Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAPT | P10636 | 6/20 | 0.44 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.44 |
| ▸ | NPSR1 | Q6W5P4 | 3/20 | 0.44 |
| ▸ | HPGD | P15428 | 3/20 | 0.44 |
| ▸ | GAA | P10253 | 2/20 | 0.44 |
| ▸ | CCR6 | P51684 | 2/20 | 0.44 |
| ▸ | ALOX12 | P18054 | 2/20 | 0.44 |
| ▸ | CACNA1B | Q00975 | 2/20 | 0.44 |
| ▸ | APBA1 | Q02410 | 2/20 | 0.44 |
| ▸ | LMNA | P02545 | 4/20 | 0.42 |
| ▸ | HTT | P42858 | 1/20 | 0.42 |
| ▸ | RGS4 | P49798 | 1/20 | 0.39 |
| ▸ | DRD2 | P14416 | 1/20 | 0.37 |
| ▸ | DRD3 | P35462 | 1/20 | 0.37 |
| ▸ | HCRTR1 | O43613 | 1/20 | 0.36 |
| ▸ | S1PR4 | O95977 | 1/20 | 0.36 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.36 |
| ▸ | S1PR1 | P21453 | 1/20 | 0.36 |
| ▸ | BACE1 | P56817 | 3/20 | 0.35 |
| ▸ | FOS | P01100 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL152124 | 0.80 | MAPT (0.49) | MAPTALDH1A1NPSR1HPGDGAA | |
| SCHEMBL63108 | 0.77 | MAPT (0.44) | MAPTALDH1A1NPSR1HPGDGAA | |
| SCHEMBL9435961 | 0.76 | ALDH1A1 (0.40) | MAPTALDH1A1NPSR1HPGDGAA | |
| SCHEMBL3691136 | 0.75 | MAPT (0.45) | MAPTALDH1A1NPSR1HPGDGAA | |
| SCHEMBL10834531 | 0.75 | MAPT (0.45) | MAPTALDH1A1NPSR1HPGDGAA | |
| SCHEMBL9418787 | 0.75 | MAPT (0.42) | MAPTALDH1A1NPSR1HPGDGAA | |
| SCHEMBL9240802 | 0.75 | MAPT (0.47) | MAPTALDH1A1NPSR1HPGDGAA | |
| SCHEMBL6740675 | 0.75 | MAPT (0.47) | MAPTALDH1A1NPSR1HPGDGAA | |
| SCHEMBL28770983 | 0.72 | MAPT (0.45) | MAPTALDH1A1NPSR1HPGDGAA | |
| SCHEMBL8568470 | 0.72 | MAPT (0.45) | MAPTALDH1A1NPSR1HPGDGAA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0202498-B1 | USE OF A THERMO-SETTING, POLYMERIZABLE COMPOSITION AND WIRING BOARD | HITACHI, LTD. (JP) | 1990-07-11 | — | — | EP | claimed |
| EP-0202498-A2 | Use of a thermo-setting, polymerizable composition and wiring board | HITACHI, LTD. (JP) | 1986-11-26 | — | — | EP | claimed |
| EP-0720060-B1 | Process for the development of irradiated radiation-sensitive recording materials | AGFA GEVAERT AG (DE) | 1998-03-25 | — | — | EP | disclosed |
| EP-0720060-A1 | Process for the development of irradiated radiation-sensitive recording materials | HOECHST AKTIENGESELLSCHAFT (DE) | 1996-07-03 | — | — | EP | disclosed |
| EP-0315211-B1 | Thermosetting resin composition, and prepreg and laminated sheet which use the same | HITACHI LTD (JP) | 1995-05-24 | — | — | EP | disclosed |
| US-5212244-A | Heat and fire resistance, dimensional stability, printed circuits | HITACHI, LTD. (JP) | 1993-05-18 | — | — | US | disclosed |
| US-5080965-A | PREPREG FROM POLY(P-HYDROXYSTYRENE), EPOXY-MODIFIED POLYBUTADIENE AND MALEIMIDE | HITACHI, LTD. (JP) | 1992-01-14 | — | — | US | disclosed |
| EP-0269021-B1 | RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND SUCH BOARD FORMED BY USE THEREOF | HITACHI, LTD. (JP) | 1991-10-23 | — | — | EP | disclosed |
| US-5041478-A | Maleimidized cyclic phosphonitrile with an aromatic amine and/or aromatic maleimide; heat resistant, moisture resistant | HITACHI, LTD. (JP) | 1991-08-20 | — | — | US | disclosed |
| US-4946734-A | MALEIMIDE SUBSTITUTED PHOSPHONITRILE | HITACHI, LTD. (JP) | 1990-08-07 | — | — | US | disclosed |
| EP-0202498-B1 | USE OF A THERMO-SETTING, POLYMERIZABLE COMPOSITION AND WIRING BOARD | HITACHI, LTD. (JP) | 1990-07-11 | — | — | EP | disclosed |
| EP-0315211-A1 | Thermosetting resin composition, and prepreg and laminated sheet which use the same | HITACHI, LTD. (JP) | 1989-05-10 | — | — | EP | disclosed |
| US-4738900-A | HEAT RESISTANT DIELECTRIC LAYER OF A POLYMER OF AN AROMATIC DIMALEIMIDE AND AN AROMATIC DICYANAMIDE | HITACHI, LTD. (JP) | 1988-04-19 | — | — | US | disclosed |
| EP-0202498-A2 | Use of a thermo-setting, polymerizable composition and wiring board | HITACHI, LTD. (JP) | 1986-11-26 | — | — | EP | disclosed |
| EP-0078039-B1 | THERMOSETTING RESIN COMPOSITION, PREPOLYMER THEREOF AND CURED ARTICLE THEREOF | Hitachi, Ltd. (JP) | 1986-01-22 | — | — | EP | disclosed |
| US-4546168-A | POLYMERIZABLE EPOXY COMPOUNDS, PHENOLIC COMPOUNDS, AND TRIALLYL ISOCYANURATE COMPOUNDS | HITACHI, LTD. (JP) | 1985-10-08 | — | — | US | disclosed |
| US-4482703-A | Thermosetting resin composition comprising dicyanamide and polyvalent imide | HITACHI, LTD. (JP) | 1984-11-13 | — | — | US | disclosed |
| EP-0123262-A2 | Resin encapsulated semiconductor device and process for producing the same | HITACHI, LTD. (JP) | 1984-10-31 | — | — | EP | disclosed |
| US-4400438-A | MALEIMIDE RESING AND HALOGENATED DIPHENYL ETHER | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1983-08-23 | — | — | US | disclosed |
| EP-0078039-A1 | Thermosetting resin composition, prepolymer thereof and cured article thereof | Hitachi, Ltd. (JP) | 1983-05-04 | — | — | EP | disclosed |