SCHEMBL8467225

SCHEMBL8467225

c1ccc(Cc2ccc(OCC3CO3)cc2)cc1

nearest known ligand 0.73

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.73
MEN1 O00255 2/20 0.60
KMT2A Q03164 2/20 0.60
MGLL Q99685 2/20 0.57
ALDH1A1 P00352 4/20 0.56
TP53 P04637 3/20 0.56
TSHR P16473 3/20 0.56
HIF1A Q16665 2/20 0.56
CYP3A4 P08684 1/20 0.56
SMN1; SMN2 Q16637 1/20 0.56
MAPT P10636 2/20 0.54
HPGD P15428 2/20 0.54
PKM P14618 2/20 0.54
CYP1A2 P05177 1/20 0.54
PPARG P37231 1/20 0.54
LMNA P02545 1/20 0.54
GAA P10253 1/20 0.54
LTA4H P09960 6/20 0.54
GLA P06280 1/20 0.49

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17902752 0.93 TDP1 (0.66) TDP1MEN1KMT2AMGLLALDH1A1
SCHEMBL15246816 0.93 TDP1 (0.66) TDP1MEN1KMT2AMGLLALDH1A1
SCHEMBL194748 0.93 TDP1 (0.66) TDP1MEN1KMT2AMGLLALDH1A1
SCHEMBL16527790 0.93 TDP1 (0.66) TDP1MEN1KMT2AMGLLALDH1A1
SCHEMBL19828241 0.90 ALDH1A1 (0.62) TDP1MEN1KMT2AMGLLALDH1A1
SCHEMBL4431569 0.90 TDP1 (0.73) TDP1MEN1KMT2AMGLLALDH1A1
SCHEMBL9226245 0.88 TDP1 (0.59) TDP1MEN1KMT2AMGLLALDH1A1
SCHEMBL16527805 0.87 ALDH1A1 (0.68) TDP1MEN1KMT2AMGLLALDH1A1
SCHEMBL1228699 0.86 TDP1 (0.73) TDP1MEN1KMT2AALDH1A1TP53
SCHEMBL1351514 0.86 TDP1 (0.73) TDP1MEN1KMT2AALDH1A1TP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113122057-A Quantum dot ink and preparation method of quantum dot film TCL集团股份有限公司 2021-07-16 CN claimed
CN-110467795-B Low-viscosity liquid oxygen compatible epoxy resin system for wet-process fiber winding and preparation method thereof 大连理工大学 2021-02-23 CN claimed
CN-110467795-A A kind of low viscosity liquid oxygen compatible epoxy system and preparation method thereof for wet laid fiber winding UNIV DALIAN TECH 2019-11-19 CN claimed
EP-0605937-B1 Antistatic resin composition DAISO CO LTD (JP) 1997-06-11 EP claimed
EP-0605937-A1 Antistatic resin composition DAISO CO., LTD. (JP) 1994-07-13 EP claimed
CN-113122057-A Quantum dot ink and preparation method of quantum dot film TCL集团股份有限公司 2021-07-16 CN disclosed
CN-110467795-B Low-viscosity liquid oxygen compatible epoxy resin system for wet-process fiber winding and preparation method thereof 大连理工大学 2021-02-23 CN disclosed
US-10017604-B2 Modified phenolic resin, method for producing modified phenolic resin, modified epoxy resin, method for producing modified epoxy resin, curable resin composition, cured product of same, and printed wiring board DIC CORPORATION (JP) 2018-07-10 US disclosed
US-20160060384-A1 MODIFIED PHENOLIC RESIN, METHOD FOR PRODUCING MODIFIED PHENOLIC RESIN, MODIFIED EPOXY RESIN, METHOD FOR PRODUCING MODIFIED EPOXY RESIN, CURABLE RESIN COMPOSITION, CURED PRODUCT OF SAME, AND PRINTED WIRING BOARD DIC CORPORATION (JP) 2016-03-03 US disclosed
US-5936048-A Method for preparing modified resins and their applications MITSUI CHEMICALS, INC. (JP) 1999-08-10 US disclosed
EP-0698620-B1 Method for preparing modified resins and their applications MITSUI CHEMICALS INC (JP) 1998-12-09 EP disclosed
US-5792814-A REACTING A RESIN WITH A 5-((4,6-DIAMINO-S-TRIAZIN-2-YL)-NORBORN-2-ENE AND REACTING WITH AN EPOXIDE; FIREPROOFING; MOLDING MATERIALS MITSUI CHEMICALS, INC. (JP) 1998-08-11 US disclosed
US-5674947-A HEATING RESIN WITH FUNCTIONALIZED NORBORNENE COMPOUND IN ABSENCE OF REACTION CATALYST OR INITIATOR MITSUI TOATSU CHEMICALS, INC. (JP) 1997-10-07 US disclosed
EP-0605937-B1 Antistatic resin composition DAISO CO LTD (JP) 1997-06-11 EP disclosed
US-5556916-A ACRYLONITRILE-BUTADIENE-STYRENE TERPOLYMER WITH POLYOXYETHYLENE GLYCOL POLYMER OR COPOLYMER ON RUBBER SUBSTRATE DAISO CO. LTD. (JP) 1996-09-17 US disclosed
EP-0698620-A1 Method for preparing modified resins and their applications MITSUI TOATSU CHEMICALS, Inc. (JP) 1996-02-28 EP disclosed
EP-0605937-A1 Antistatic resin composition DAISO CO., LTD. (JP) 1994-07-13 EP disclosed