) 1981-12-08 US claimed
US-4110364-A AND BISMALEIIMIDES MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1978-08-29 US claimed
US-4026872-A PHENOLIC CURING AGENTS HITACHI, LTD. (JA) 1977-05-31 US claimed
US-3984376-A Thermosetting resin compositions prepared from isocyanates and epoxyphenols HITACHI, LTD. (JA) 1976-10-05 US claimed