⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL16471018 | 1.00 | — | — | |
| SCHEMBL13327528 | 0.83 | — | — | |
| SCHEMBL4811947 | 0.82 | — | — | |
| SCHEMBL13094607 | 0.81 | — | — | |
| SCHEMBL8944570 | 0.81 | — | — | |
| SCHEMBL5093293 | 0.80 | — | — | |
| SCHEMBL14365414 | 0.78 | CTSV (0.31) | — | |
| SCHEMBL332860 | 0.77 | — | — | |
| SCHEMBL13809878 | 0.77 | — | — | |
| SCHEMBL4809666 | 0.77 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2433972-B1 | Polymer compound, photoresist composition containing such polymer compound, and method for forming resist pattern | TOKYO OHKA KOGYO CO LTD (JP) | 2014-11-12 | — | — | EP | disclosed |
| EP-2433972-B1 | Polymer compound, photoresist composition containing such polymer compound, and method for forming resist pattern | TOKYO OHKA KOGYO CO LTD (JP) | 2014-11-12 | — | — | EP | disclosed |
| EP-1717261-B1 | POLYMER COMPOUND, PHOTORESIST COMPOSITION CONTAINING SUCH POLYMER COMPOUND, AND METHOD FOR FORMING RESIST PATTERN | TOKYO OHKA KOGYO CO LTD (JP) | 2014-01-01 | — | — | EP | disclosed |
| EP-2433972-A1 | Polymer compound, photoresist composition containing such polymer compound, and method for forming resist pattern | Tokyo Ohka Kogyo Co., Ltd. (JP) | 2012-03-28 | — | — | EP | disclosed |
| US-7723007-B2 | Polymer compound, photoresist composition including the polymer compound, and resist pattern formation method | TOKYO OHKA KOGYO CO., LTD. (JP) | 2010-05-25 | — | — | US | disclosed |
| US-7723007-B2 | Polymer compound, photoresist composition including the polymer compound, and resist pattern formation method | TOKYO OHKA KOGYO CO., LTD. (JP) | 2010-05-25 | — | — | US | disclosed |
| US-7723007-B2 | Polymer compound, photoresist composition including the polymer compound, and resist pattern formation method | TOKYO OHKA KOGYO CO., LTD. (JP) | 2010-05-25 | — | — | US | disclosed |
| CN-100572422-C | Macromolecular compound, the photo-corrosion-resisting agent composition that contains this macromolecular compound and corrosion-resisting pattern formation method | TOKYO OHKA KOGYO CO LTD (JP) | 2009-12-23 | — | — | CN | disclosed |
| US-7608381-B2 | copolymer of an acrylate monomer containing a 20 membered cyclic group, an acrylate monomer of alpha-alkyl acrylate estre having a lactone containing monocyclic or polycyclic group, a lower alkylate ester having an aliphatic cyclic group containing non acid dissociable dissociation inhibiting group | TOKYO OHKA KOGYO CO., LTD. (JP) | 2009-10-27 | — | — | US | disclosed |
| US-7470824-B2 | Adamantane derivative and process for producing the same | IDEMITSU KOSAN CO., LTD. (JP) | 2008-12-30 | — | — | US | disclosed |
| US-7470824-B2 | Adamantane derivative and process for producing the same | IDEMITSU KOSAN CO., LTD. (JP) | 2008-12-30 | — | — | US | disclosed |
| US-20080193871-A1 | Positive Resist Composition For Immersion Exposure and Method of Forming Resist Pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2008-08-14 | — | — | US | disclosed |
| US-20080193871-A1 | Positive Resist Composition For Immersion Exposure and Method of Forming Resist Pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2008-08-14 | — | — | US | disclosed |
| US-20080193871-A1 | Positive Resist Composition For Immersion Exposure and Method of Forming Resist Pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2008-08-14 | — | — | US | disclosed |
| US-20080166655-A1 | Polymer Compound, Photoresist Composition Including the Polymer Compound, and Resist Pattern Formation Method | OGATA TOSHIYUKI | 2008-07-10 | — | — | US | disclosed |
| US-20080166655-A1 | Polymer Compound, Photoresist Composition Including the Polymer Compound, and Resist Pattern Formation Method | OGATA TOSHIYUKI | 2008-07-10 | — | — | US | disclosed |
| US-20080166655-A1 | Polymer Compound, Photoresist Composition Including the Polymer Compound, and Resist Pattern Formation Method | OGATA TOSHIYUKI | 2008-07-10 | — | — | US | disclosed |
| US-20080096126-A1 | Polymer Compound, Positive Resist Composition and Process for Forming Resist Pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 2008-04-24 | — | — | US | disclosed |
| CN-1918217-A | Polymer compound, photoresist composition containing such polymer compound, and method for forming resist pattern | TOKYO OHKA KOGYO CO LTD (JP) | 2007-02-21 | — | — | CN | disclosed |
| EP-1717261-A1 | POLYMER COMPOUND, PHOTORESIST COMPOSITION CONTAINING SUCH POLYMER COMPOUND, AND METHOD FOR FORMING RESIST PATTERN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-11-02 | — | — | EP | disclosed |