SCHEMBL8544738

SCHEMBL8544738

CCC(=O)OCC(Cn1c(=O)n(CC2CO2)c(=O)n(CC2CO2)c1=O)OC(=O)CC

nearest known ligand 0.45

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
TP53 P04637 1/20 0.45
HBB P68871 1/20 0.45
SMN1; SMN2 Q16637 1/20 0.45
ALDH1A1 P00352 2/20 0.31
LMNA P02545 1/20 0.31
CYP1A2 P05177 1/20 0.31
HPGD P15428 1/20 0.31
CYP2C19 P33261 1/20 0.31
BLM P54132 1/20 0.31
WRN Q14191 1/20 0.31
HIF1A Q16665 1/20 0.31
GAA P10253 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8546480 1.00 TP53 (0.45) TP53HBBSMN1; SMN2ALDH1A1LMNA
SCHEMBL8592751 0.87 ALDH1A1 (0.39) SMN1; SMN2ALDH1A1LMNACYP1A2HPGD
SCHEMBL21944850 0.85 TP53 (0.47) TP53HBBSMN1; SMN2ALDH1A1CYP1A2
SCHEMBL21944919 0.78 ALDH1A1 (0.46) TP53HBBSMN1; SMN2ALDH1A1CYP2C19
SCHEMBL21944853 0.78 TP53 (0.45) TP53HBBSMN1; SMN2ALDH1A1HPGD
SCHEMBL10521424 0.77 TP53 (0.41) TP53HBBSMN1; SMN2ALDH1A1LMNA
SCHEMBL11138949 0.75 TP53 (0.45) TP53HBBSMN1; SMN2
SCHEMBL21945399 0.75 TP53 (0.45) TP53HBBSMN1; SMN2LMNABLM
SCHEMBL11138955 0.74 TP53 (0.47) TP53HBBSMN1; SMN2
SCHEMBL21944852 0.74 TP53 (0.50) TP53HBBSMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 62 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10920008-B2 Thermal-curable resin composition, and pre-preg, metal-clad laminate and printed circuit board manufactured using the same TAIWAN UNION TECHNOLOGY CORPORATION (TW) 2021-02-16 US claimed
US-20200123307-A1 THERMAL-CURABLE RESIN COMPOSITION, AND PRE-PREG, METAL-CLAD LAMINATE AND PRINTED CIRCUIT BOARD MANUFACTURED USING THE SAME TAIWAN UNION TECHNOLOGY CORPORATION (TW) 2020-04-23 US claimed
US-11643544-B2 Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same TAIWAN UNION TECHNOLOGY CORPORATION (TW) 2023-05-09 US disclosed
WO-2023074171-A1 RELEASE LAYER-FORMING COMPOSITION, LAMINATE, AND METHOD FOR MANUFACTURING LAMINATE 日産化学株式会社 2023-05-04 WO disclosed
WO-2023074169-A1 PRIMER LAYER-FORMING COMPOSITION, LAMINATE, AND METHOD FOR DECOMPOSING LAMINATE 日産化学株式会社 2023-05-04 WO disclosed
CN-111087809-B Thermosetting resin composition, prepreg, metal foil laminate and printed wiring board using the same 台燿科技股份有限公司 2022-09-13 CN disclosed
CN-110117404-B Resin composition, and prepreg, metal foil laminate and printed wiring board produced using the same 台燿科技股份有限公司 2021-12-07 CN disclosed
US-11137682-B2 Photosensitive resin composition and cured film prepared therefrom ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. 2021-10-05 US disclosed
US-10920008-B2 Thermal-curable resin composition, and pre-preg, metal-clad laminate and printed circuit board manufactured using the same TAIWAN UNION TECHNOLOGY CORPORATION (TW) 2021-02-16 US disclosed
EP-3375804-B1 LONG-CHAIN ALKYLENE GROUP-CONTAINING EPOXY RESIN COMPOSITION NISSAN CHEMICAL CORP (JP) 2020-10-14 EP disclosed
US-20200319549-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT HAVING CURED FILM, ORGANIC EL DISPLAY, AND METHOD FOR MANUFACTURING ORGANIC EL DISPLAY TORAY INDUSTRIES, INC. (JP) 2020-10-08 US disclosed
US-20110319589-A1 LONG CHAIN ALKYLENE GROUP-CONTAINING EPOXY COMPOUND NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2011-12-29 US disclosed
US-20110319589-A1 LONG CHAIN ALKYLENE GROUP-CONTAINING EPOXY COMPOUND NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2011-12-29 US disclosed
US-20100311871-A1 COLLOIDAL SILICA PARTICLES, PROCESS FOR PRODUCING THE SAME, AND ORGANIC SOLVENT-DISPERSED SILICA SOL, POLYMERIZABLE COMPOUND-DISPERSED SILICA SOL, AND DICARBOXYLIC ANHYDRIDE-DISPERSED SILICA SOL EACH OBTAINED FROM THE SAME NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2010-12-09 US disclosed
US-20100311871-A1 COLLOIDAL SILICA PARTICLES, PROCESS FOR PRODUCING THE SAME, AND ORGANIC SOLVENT-DISPERSED SILICA SOL, POLYMERIZABLE COMPOUND-DISPERSED SILICA SOL, AND DICARBOXYLIC ANHYDRIDE-DISPERSED SILICA SOL EACH OBTAINED FROM THE SAME NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2010-12-09 US disclosed
US-20100305237-A1 SILICA-CONTAINING EPOXY CURING AGENT AND CURED EPOXY RESIN PRODUCT NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2010-12-02 US disclosed
US-20100305237-A1 SILICA-CONTAINING EPOXY CURING AGENT AND CURED EPOXY RESIN PRODUCT NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2010-12-02 US disclosed
EP-2216355-A1 SILICA-CONTAINING EPOXY CURING AGENT AND EPOXY RESIN CURED BODY Nissan Chemical Industries, Ltd. (JP) 2010-08-11 EP disclosed
US-20100137475-A1 EPOXY RESIN-FORMING LIQUID PREPARATION CONTAINING INORGANIC PARTICLE NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2010-06-03 US disclosed
US-20100137475-A1 EPOXY RESIN-FORMING LIQUID PREPARATION CONTAINING INORGANIC PARTICLE NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2010-06-03 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20110319589-A1 LONG CHAIN ALKYLENE GROUP-CONTAINING EPOXY COMPOUND GPR17, ELOVL5, TAS2R16 TP53 4361/4885HBB 3488/4885SMN1; SMN2 3600/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.