SCHEMBL8469260

SCHEMBL8469260

CCCCCCCCC1OC1CCCCCC1OC1C(=O)OC1CCCC1

nearest known ligand 0.50

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
NAAA Q02083 3/20 0.50
CTSK P43235 2/20 0.41
EPHX1 P07099 1/20 0.36
CTSL P07711 2/20 0.35
SPHK2 Q9NRA0 4/20 0.35
SPHK1 Q9NYA1 4/20 0.35
DNTT P04053 1/20 0.35
ALDH1A1 P00352 1/20 0.33
HTT P42858 1/20 0.33
PRKCA P17252 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27987015 0.82 NAAA (0.77) NAAAPRKCA
SCHEMBL14967428 0.79 EPHX1 (0.43) NAAAEPHX1ALDH1A1HTT
SCHEMBL14968182 0.77 EPHX1 (0.46) NAAAEPHX1ALDH1A1HTT
SCHEMBL28638945 0.76 DNTT (0.44) CTSKEPHX1SPHK2SPHK1DNTT
SCHEMBL9690196 0.76 DNTT (0.44) CTSKEPHX1SPHK2SPHK1DNTT
SCHEMBL1090911 0.76 DNTT (0.44) CTSKEPHX1SPHK2SPHK1DNTT
SCHEMBL14967381 0.76 EPHX1 (0.40) NAAAEPHX1HTT
SCHEMBL9133924 0.74 ALDH1A1 (0.43) SPHK2SPHK1ALDH1A1
SCHEMBL8823428 0.74 ALDH1A1 (0.43) SPHK2SPHK1ALDH1A1
SCHEMBL8823441 0.74 DNTT (0.42) CTSKEPHX1SPHK2SPHK1DNTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9834671-B2 Curable epoxy composition and a composite made therefrom DOW GLOBAL TECHNOLOGIES LLC (US) 2017-12-05 US disclosed
EP-2864418-B1 INSULATING COMPOSITES FOR POWER TRANSMISSION AND DISTRIBUTION DOW GLOBAL TECHNOLOGIES LLC (US) 2017-08-16 EP disclosed
EP-2797980-B1 FUNCTIONAL SILANE-COMPATIBILIZED EPOXY COMPOSITIONS FOR INSULATION APPLICATIONS DOW GLOBAL TECHNOLOGIES LLC (US) 2017-02-01 EP disclosed
EP-2841499-B1 CURABLE EPOXY RESIN COMPOSITIONS AND COMPOSITES MADE THEREFROM DOW GLOBAL TECHNOLOGIES LLC (US) 2016-11-30 EP disclosed
US-20150284562-A1 CURABLE EPOXY COMPOSITION AND A COMPOSITE MADE THEREFROM THE DOW CHEMICAL COMPANY (US) 2015-10-08 US disclosed
EP-2917278-A1 A CURABLE EPOXY COMPOSITION AND A COMPOSITE MADE THEREFROM Dow Global Technologies LLC (US) 2015-09-16 EP disclosed
US-9127116-B2 Functional silane-compatibilized epoxy compositions for insulation applications DOW GLOBAL TECHNOLOGIES LLC (US) 2015-09-08 US disclosed
US-20150210846-A1 CURABLE EPOXY RESIN COMPOSITIONS AND COMPOSITES MADE THEREFROM DOW GLOBAL TECHNOLOGIES LLC (US) 2015-07-30 US disclosed
US-20150162110-A1 INSULATING COMPOSITES FOR POWER TRANSMISSION AND DISTRIBUTION DOW GLOBAL TECHNOLOGIES LLC (US) 2015-06-11 US disclosed
CN-104583311-A Insulating composite for power transmission and distribution DOW GLOBAL TECHNOLOGIES INC 2015-04-29 CN disclosed
US-20140378625-A1 FUNCTIONAL SILANE-COMPATIBILIZED EPOXY COMPOSITIONS FOR INSULATION APPLICATIONS DOW GLOBAL TECHNOLOGIES LLC (US) 2014-12-25 US disclosed
EP-2797980-A1 FUNCTIONAL SILANE-COMPATIBILIZED EPOXY COMPOSITIONS FOR INSULATION APPLICATIONS Dow Global Technologies LLC (US) 2014-11-05 EP disclosed
WO-2014071576-A1 A CURABLE EPOXY COMPOSITION AND A COMPOSITE MADE THEREFROM DOW GLOBAL TECHNOLOGIES LLC (US) 2014-05-15 WO disclosed
WO-2014000158-A1 INSULATING COMPOSITES FOR POWER TRANSMISSION AND DISTRIBUTION DOW GLOBAL TECHNOLOGIES LLC (US) 2014-01-03 WO disclosed
WO-2013159339-A1 CURABLE EPOXY RESIN COMPOSITIONS AND COMPOSITES MADE THEREFROM DOW GLOBAL TECHNOLOGIES LLC (US) 2013-10-31 WO disclosed
WO-2013097197-A1 FUNCTIONAL SILANE-COMPATIBILIZED EPOXY COMPOSITIONS FOR INSULATION APPLICATIONS DOW GLOBAL TECHNOLOGIES LLC (US) 2013-07-04 WO disclosed
CN-1231539-C Low temperature bonding adhesive composition SUMITOMO BAKELITE CO (JP) 2005-12-14 CN disclosed
US-5935372-A A BLEND COMPRISING SOLVENT, A CURABLE IMIDIZED POLYIMIDESILOXANE COPOLYMER AND AN EPOXY RESIN CURING AGENT; STORAGE STABILITY, NO EXTRA HEATING STEP WHEN PACKAGE IS MOUNTED ON A CIRCUIT BOARD OCCIDENTAL CHEMICAL CORPORATION (US) 1999-08-10 US disclosed
US-4601944-A FOR HIGH SPEED INTEGRATED CIRCUITS WESTINGHOUSE ELECTRIC CORP. (US) 1986-07-22 US disclosed
US-4038338-A NEW POLYEPOXIDE-POLYSILOXANE COMPOUNDS CIBA-GEIGY CORPORATION (US) 1977-07-26 US disclosed