SCHEMBL83914

SCHEMBL83914

COc1ccccc1-c1nc(-c2ccccc2)c(-c2ccccc2)[nH]1

nearest known ligand 0.66

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 2/20 0.65
KMT2A Q03164 2/20 0.65
NOX1 Q9Y5S8 2/20 0.64
SMPD3 Q9NY59 1/20 0.64
POLB P06746 2/20 0.64
MAPT P10636 7/20 0.62
TP53 P04637 6/20 0.62
MGAM O43451 1/20 0.61
THRB P10828 1/20 0.61
KDM4E B2RXH2 3/20 0.57
ALDH1A1 P00352 3/20 0.57
LMNA P02545 2/20 0.57
MAPK1 P28482 1/20 0.57
OPRK1 P41145 1/20 0.57
HTT P42858 1/20 0.57
MMP14 P50281 1/20 0.57
NPSR1 Q6W5P4 1/20 0.57
TDP1 Q9NUW8 1/20 0.57
GPR55 Q9Y2T6 1/20 0.57
L3MBTL1 Q9Y468 1/20 0.57

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29361514 1.00 MEN1 (0.65) MEN1KMT2ANOX1SMPD3POLB
SCHEMBL30641654 0.94 MEN1 (0.58) MEN1KMT2ANOX1SMPD3POLB
SCHEMBL6469003 0.93 MAPK14 (0.67) MEN1KMT2ANOX1SMPD3POLB
SCHEMBL12336439 0.88 NOX1 (0.68) MEN1KMT2ANOX1SMPD3POLB
SCHEMBL17133401 0.88 NOX1 (0.68) MEN1KMT2ANOX1SMPD3POLB
Quinoline SCHEMBL27776390 0.88 MEN1 (0.56) MEN1KMT2ANOX1SMPD3POLB
SCHEMBL14335897 0.88 PTPN1 (0.69) MEN1KMT2ANOX1SMPD3POLB
SCHEMBL31429542 0.88 SMPD3 (0.68) MEN1KMT2ANOX1SMPD3POLB
SCHEMBL14220591 0.85 NOX1 (0.61) MEN1KMT2ANOX1SMPD3POLB
SCHEMBL29363231 0.85 NOX1 (0.61) MEN1KMT2ANOX1SMPD3MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 866 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250237947-A1 Dry Film Resist, Photosensitive Dry Film, and Copper Clad Laminate HANGZHOU FIRST ELECTRONIC MATERIAL CO., LTD (CN) 2025-07-24 US claimed
CN-118206718-A Core-shell material and preparation method thereof 华为技术有限公司 2024-06-18 CN claimed
WO-2023185530-A1 DRY FILM RESIST, PHOTOSENSITIVE DRY FILM, AND COPPER CLAD LAMINATE 杭州福斯特电子材料有限公司 2023-10-05 WO claimed
CN-107203095-B White alkali-soluble photosensitive composition and preparation method and application thereof 江苏广信感光新材料股份有限公司 2020-08-18 CN claimed
CN-105566878-B High-fire resistance polymerized thylene carbonate hydrocarbon ester resin composition SK新技术株式会社 2019-07-19 CN claimed
CN-106249545-B It is a kind of can selfreparing photosensitive dry film solder mask 杭州福斯特应用材料股份有限公司 2019-06-25 CN claimed
US-9969878-B2 Polyalkylene carbonate resin composition having high thermal stability SK INNOVATION CO., LTD. (KR) 2018-05-15 US claimed
US-9777153-B2 Polyalkylene carbonate resin composition having an interpenetrating crosslinked structure SK INNOVATION CO., LTD. (KR) 2017-10-03 US claimed
CN-107219726-A A kind of resin combination and purposes 浙江福斯特新材料研究院有限公司 2017-09-29 CN claimed
EP-2845878-B1 POLYALKYLENE CARBONATE RESIN COMPOSITION HAVING AN INTERPENETRATING CROSSLINKED STRUCTURE SK INNOVATION CO LTD (KR) 2017-07-12 EP claimed
EP-1194953-A4 CONTROLLABLY DEGRADABLE COMPOSITION OF HETEROATOM CARBOCYCLIC OR EPOXY RESIN AND CURING AGENT LOCTITE CORP (US) 2002-09-04 EP claimed
US-20020058778-A1 Toughened thermosetting resin compositions useful as underfill sealants LOCTITE CORPORATION 2002-05-16 US claimed
US-20020058756-A1 Underfill sealants with improved adhesion, improved resistance to moisture absorption and improved resistance to stress cracking LOCTITE CORPORATION 2002-05-16 US claimed
WO-2002028849-A1 REWORKABLE EPOXIDIZED 1-(CYCLO)ALKENYL ETHER/POLYCARBOXYLIC ACID PRODUCT HENKEL LOCTITE CORPORATION (US) 2002-04-11 WO claimed
EP-1194953-A1 CONTROLLABLY DEGRADABLE COMPOSITION OF HETEROATOM CARBOCYCLIC OR EPOXY RESIN AND CURING AGENT LOCTITE CORPORATION (US) 2002-04-10 EP claimed
US-6342577-B1 Thermosetting resin compositions useful as underfill sealants LOCTITE CORPORATION 2002-01-29 US claimed
WO-2001074798-A1 REWORKABLE COMPOSITION OF OXIRANE(S) OR THIIRANE(S)-CONTAINING RESIN AND CURING AGENT LOCTITE CORPORATION (US) 2001-10-11 WO claimed
EP-1090057-A1 REWORKABLE THERMOSETTING RESIN COMPOSITIONS LOCTITE CORPORATION (US) 2001-04-11 EP claimed
WO-2000079582-A1 CONTROLLABLY DEGRADABLE COMPOSITION OF HETEROATOM CARBOCYCLIC OR EPOXY RESIN AND CURING AGENT LOCTITE CORPORATION (US) 2000-12-28 WO claimed
WO-2000056799-A1 REWORKABLE THERMOSETTING RESIN COMPOSITIONS LOCTITE CORPORATION (US) 2000-09-28 WO claimed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20250237947-A1 Dry Film Resist, Photosensitive Dry Film, and Copper Clad Laminate PADI2, PADI4, PADI1 MEN1 2809/4885KMT2A 352/4885NOX1 1660/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.