SCHEMBL8469558

SCHEMBL8469558

CCCCCCCCCCCCC(CCCCCCCCCCCC)(O[Ti](=O)O)C(CCCCCCCCCCCC)(CCCCCCCCCCCC)C(C)C

nearest known ligand 0.33

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
GGPS1 O95749 6/20 0.33
SMPD1 P17405 5/20 0.33
FDPS P14324 9/20 0.33
CES2 O00748 1/20 0.32
LPAR1 Q92633 1/20 0.32
LPAR3 Q9UBY5 1/20 0.32
LMNA P02545 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10794238 0.80 SMPD1 (0.41) GGPS1SMPD1FDPSCES2
SCHEMBL11213046 0.73 GGPS1 (0.41) GGPS1SMPD1FDPSCES2LPAR1
SCHEMBL21539 0.72 SMPD1 (0.31) GGPS1SMPD1FDPS
SCHEMBL918183 0.69 SMPD1 (0.41) GGPS1SMPD1FDPSCES2LPAR1
SCHEMBL5861642 0.68 LMNA (0.46) GGPS1SMPD1FDPSLMNA
SCHEMBL11503181 0.68 SMPD1 (0.34) SMPD1FDPS
SCHEMBL3685062 0.65 FDPS (0.31) FDPS
SCHEMBL10799271 0.65 LMNA (0.41) GGPS1SMPD1FDPSLMNA
SCHEMBL142411 0.64 FDPS (0.33) FDPS
SCHEMBL3691820 0.64 TSHR (0.35) GGPS1SMPD1FDPSCES2LPAR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0616013-B1 Thermoplastic resin composition MITSUBISHI CHEM CORP (JP) 1999-06-02 EP disclosed
US-5571866-A Thermoplastic resin composition MITSUBISHI CHEMICAL CORPORATION (JP) 1996-11-05 US disclosed
US-5449722-A Resin blends with crystal and noncrystal structures MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1995-09-12 US disclosed
EP-0357065-B1 Resin composition MITSUBISHI PETROCHEMICAL CO (JP) 1994-12-21 EP disclosed
EP-0616013-A2 Thermoplastic resin composition MITSUBISHI CHEMICAL CORPORATION (JP) 1994-09-21 EP disclosed
US-5159008-A High viscosity polyphenylene ether, low viscosity polyphenylen ether, polyamide unsaturated polar compound, and mineral filles and-or glass fibers MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1992-10-27 US disclosed
EP-0454156-A2 Thermoplastic resin composition MITSUBISHI CHEMICAL CORPORATION (JP) 1991-10-30 EP disclosed
US-5001181-A polyamide blends with dispersed particles of polyphenylene ether which contain dispersed filler particles; strength, flexibility, solvent resistance MITSUBISHI PETROCHEMICAL COMPANY, LTD. (JP) 1991-03-19 US disclosed
US-4699935-A Inorganic filler-containing polyolefin resin compositions MITSUBISHI PETROCHEMICAL COMPANY LIMITED (JP) 1987-10-13 US disclosed
EP-0202430-A1 Inorganic filler-containing polyolefin resin compositions MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1986-11-26 EP disclosed
US-4480057-A WITH CRYSTALLINE OLEFIN POLYMER, OR HYDROGENATED STYRENE-CONJUGATED DIENE MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1984-10-30 US disclosed
US-4433073-A OLEFINIC POLYMER MATRIX WITH DISPERSION OF IMPACT ABSORBING RUBBERY POLYMER MITSUBISHI PETROCHEMICAL COMPANY, LTD. (JP) 1984-02-21 US disclosed