Orthocresol

Orthocresol

SCHEMBL8399667

C=CC.C=CC.COC.Cc1ccccc1O

nearest known ligand 0.43

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Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TRPA1 O75762 3/20 0.43
ATM Q13315 1/20 0.43
CYP1A2 P05177 1/20 0.42
CYP2C19 P33261 1/20 0.42
TSHR P16473 3/20 0.41
CA2 P00918 3/20 0.41
TP53 P04637 3/20 0.41
CA1 P00915 2/20 0.41
ALDH1A1 P00352 6/20 0.38
LMNA P02545 4/20 0.38
KDM4E B2RXH2 4/20 0.38
MAPT P10636 4/20 0.38
ACHE P22303 3/20 0.38
HPGD P15428 3/20 0.38
HSD17B10 Q99714 3/20 0.38
POLB P06746 2/20 0.38
RECQL P46063 2/20 0.38
L3MBTL1 Q9Y468 2/20 0.38
CYP3A4 P08684 2/20 0.38
ALOX15 P16050 2/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Orthocresol SCHEMBL8359795 0.93 TRPA1 (0.48) TRPA1ATMCYP1A2CYP2C19TSHR
Orthocresol SCHEMBL668756 0.89 TRPA1 (0.52) TRPA1ATMCYP1A2CYP2C19TSHR
Orthocresol SCHEMBL605676 0.81 TRPA1 (0.50) TRPA1ATMCYP1A2CYP2C19TSHR
Orthocresol SCHEMBL6544575 0.81 TRPA1 (0.55) TRPA1ATMCYP1A2CYP2C19TSHR
Orthocresol SCHEMBL2814754 0.81 TRPA1 (0.55) TRPA1ATMCYP1A2CYP2C19TSHR
Orthocresol SCHEMBL8710164 0.81 TRPA1 (0.60) TRPA1ATMCYP1A2CYP2C19TSHR
Orthocresol SCHEMBL10419161 0.81 TRPA1 (0.60) TRPA1ATMCYP1A2CYP2C19TSHR
Orthocresol SCHEMBL29395276 0.81
Orthocresol SCHEMBL16002 0.81
Orthocresol SCHEMBL170162 0.81 TRPA1 (0.60) TRPA1ATMCYP1A2CYP2C19TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5935452-A DRYING COATED FILLING MATERIAL IN HOLLOW PORTIONS OF CIRCUIT SUBSTRATE; PILING COPPER FOIL HAVING LAYER OF DIELECTRIC ADHESIVE COMPRISING EPOXY RESIN ON SUBSTRATE SURFACE AND LAMINATING; ETCHING; CONNECTING COPPER FOIL WITH CIRCUITS HITACHI CHEMICAL COMPANY, LTD. (JP) 1999-08-10 US disclosed
EP-0742265-B1 Resin composition and its use in production of multilayer printed circuit board HITACHI CHEMICAL CO LTD (JP) 1999-06-16 EP disclosed
US-5874009-A FORMING THROUGH HOLES BY ETCHING COPPER AND INSULATING ADHESIVE LAYERS HITACHI CHEMICAL COMPANY, LTD. (JP) 1999-02-23 US disclosed
EP-0742265-A1 Resin composition and its use in production of multilayer printed circuit board Hitachi Chemical Co., Ltd. (JP) 1996-11-13 EP disclosed