Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.46 |
| ▸ | ALOX15 | P16050 | 2/20 | 0.46 |
| ▸ | CYP2C9 | P11712 | 2/20 | 0.46 |
| ▸ | NR1I2 | O75469 | 1/20 | 0.46 |
| ▸ | LMNA | P02545 | 1/20 | 0.46 |
| ▸ | MIF | P14174 | 1/20 | 0.46 |
| ▸ | TYR | P14679 | 1/20 | 0.46 |
| ▸ | HTT | P42858 | 1/20 | 0.46 |
| ▸ | NFE2L2 | Q16236 | 1/20 | 0.46 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.46 |
| ▸ | TSHR | P16473 | 2/20 | 0.44 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.44 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.39 |
| ▸ | MAPT | P10636 | 2/20 | 0.39 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.39 |
| ▸ | ATP2A2 | P16615 | 1/20 | 0.39 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.39 |
| ▸ | ATP2A3 | Q93084 | 1/20 | 0.39 |
| ▸ | NR1H4 | Q96RI1 | 1/20 | 0.39 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15968048 | 0.89 | CYP2C9 (0.43) | ALDH1A1ALOX15CYP2C9NR1I2LMNA | |
| SCHEMBL6888720 | 0.86 | ALOX15 (0.36) | ALDH1A1ALOX15CYP2C9NR1I2LMNA | |
| SCHEMBL6030787 | 0.83 | CYP2C9 (0.34) | ALDH1A1ALOX15CYP2C9NR1I2LMNA | |
| SCHEMBL1597262 | 0.81 | ALDH1A1 (0.53) | ALDH1A1ALOX15CYP2C9NR1I2LMNA | |
| SCHEMBL30343443 | 0.81 | ALDH1A1 (0.53) | ALDH1A1ALOX15CYP2C9NR1I2LMNA | |
| SCHEMBL1596042 | 0.81 | ALDH1A1 (0.53) | ALDH1A1ALOX15CYP2C9NR1I2LMNA | |
| SCHEMBL30343454 | 0.81 | ALDH1A1 (0.53) | ALDH1A1ALOX15CYP2C9NR1I2LMNA | |
| SCHEMBL31266974 | 0.81 | TSHR (0.52) | ALDH1A1ALOX15CYP2C9LMNATYR | |
| SCHEMBL135082 | 0.80 | ALDH1A1 (0.52) | ALDH1A1ALOX15CYP2C9NR1I2LMNA | |
| SCHEMBL29556942 | 0.80 | ALDH1A1 (0.52) | ALDH1A1ALOX15CYP2C9NR1I2LMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11767452-B2 | Curable composition, especially as crystallizing rubber to substrate bonding primer | HENKEL AG & CO. KGAA (DE) | 2023-09-26 | — | — | US | disclosed |
| EP-3135740-B1 | CURABLE COMPOSITION, ESPECIALLY FOR RUBBER TO SUBSTRATE BONDING | HENKEL AG & CO KGAA (DE) | 2018-10-10 | — | — | EP | disclosed |
| EP-3369770-A1 | CURABLE COMPOSITION, ESPECIALLY AS CRYSTALLIZING RUBBER TO SUBSTRATE BONDING PRIMER | Henkel AG & Co. KGaA (DE) | 2018-09-05 | — | — | EP | disclosed |
| US-20180163101-A1 | CURABLE COMPOSITION, ESPECIALLY FOR RUBBER TO SUBSTRATE BONDING | HENKEL AG & CO. KGAA (DE) | 2018-06-14 | — | — | US | disclosed |
| EP-3135740-A1 | CURABLE COMPOSITION, ESPECIALLY FOR RUBBER TO SUBSTRATE BONDING | Henkel AG & Co. KGaA (DE) | 2017-03-01 | — | — | EP | disclosed |
| US-8142605-B2 | Circuit-connecting material and circuit terminal connected structure and connecting method | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-03-27 | — | — | US | disclosed |
| US-7967943-B2 | Circuit-connecting material and circuit terminal connected structure and connecting method | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2011-06-28 | — | — | US | disclosed |
| US-20110114893-A1 | CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTURE AND CONNECTING METHOD | HITACHI CHEMICAL CO., LTD. (JP) | 2011-05-19 | — | — | US | disclosed |
| US-7879956-B2 | Circuit-connecting material and circuit terminal connected structure and connecting method | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2011-02-01 | — | — | US | disclosed |
| US-7629056-B2 | SUPERIOR LOW-TEMPERATURE RAPID CURABILITY AND ALSO HAVING A LONG POT LIFE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2009-12-08 | — | — | US | disclosed |
| US-7553890-B2 | interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components, a curing agent and a hydroxy resin with radical polymer | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2009-06-30 | — | — | US | disclosed |
| US-20080064233-A1 | CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTURE AND CONNECTING METHOD | HITACHI CHEMICAL CO., LTD. (JP) | 2008-03-13 | — | — | US | disclosed |
| US-20080057742-A1 | CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTURE AND CONNECTING METHOD | HITACHI CHEMICAL CO., LTD. (JP) | 2008-03-06 | — | — | US | disclosed |
| US-20080054225-A1 | interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components, a curing agent and a hydroxy resin with radical polymer | HITACHI CHEMICAL CO., LTD. (JP) | 2008-03-06 | — | — | US | disclosed |
| US-20070299172-A1 | interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components, a curing agent and a hydroxy resin with radical polymer | HITACHI CHEMICAL CO., LTD. (JP) | 2007-12-27 | — | — | US | disclosed |
| WO-2007021070-A1 | FILM FOR ANISOTROPIC CONDUCTIVITY AND ELECTRONIC CIRCUITS AND DEVICES USING THE FILM | CHEIL INDUSTRIES INC. (KR) | 2007-02-22 | — | — | WO | disclosed |
| US-20060060969-A1 | Electronic circuit including circuit-connecting material | HITACHI CHEMICAL CO., LTD. (JP) | 2006-03-23 | — | — | US | disclosed |
| US-20060063366-A1 | Circuit-connecting material and circuit terminal connected structure and connecting method | HITACHI CHEMICAL CO., LTD. (JP) | 2006-03-23 | — | — | US | disclosed |
| US-20060014860-A1 | interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components, a curing agent and a hydroxy resin with radical polymer | HITACHI CHEMICAL CO., LTD. (JP) | 2006-01-19 | — | — | US | disclosed |
| US-20040222408-A1 | SUPERIOR LOW-TEMPERATURE RAPID CURABILITY AND ALSO HAVING A LONG POT LIFE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2004-11-11 | — | — | US | disclosed |