SCHEMBL84664

SCHEMBL84664

CNc1nnn[nH]1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Bromide SCHEMBL2151490 0.97
Hydrochloric Acid SCHEMBL8188453 0.97
SCHEMBL16948574 0.79
SCHEMBL8471071 0.72
SCHEMBL1091034 0.72
SCHEMBL10380209 0.71 ALDH1A1 (0.36)
SCHEMBL4397449 0.70
SCHEMBL2294837 0.69
SCHEMBL15617040 0.67 MAPT (0.32)
SCHEMBL4899627 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 190 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3686207-B1 TETRAZOLE SILANE COMPOUND, METHOD FOR SYNTHESIZING SAID COMPOUND AND USE THEREOF SHIKOKU CHEM (JP) 2024-10-23 EP claimed
EP-1255797-B2 METHOD FOR ROUGHENING COPPER SURFACES FOR BONDING TO SUBSTRATES OMG ELECTRONIC CHEMICALS INC (US) 2016-10-12 EP claimed
EP-2016047-B1 BIPHENYL AMIDE LACTAM DERIVATIVES AS INHIBITORS OF 11- BETA-HYDROXYSTEROID DEHYDROGENASE 1 LILLY CO ELI (US) 2013-08-28 EP claimed
EP-1255797-B1 METHOD FOR ROUGHENING COPPER SURFACES FOR BONDING TO SUBSTRATES OMG ELECTRONIC CHEMICALS INC (US) 2012-06-13 EP claimed
JP-4754752-B2 2011-08-24 JP claimed
EP-1255797-A4 METHOD FOR ROUGHENING COPPER SURFACES FOR BONDING TO SUBSTRATES ELECTROCHEMICALS INC (US) 2009-01-14 EP claimed
US-7351353-B1 Method for roughening copper surfaces for bonding to substrates ELECTROCHEMICALS, INC. (US) 2008-04-01 US claimed
CN-100340632-C Method for roughening copper surfaces for bonding to substrates ELECTROCHEMICALS INC (US) 2007-10-03 CN claimed
US-20070102076-A1 Gas-producing mixtures DELPHI TECHNOLOGIES, INC. (US) 2007-05-10 US claimed
US-7153445-B2 Method for roughening copper surfaces for bonding to substrates ELECTROCHEMICALS INC. (US) 2006-12-26 US claimed
CN-1451031-A Method for roughening copper surfaces for bonding to substrates ELECTROCHEMICALS INC (US) 2003-10-22 CN claimed
JP-2003519286-A 2003-06-17 JP claimed
EP-1255797-A1 METHOD FOR ROUGHENING COPPER SURFACES FOR BONDING TO SUBSTRATES ELECTROCHEMICALS INC. (US) 2002-11-13 EP claimed
WO-2001049805-A1 METHOD FOR ROUGHENING COPPER SURFACES FOR BONDING TO SUBSTRATES ELECTROCHEMICALS INC. (US) 2001-07-12 WO claimed
CN-1183758-A Gas-generating mixture DYNAMIT NOBEL AG (DE) 1998-06-03 CN claimed
EP-4722199-A1 AZOLE COMPOUND, METHOD FOR SYNTHESIZING SAID AZOLE COMPOUND, AND USE THEREOF SHIKOKU CHEMICALS CORPORATION (JP) 2026-04-08 EP disclosed
WO-2024247919-A1 AZOLE COMPOUND, METHOD FOR SYNTHESIZING SAID AZOLE COMPOUND, AND USE THEREOF 四国化成工業株式会社 2024-12-05 WO disclosed
EP-0519485-A1 Propellant for gas generators Dynamit Nobel Aktiengesellschaft (DE) 1992-12-23 EP disclosed
US-4350804-A Curable compositions comprising an azole-functional resin and a metal-ligand complex PPG INDUSTRIES, INC. (US) 1982-09-21 US disclosed
US-4322459-A Epoxy derived resins containing amino or mercapto substituted azole functionality and compositions containing same PPG INDUSTRIES, INC. (US) 1982-03-30 US disclosed