SCHEMBL8375580

SCHEMBL8375580

CCCCCCCCCCCCCOP(OCCCC(CCCCCCCCC)C(C(C)C)C(CCCCCCCCC)CCCOP(OCCCCCCCCCCCCC)Oc1cc(C)ccc1C(C)(C)C)Oc1cc(C)ccc1C(C)(C)C

nearest known ligand 0.36

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
▸ L3MBTL1 Q9Y468 2/20 0.36
▸ HTT P42858 1/20 0.36
▸ KDM4E B2RXH2 2/20 0.31
▸ MRGPRX4 Q96LA9 1/20 0.31
▸ MAPK1 P28482 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL206723 0.89 L3MBTL1 (0.37) L3MBTL1HTTKDM4EMRGPRX4MAPK1
SCHEMBL30231813 0.87 L3MBTL1 (0.45) L3MBTL1HTTKDM4EMRGPRX4
SCHEMBL10975878 0.87 L3MBTL1 (0.45) L3MBTL1HTTKDM4EMRGPRX4
SCHEMBL2711006 0.87 L3MBTL1 (0.45) L3MBTL1HTTKDM4EMRGPRX4
SCHEMBL11216723 0.78 THRB (0.40) L3MBTL1HTT
SCHEMBL11261067 0.78 THRB (0.40) L3MBTL1HTT
SCHEMBL29115186 0.77 L3MBTL1 (0.41) L3MBTL1HTTKDM4EMRGPRX4MAPK1
SCHEMBL16005369 0.75 — —
SCHEMBL29115187 0.74 L3MBTL1 (0.42) L3MBTL1HTTKDM4EMRGPRX4MAPK1
SCHEMBL11266524 0.72 L3MBTL1 (0.36) L3MBTL1HTTKDM4EMAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2805996-B1 THERMOPLASTIC ELASTOMER COMPOSITION ARON KASEI KK (JP) 2017-11-22 — — EP disclosed
US-9175159-B2 Thermoplastic elastomer composition ARONKASEI CO., LTD. (JP) 2015-11-03 — — US disclosed
US-20140357775-A1 THERMOPLASTIC ELASTOMER COMPOSITION ARONKASEI CO., LTD. (JP) 2014-12-04 — — US disclosed
EP-2805996-A1 THERMOPLASTIC ELASTOMER COMPOSITION Aronkasei CO., LTD. (JP) 2014-11-26 — — EP disclosed
US-5998556-A USING N-CYCLOHEXYLMALEIMIDE NIPPON SHOKUBAI CO., LTD. (JP) 1999-12-07 — — US disclosed
EP-0794201-A1 RAW MATERIAL FOR THE PRODUCTION OF HEAT-RESISTANT RESIN, HEAT-RESISTANT RESIN AND PROCESS FOR THE PRODUCTION OF THE RESIN NIPPON SHOKUBAI CO., LTD. (JP) 1997-09-10 — — EP disclosed
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