SCHEMBL8399780

SCHEMBL8399780

CCCCCCCCC=CCCCCCCCC(=O)OCCN(CC)CC

nearest known ligand 0.60

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
DNM1 Q05193 1/20 0.60
DGKA P23743 2/20 0.57
MGLL Q99685 1/20 0.57
MAPT P10636 2/20 0.56
ALDH1A1 P00352 1/20 0.56
THRB P10828 1/20 0.56
CNR1 P21554 1/20 0.56
FAAH O00519 3/20 0.52
PRKCE Q02156 1/20 0.52
PRKCQ Q04759 1/20 0.52
PRKCD Q05655 1/20 0.52
PRKCA P17252 1/20 0.52
EPHX2 P34913 1/20 0.52
GMNN O75496 1/20 0.50
USP2 O75604 1/20 0.50
LMNA P02545 1/20 0.50
CYP1A2 P05177 1/20 0.50
POLB P06746 1/20 0.50
CYP2C9 P11712 1/20 0.50
ALOX15 P16050 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8399776 1.00 DNM1 (0.60) DNM1DGKAMGLLMAPTALDH1A1
SCHEMBL9189542 1.00 DNM1 (0.60) DNM1DGKAMGLLMAPTALDH1A1
SCHEMBL9717053 0.94 DNM1 (0.64) DNM1DGKAMGLLMAPTALDH1A1
SCHEMBL9717060 0.94 DNM1 (0.64) DNM1DGKAMGLLMAPTALDH1A1
SCHEMBL29029248 0.93 MGLL (0.56) DNM1DGKAMGLLMAPTALDH1A1
SCHEMBL17411411 0.93 DNM1 (0.62) DNM1DGKAMGLLMAPTALDH1A1
SCHEMBL17401269 0.93 DNM1 (0.62) DNM1DGKAMGLLMAPTALDH1A1
SCHEMBL432806 0.91 DNM1 (0.72) DNM1DGKAMAPTALDH1A1LMNA
SCHEMBL4245473 0.91 DNM1 (0.72) DNM1DGKAMAPTALDH1A1LMNA
SCHEMBL8398314 0.91 DNM1 (0.72) DNM1DGKAMAPTALDH1A1LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5858472-A Method of improving the electrical conductivity of a molding article of resin, method of coating a molding article of resin, and coating composition NIPPON PAINT CO., LTD. (JP) 1999-01-12 US disclosed
EP-0764663-A2 Method of improving the electrical conductivity of a molding artcile of resin, method of coating a molding article of resin, and coating composition NIPPON PAINT CO., LTD. (JP) 1997-03-26 EP disclosed