Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ACHE | P22303 | 3/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL13383681 | 0.67 | ACHE (0.33) | ACHE | |
| SCHEMBL5889616 | 0.63 | — | — | |
| SCHEMBL14590503 | 0.57 | ACHE (0.41) | ACHE | |
| SCHEMBL2952712 | 0.55 | ACHE (0.40) | ACHE | |
| SCHEMBL11308950 | 0.55 | ACHE (0.40) | ACHE | |
| SCHEMBL85826 | 0.53 | ACHE (0.38) | ACHE | |
| SCHEMBL16785663 | 0.53 | ACHE (0.38) | ACHE | |
| SCHEMBL14217694 | 0.53 | ACHE (0.38) | ACHE | |
| SCHEMBL8760045 | 0.53 | SMN1; SMN2 (0.32) | — | |
| SCHEMBL2798555 | 0.53 | TDP1 (0.39) | ACHE |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-5935452-A | DRYING COATED FILLING MATERIAL IN HOLLOW PORTIONS OF CIRCUIT SUBSTRATE; PILING COPPER FOIL HAVING LAYER OF DIELECTRIC ADHESIVE COMPRISING EPOXY RESIN ON SUBSTRATE SURFACE AND LAMINATING; ETCHING; CONNECTING COPPER FOIL WITH CIRCUITS | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1999-08-10 | — | — | US | disclosed |
| EP-0742265-B1 | Resin composition and its use in production of multilayer printed circuit board | HITACHI CHEMICAL CO LTD (JP) | 1999-06-16 | — | — | EP | disclosed |
| US-5874009-A | FORMING THROUGH HOLES BY ETCHING COPPER AND INSULATING ADHESIVE LAYERS | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1999-02-23 | — | — | US | disclosed |
| EP-0742265-A1 | Resin composition and its use in production of multilayer printed circuit board | Hitachi Chemical Co., Ltd. (JP) | 1996-11-13 | — | — | EP | disclosed |