SCHEMBL8543799

SCHEMBL8543799

Nc1cccc(Oc2ccc(C(=O)c3ccccc3)cc2)c1

nearest known ligand 0.68

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAOB P27338 1/20 0.68
PBRM1 Q86U86 1/20 0.64
SRD5A2 P31213 4/20 0.62
POLB P06746 1/20 0.60
AKR1C3 P42330 1/20 0.57
PARP10 Q53GL7 2/20 0.57
TNKS O95271 1/20 0.57
PARP15 Q460N3 1/20 0.57
PARP14 Q460N5 1/20 0.57
TNKS2 Q9H2K2 1/20 0.57
PARP2 Q9UGN5 1/20 0.57
ALDH1A1 P00352 2/20 0.53
HDAC8 Q9BY41 1/20 0.51
MEN1 O00255 1/20 0.50
MITF O75030 1/20 0.50
GAA P10253 1/20 0.50
MAPT P10636 1/20 0.50
GFER P55789 1/20 0.50
KMT2A Q03164 1/20 0.50
SMN1; SMN2 Q16637 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL204441 0.95 MAOB (0.63) MAOBPBRM1SRD5A2POLBAKR1C3
SCHEMBL29362975 0.95 MAOB (0.63) MAOBPBRM1SRD5A2POLBAKR1C3
SCHEMBL8962593 0.95 MAOB (0.63) MAOBPBRM1SRD5A2POLBAKR1C3
SCHEMBL204289 0.95 MAOB (0.63) MAOBPBRM1SRD5A2POLBAKR1C3
SCHEMBL29394233 0.95 MAOB (0.63) MAOBPBRM1SRD5A2POLBAKR1C3
SCHEMBL8375630 0.94 PBRM1 (0.64) MAOBPBRM1SRD5A2POLBAKR1C3
SCHEMBL29363911 0.94 PBRM1 (0.59) MAOBPBRM1SRD5A2POLBAKR1C3
SCHEMBL203908 0.94 PBRM1 (0.59) MAOBPBRM1SRD5A2POLBAKR1C3
SCHEMBL309443 0.94 TNKS (0.61) MAOBPBRM1SRD5A2POLBAKR1C3
SCHEMBL10067180 0.92 MAOB (0.62) MAOBPBRM1SRD5A2POLBAKR1C3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 75 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117048152-B Method for manufacturing metal-clad laminate NIPPON STEEL & SUMIKIN CHEMICAL CO.,LTD. (JP) 2026-05-26 CN disclosed
CN-113462300-B Resin film, metal-clad laminate, and circuit board 日铁化学材料株式会社 2025-03-04 CN disclosed
CN-114656874-B Polyimide composition, resin film, laminate, cover film, resin-coated copper foil, metal-coated laminate, and circuit board 日铁化学材料株式会社 2024-11-26 CN disclosed
CN-113043690-B Metal-clad laminate and circuit board 日铁化学材料株式会社 2024-11-26 CN disclosed
CN-113527882-B Polyimide film and copper-clad laminate 日铁化学材料株式会社 2024-10-18 CN disclosed
CN-114716707-B Polyimide film, copper-clad laminate, and circuit board 日铁化学材料株式会社 2024-10-11 CN disclosed
CN-118240361-A Resin composition 南亚塑胶工业股份有限公司 2024-06-25 CN disclosed
CN-118063769-A Polyimide resin 住友化学株式会社 2024-05-24 CN disclosed
CN-117986861-A Resin composition and electronic component 南亚塑胶工业股份有限公司 2024-05-07 CN disclosed
CN-117794048-A Metal-clad laminate, circuit board, electronic device, and electronic apparatus 日铁化学材料株式会社 2024-03-29 CN disclosed
CN-102741352-A Metal-resin composite MITSUI CHEMICALS INC 2012-10-17 CN disclosed
US-5821319-A COMPRISING STRUCTURAL UNITS DERIVED FROM PYROMELLITIC ANHYDRIDE, TEREPHTHALOYL CHLORIDE, 1,3-BIS/4-(4-AMINOPHENOXY)-ALPHA,ALPHA-DIMETHYLBENZYL/BENZENE MITSUI CHEMICALS, INC. (JP) 1998-10-13 US disclosed
US-5719256-A CONDENSING CARBOXYL GROUP CONTAINING COMPOUND AND ACTIVE HYDROGEN CONTAINING COMPOUND IN PRESENCE OF HALOIMINIUM SALT AS POLYMERIZATION CATALYST MITSU TOATSU CHEMICALS, INC. (JP) 1998-02-17 US disclosed
US-5710334-A PENDANT ETHER GROUPS, POLYIMIDES WITH IMPROVED SOLUBILITY, MELT FLOW STABILITY, PROCESSABILITY MITSUI TOATSU CHEMICALS, INC. (JP) 1998-01-20 US disclosed
US-5708128-A HEAT RESISTANCE MITSUI TOATSU CHEMICALS, INC. (JP) 1998-01-13 US disclosed
US-5514748-A POLYMER FOR SLIDING CONTAINING PHENOLIC RESINS AND LUBRICANTS WITH POLYIMIDES MITSUI TOATSU CHEMICALS, INC. (JP) 1996-05-07 US disclosed
EP-0368590-B1 Production process for polyimide fibers MITSUI TOATSU CHEMICALS (JP) 1995-01-25 EP disclosed
EP-0431789-B1 Preparation process of polyimide MITSUI TOATSU CHEMICALS (JP) 1995-01-25 EP disclosed
US-5210174-A Solution polymerization of diamine with tetracarboxylic acid MITSUI TOATSU CHEMICALS, INC. (JP) 1993-05-11 US disclosed
EP-0431789-A2 Preparation process of polyimide MITSUI TOATSU CHEMICALS, Inc. (JP) 1991-06-12 EP disclosed