SCHEMBL8407916

SCHEMBL8407916

Nc1ccc(C=CCOCC=Cc2ccc(N)cc2)cc1

nearest known ligand 0.50

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
APP P05067 4/20 0.50
CYP19A1 P11511 13/20 0.48
MAOA P21397 1/20 0.48
MAOB P27338 1/20 0.48
IDO1 P14902 2/20 0.47
NQO2 P16083 2/20 0.42
MEN1 O00255 1/20 0.36
MAPT P10636 1/20 0.36
KMT2A Q03164 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21835121 0.83 CYP19A1 (0.48) APPCYP19A1MAOAMAOBIDO1
SCHEMBL21835122 0.83 CYP19A1 (0.48) APPCYP19A1MAOAMAOBIDO1
SCHEMBL3793251 0.79 APP (0.43) APPCYP19A1MAOAMAOBIDO1
SCHEMBL804594 0.78 APP (0.42) APPCYP19A1MAOAMAOBIDO1
SCHEMBL3793245 0.78 APP (0.42) APPCYP19A1MAOAMAOBIDO1
SCHEMBL7627267 0.77 IDO1 (0.42) MAOAMAOBIDO1MEN1MAPT
SCHEMBL11498981 0.77 RELA (0.48) IDO1MAPTKMT2A
SCHEMBL8935880 0.77 IDO1 (0.42) IDO1
Alcohol SCHEMBL21835120 0.77 CYP19A1 (0.43) APPCYP19A1MAOAMAOBIDO1
SCHEMBL8527959 0.76 APP (0.54) APPCYP19A1MAOAMAOBIDO1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9035292-B2 Organic thin-film transistor insulating layer material SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2015-05-19 US disclosed
US-20140070205-A1 ORGANIC THIN-FILM TRANSISTOR INSULATING LAYER MATERIAL SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2014-03-13 US disclosed
EP-0567993-B1 Thermosetting imide oligomer and manufacturing method of heat resistant laminated sheet using the same KANEGAFUCHI CHEMICAL IND (JP) 1999-07-14 EP disclosed
US-5397419-A Dissolving in solvent, coating or impregnation to form prepreg, heating, pressurization; heat resistant paints, electronics KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1995-03-14 US disclosed
EP-0567993-A1 Thermosetting imide oligomer and manufacturing method of heat resistant laminated sheet using the same KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1993-11-03 EP disclosed