SCHEMBL843972

SCHEMBL843972

O=C(COS)c1ccccc1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 3/20 0.56
MAPT P10636 3/20 0.56
MAPK1 P28482 2/20 0.56
HPGD P15428 2/20 0.56
KMT2A Q03164 2/20 0.56
SMN1; SMN2 Q16637 2/20 0.56
KDM4E B2RXH2 1/20 0.56
MEN1 O00255 1/20 0.56
CYP3A4 P08684 1/20 0.56
ALOX15 P16050 1/20 0.56
CES1 P23141 1/20 0.56
GSK3B P49841 2/20 0.52
ALDH1A1 P00352 2/20 0.52
PTPN1 P18031 2/20 0.52
TRPA1 O75762 1/20 0.52
HIF1A Q16665 1/20 0.52
NPC1 O15118 5/20 0.50
L3MBTL1 Q9Y468 4/20 0.50
RAB9A P51151 4/20 0.50
LMNA P02545 2/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28200543 0.84 MAPT (0.58) TDP1MAPTMAPK1HPGDKMT2A
SCHEMBL864716 0.81 MAPT (0.61) TDP1MAPTMAPK1HPGDKMT2A
SCHEMBL9305304 0.77 HPGD (0.62) TDP1MAPTMAPK1HPGDKMT2A
SCHEMBL291698 0.77 L3MBTL1 (0.59) TDP1MAPTMAPK1HPGDKMT2A
SCHEMBL291697 0.77 L3MBTL1 (0.59) TDP1MAPTMAPK1HPGDKMT2A
SCHEMBL28612997 0.77 MAPT (0.56) TDP1MAPTMAPK1HPGDKMT2A
SCHEMBL10809629 0.77 L3MBTL1 (0.59) TDP1MAPTMAPK1HPGDKMT2A
SCHEMBL2388014 0.77 TDP1 (0.56) TDP1MAPTMAPK1HPGDKMT2A
SCHEMBL5852707 0.77 MAPT (0.56) TDP1MAPTMAPK1HPGDKMT2A
SCHEMBL8158863 0.77 GSK3B (0.58) TDP1MAPTMAPK1HPGDKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 103 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250321486-A1 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2025-10-16 US disclosed
US-20250271765-A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2025-08-28 US disclosed
US-12386265-B2 Pattern forming method and method for manufacturing electronic device FUJIFILM CORPORATION (JP) 2025-08-12 US disclosed
US-12372873-B2 Treatment liquid for manufacturing semiconductor, pattern forming method using the same, and method of manufacturing electronic device using the same FUJIFILM CORPORATION (JP) 2025-07-29 US disclosed
US-12313976-B2 Storage container storing treatment liquid for manufacturing semiconductor FUJIFILM CORPORATION (JP) 2025-05-27 US disclosed
US-12306538-B2 Treatment liquid and pattern forming method FUJIFILM CORPORATION (JP) 2025-05-20 US disclosed
US-20240295822-A1 PATTERN FORMING METHOD AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2024-09-05 US disclosed
US-12013644-B2 Method for manufacturing electronic device FUJIFILM CORPORATION (JP) 2024-06-18 US disclosed
US-20240103374-A1 TREATMENT LIQUID FOR MANUFACTURING SEMICONDUCTOR, PATTERN FORMING METHOD USING THE SAME, AND METHOD OF MANUFACTURING ELECTRONIC DEVICE USING THE SAME FUJIFILM CORPORATION (JP) 2024-03-28 US disclosed
US-11892775-B2 Storage container storing treatment liquid for manufacturing semiconductor FUJIFILM CORPORATION (JP) 2024-02-06 US disclosed
US-6808862-B2 INCLUDING A COMPOUND (ESPECIALLY A SULFONIUM SALT) THAT GENERATES AN ALPHA-FLUOROALKANESULFONIC ACID UPON IRRADIATION; A (NON-FLUORO ALKANESULFONIC ACID ONIUM SALT; AND A MONOCYCLIC OR POLYCYCLIC ALICYCLIC HYDROCARBON RESIN FUJI PHOTO FILM CO., LTD. (JP) 2004-10-26 US disclosed
US-20040185373-A1 Photosensitive composition FUJI PHOTO FILM CO., LTD. 2004-09-23 US disclosed
EP-1260864-B1 Positive photosensitive composition FUJI PHOTO FILM CO LTD (JP) 2004-08-18 EP disclosed
US-20030224285-A1 Positive photosensitive composition FUJI PHOTO FILM CO., LTD. 2003-12-04 US disclosed
US-20030186161-A1 Positive photosensitive composition FUJI PHOTO FILM CO., LTD. 2003-10-02 US disclosed
US-20030077540-A1 Positive photosensitive composition FUJI PHOTO FILM CO., LTD. 2003-04-24 US disclosed
US-20030044717-A1 Positive photosensitive composition FUJI PHOTO FILM CO., LTD. 2003-03-06 US disclosed
US-20030010748-A1 Positive photosensitive compositions FUJI PHOTO FILM CO., LTD. 2003-01-16 US disclosed
EP-1273970-A2 Positive photosensitive composition FUJI PHOTO FILM CO., LTD. (JP) 2003-01-08 EP disclosed
EP-1260864-A1 Positive photosensitive composition FUJI PHOTO FILM CO., LTD. (JP) 2002-11-27 EP disclosed