SCHEMBL203908

SCHEMBL203908

Nc1cccc(Oc2ccc(C(=O)c3cccc(C(=O)c4ccc(Oc5cccc(N)c5)cc4)c3)cc2)c1

nearest known ligand 0.65

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PBRM1 Q86U86 1/20 0.59
MAOB P27338 1/20 0.58
TNKS O95271 1/20 0.57
PARP15 Q460N3 1/20 0.57
PARP14 Q460N5 1/20 0.57
PARP10 Q53GL7 1/20 0.57
TNKS2 Q9H2K2 1/20 0.57
PARP2 Q9UGN5 1/20 0.57
SRD5A2 P31213 2/20 0.53
POLB P06746 2/20 0.53
ALDH1A1 P00352 2/20 0.53
MITF O75030 2/20 0.51
NPC1 O15118 1/20 0.51
LMNA P02545 1/20 0.51
STS P08842 3/20 0.51
MEN1 O00255 1/20 0.50
GAA P10253 1/20 0.50
MAPT P10636 1/20 0.50
GFER P55789 1/20 0.50
KMT2A Q03164 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29363911 1.00 PBRM1 (0.59) PBRM1MAOBTNKSPARP15PARP14
SCHEMBL8375630 0.97 PBRM1 (0.64) PBRM1MAOBTNKSPARP15PARP14
SCHEMBL309443 0.97 TNKS (0.61) PBRM1MAOBTNKSPARP15PARP14
SCHEMBL204441 0.95 MAOB (0.63) PBRM1MAOBTNKSPARP15PARP14
SCHEMBL29394233 0.95 MAOB (0.63) PBRM1MAOBTNKSPARP15PARP14
SCHEMBL204289 0.95 MAOB (0.63) PBRM1MAOBTNKSPARP15PARP14
SCHEMBL8962593 0.95 MAOB (0.63) PBRM1MAOBTNKSPARP15PARP14
SCHEMBL29362975 0.95 MAOB (0.63) PBRM1MAOBTNKSPARP15PARP14
SCHEMBL8543799 0.94 MAOB (0.68) PBRM1MAOBTNKSPARP15PARP14
SCHEMBL7932816 0.92 CA1 (0.59) PBRM1MAOBTNKSPARP15PARP14

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 641 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115626989-B Photosensitive polyimide, photosensitive polyimide film, and preparation methods and applications thereof 嘉兴瑞华泰薄膜技术有限公司 2023-06-13 CN claimed
CN-115626989-A Photosensitive polyimide, photosensitive polyimide film, and preparation method and application thereof 嘉兴瑞华泰薄膜技术有限公司 2023-01-20 CN claimed
CN-110476123-B Photosensitive polyimide resin composition and polyimide film thereof 律胜科技股份有限公司 2022-02-08 CN claimed
CN-109400875-B Method for synthesizing polyamic acid resin by using 1, 3-bis [4- (3-aminophenoxy) benzoyl ] benzene 江苏亚宝绝缘材料股份有限公司 2021-12-07 CN claimed
CN-110431484-B Photosensitive polyimide resin composition and polyimide film thereof 律胜科技股份有限公司 2021-11-02 CN claimed
US-20210109443-A1 PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION AND POLYIMIDE FILM THEREOF MICROCOSM TECHNOLOGY CO., LTD. (TW) 2021-04-15 US claimed
US-20210088903-A1 PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION AND POLYIMIDE FILM THEREOF MICROCOSM TECHNOLOGY CO., LTD. (TW) 2021-03-25 US claimed
US-20180066110-A1 NOVEL POLYAMIDEIMIDE HAVING LOW THERMAL EXPANSION COEFFICIENT KOREA ADVANCED INST SCI & TECH (KR) 2018-03-08 US claimed
US-20160194449-A1 NOVEL POLYAMIDEIMIDE HAVING LOW THERMAL EXPANSION COEFFICIENT KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (KR) 2016-07-07 US claimed
EP-2940015-A1 NOVEL POLYAMIDEIMIDE HAVING LOW THERMAL EXPANSION COEFFICIENT Korea Advanced Institute of Science and Technology (KR) 2015-11-04 EP claimed
US-20150045481-A1 Asymmetric Diamine Compounds Containing Two Functional Groups and Polymers Therefrom KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY (KR) 2015-02-12 US claimed
US-6040418-A FLUORINATED POLYMIDES COMPRISING UNITS OF 2,2',5,5',6,6'-HEXAFLUOROBIPHENYL-3,3',4,4'-TETRACARBOXYLIC DIANHYDRIDE AND AROMATIC DIAMINE UBE INDUSTRIES, LTD. (JP) 2000-03-21 US claimed
US-5459233-A High temperature engineering aromatic polyimides MITSUI TOATSU CHEMICALS, INCORPORATED (JP) 1995-10-17 US claimed
US-5288843-A Polymerizing 4,4'-bis(3-aminophenoxy)biphenyl, pyromellitic dianhydride and a different aromaticdiamine; engineering plastics; molding mateials; aerospace; heat resistance; melt processibility MITSUI TOATSU CHEMICALS, INC. (JP) 1994-02-22 US claimed
US-4937316-A Process for preparing polyimides AMDAHL CORPORATION (US) 1990-06-26 US claimed
JP-62050372-A None JP disclosed
JP-5310921-A None JP disclosed
EP-0294195-A2 Polyimide resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1988-12-07 EP disclosed
EP-0294144-A1 Polyimide resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1988-12-07 EP disclosed
JP-S6250372-A HEAT-RESISTANT ADHESIVE MITSUI TOATSU CHEM INC 1987-03-05 JP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20150045481-A1 Asymmetric Diamine Compounds Containing Two Functional Groups and Polymers Therefrom AOC1, INMT, PRMT6 PBRM1 101/4885MAOB 565/4885TNKS 1946/4885
US-20180066110-A1 NOVEL POLYAMIDEIMIDE HAVING LOW THERMAL EXPANSION COEFFICIENT RICTOR, SGTA, SLC43A1 PBRM1 294/4885MAOB 4063/4885TNKS 972/4885
US-20160194449-A1 NOVEL POLYAMIDEIMIDE HAVING LOW THERMAL EXPANSION COEFFICIENT SGTA, RICTOR, SLC43A1 PBRM1 399/4885MAOB 4147/4885TNKS 1486/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.