SCHEMBL8466969

SCHEMBL8466969

CC(O)COC(=O)c1ccccc1C(=O)OCC(C)O

nearest known ligand 0.75

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
TSHR P16473 6/20 0.75
ALDH1A1 P00352 5/20 0.75
CYP3A4 P08684 3/20 0.54
CA2 P00918 1/20 0.54
ADRB2 P07550 6/20 0.53
ADRB1 P08588 6/20 0.53
ADRB3 P13945 6/20 0.53
TDP1 Q9NUW8 1/20 0.52
L3MBTL1 Q9Y468 1/20 0.52
PRSS1 P07477 1/20 0.51
PRSS2 P07478 1/20 0.51
PRSS3 P35030 1/20 0.51
TP53 P04637 1/20 0.50
MAPK1 P28482 1/20 0.50
LMNA P02545 1/20 0.49
NPC1 O15118 1/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31036163 0.93 TSHR (0.72) TSHRALDH1A1CYP3A4CA2ADRB2
SCHEMBL28228886 0.93 ALDH1A1 (0.66) TSHRALDH1A1CYP3A4CA2ADRB2
SCHEMBL9104304 0.93 TSHR (0.66) TSHRALDH1A1CYP3A4CA2ADRB2
SCHEMBL30306347 0.93 ALDH1A1 (0.66) TSHRALDH1A1CYP3A4CA2ADRB2
SCHEMBL18411635 0.93 TSHR (0.66) TSHRALDH1A1CYP3A4CA2ADRB2
SCHEMBL4597929 0.93 ALDH1A1 (0.66) TSHRALDH1A1CYP3A4CA2ADRB2
SCHEMBL10591909 0.93 TSHR (0.66) TSHRALDH1A1CYP3A4CA2ADRB2
SCHEMBL28757476 0.93 TSHR (0.72) TSHRALDH1A1CYP3A4CA2ADRB2
SCHEMBL29136233 0.91 TSHR (0.64) TSHRALDH1A1CYP3A4CA2ADRB2
SCHEMBL20432946 0.90 TSHR (0.62) TSHRALDH1A1CYP3A4CA2ADRB2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118871514-A Resin composition for surface-modified material 住友电木株式会社 2024-10-29 CN disclosed
CN-110850680-B Curable composition, display element, and method for forming cured film JSR株式会社 2024-10-25 CN disclosed
WO-2023249171-A1 PHOTOCURABLE COMPOSITION, COATING LAYER COMPRISING CURED PRODUCT THEREOF, AND PROCESS FILM 주식회사 엘지화학 2023-12-28 WO disclosed
CN-117148676-A Negative photoresist composition for organic insulating film of liquid crystal display element 烟台希尔德材料科技有限公司 2023-12-01 CN disclosed
WO-2023190309-A1 SURFACE-MODIFIER RESIN COMPOSITION 住友ベークライト株式会社 2023-10-05 WO disclosed
WO-2023153455-A1 FINGERPRINT RESISTANCE EVALUATION METHOD, LAMINATE, PRODUCTION METHOD THEREFOR, AND DISPLAY DEVICE 日本航空電子工業株式会社 2023-08-17 WO disclosed
WO-2023153456-A1 FINGERPRINT RESISTANCE EVALUATION METHOD, LAMINATE, PRODUCTION METHOD THEREFOR, AND DISPLAY DEVICE 日本航空電子工業株式会社 2023-08-17 WO disclosed
WO-2023153457-A1 FINGERPRINT RESISTANCE EVALUATION METHOD, LAMINATE, PRODUCTION METHOD THEREFOR, AND DISPLAY DEVICE 日本航空電子工業株式会社 2023-08-17 WO disclosed
WO-2023032388-A1 PHOTOCURABLE INK COMPOSITION FOR INKJET PRINTING サカタインクス株式会社 2023-03-09 WO disclosed
WO-2022230257-A1 ELECTRON BEAM-CURABLE PRINTING INK COMPOSITION, AND PRINTED MATTER OBTAINED BY PRINTING ELECTRON BEAM-CURABLE PRINTING INK COMPOSITION サカタインクス株式会社 2022-11-03 WO disclosed
CN-106462011-A Liquid crystal display element, liquid crystal alignment film, and liquid crystal alignment treatment agent 日产化学工业株式会社 2017-02-22 CN disclosed
CN-106462014-A Sealing agent for liquid crystal dropping process, vertical conduction material, and liquid crystal display element 积水化学工业株式会社 2017-02-22 CN disclosed
EP-2993519-A1 METHOD FOR MANUFACTURING BASE MATERIAL HAVING RECESSED PATTERN, COMPOSITION, METHOD FOR FORMING ELECTRICALLY CONDUCTIVE FILM, ELECTRONIC CIRCUIT AND ELECTRONIC DEVICE JSR Corporation (JP) 2016-03-09 EP disclosed
US-20160062242-A1 METHOD FOR MANUFACTURING SUBSTRATE HAVING CONCAVE PATTERN, COMPOSITION, METHOD FOR FORMING CONDUCTIVE FILM, ELECTRONIC CIRCUIT AND ELECTRONIC DEVICE JSR CORPORATION (JP) 2016-03-03 US disclosed
CN-101137730-B Electrically conductive ink, electrically conductive circuit, and noncontact-type medium TOYO INK MFG CO 2011-11-16 CN disclosed
CN-101137730-A Electrically conductive ink, electrically conductive circuit, and noncontact-type medium TOYO INK MFG CO (JP) 2008-03-05 CN disclosed
CN-100338139-C Heat-decaying material, transfer sheet using same, and method for forming pattern SEKISUI CHEMICAL CO LTD (JP) 2007-09-19 CN disclosed
CN-1708555-A Heat-decaying material, transfer sheet using same, and method for forming pattern SEKISUI CHEMICAL CO LTD (JP) 2005-12-14 CN disclosed
EP-0930327-A2 Aromatic polyol end-capped unsaturated polyetherester resins and resin compositions containing the same having improved chemical and/or water resistance Cook Composites and Polymers Company (US) 1999-07-21 EP disclosed
US-4158727-A POLYEPOXIDES, HIGH BONDING STRENGTH ADHESIVE OKURA KOGYO KABUSHIKI KAISHA (JP) 1979-06-19 US disclosed