Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAPT | P10636 | 6/20 | 0.47 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.47 |
| ▸ | NPSR1 | Q6W5P4 | 3/20 | 0.47 |
| ▸ | GAA | P10253 | 3/20 | 0.47 |
| ▸ | CCR6 | P51684 | 2/20 | 0.47 |
| ▸ | HPGD | P15428 | 2/20 | 0.47 |
| ▸ | ALOX12 | P18054 | 2/20 | 0.47 |
| ▸ | CACNA1B | Q00975 | 2/20 | 0.47 |
| ▸ | APBA1 | Q02410 | 2/20 | 0.47 |
| ▸ | LMNA | P02545 | 2/20 | 0.45 |
| ▸ | HTT | P42858 | 1/20 | 0.45 |
| ▸ | CES1 | P23141 | 1/20 | 0.42 |
| ▸ | RGS4 | P49798 | 1/20 | 0.42 |
| ▸ | HCRTR1 | O43613 | 1/20 | 0.39 |
| ▸ | S1PR4 | O95977 | 1/20 | 0.39 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.39 |
| ▸ | S1PR1 | P21453 | 1/20 | 0.39 |
| ▸ | BACE1 | P56817 | 2/20 | 0.38 |
| ▸ | NOTUM | Q6P988 | 1/20 | 0.38 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL151352 | 0.85 | MAPT (0.50) | MAPTALDH1A1NPSR1GAACCR6 | |
| SCHEMBL787853 | 0.81 | MAPT (0.44) | MAPTALDH1A1NPSR1GAACCR6 | |
| SCHEMBL28665945 | 0.81 | MAPT (0.47) | MAPTALDH1A1NPSR1GAACCR6 | |
| SCHEMBL6741780 | 0.81 | HPGD (0.46) | MAPTALDH1A1NPSR1GAACCR6 | |
| SCHEMBL8607338 | 0.75 | MAPT (0.44) | MAPTALDH1A1NPSR1GAACCR6 | |
| SCHEMBL149927 | 0.73 | MAPT (0.53) | MAPTALDH1A1NPSR1GAACCR6 | |
| SCHEMBL152219 | 0.73 | MAPT (0.53) | MAPTALDH1A1NPSR1GAACCR6 | |
| SCHEMBL14433225 | 0.72 | MAPT (0.36) | MAPTALDH1A1NPSR1GAACCR6 | |
| Ethane SCHEMBL8564354 | 0.72 | MAPT (0.51) | MAPTALDH1A1NPSR1GAACCR6 | |
| SCHEMBL9323705 | 0.71 | ALDH1A1 (0.38) | MAPTALDH1A1NPSR1GAACCR6 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0202498-B1 | USE OF A THERMO-SETTING, POLYMERIZABLE COMPOSITION AND WIRING BOARD | HITACHI, LTD. (JP) | 1990-07-11 | — | — | EP | claimed |
| EP-0202498-A2 | Use of a thermo-setting, polymerizable composition and wiring board | HITACHI, LTD. (JP) | 1986-11-26 | — | — | EP | claimed |
| CN-115353477-B | Preparation method of diseleno maleimide compound | 温州医科大学 | 2023-10-20 | — | — | CN | disclosed |
| CN-115353477-A | Preparation method of bis-seleno-maleimide compound | 温州医科大学 | 2022-11-18 | — | — | CN | disclosed |
| EP-0315211-B1 | Thermosetting resin composition, and prepreg and laminated sheet which use the same | HITACHI LTD (JP) | 1995-05-24 | — | — | EP | disclosed |
| US-5212244-A | Heat and fire resistance, dimensional stability, printed circuits | HITACHI, LTD. (JP) | 1993-05-18 | — | — | US | disclosed |
| US-5080965-A | PREPREG FROM POLY(P-HYDROXYSTYRENE), EPOXY-MODIFIED POLYBUTADIENE AND MALEIMIDE | HITACHI, LTD. (JP) | 1992-01-14 | — | — | US | disclosed |
| EP-0269021-B1 | RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND SUCH BOARD FORMED BY USE THEREOF | HITACHI, LTD. (JP) | 1991-10-23 | — | — | EP | disclosed |
| US-5041478-A | Maleimidized cyclic phosphonitrile with an aromatic amine and/or aromatic maleimide; heat resistant, moisture resistant | HITACHI, LTD. (JP) | 1991-08-20 | — | — | US | disclosed |
| US-4946734-A | MALEIMIDE SUBSTITUTED PHOSPHONITRILE | HITACHI, LTD. (JP) | 1990-08-07 | — | — | US | disclosed |
| CN-1009006-B | Thermosetting resin composition, and prepreg and laminated sheet material produced from the same | HITACHI LTD (JP) | 1990-08-01 | — | — | CN | disclosed |
| EP-0269021-A1 | Resin composition for printed circuit board and such board formed by use thereof | HITACHI, LTD. (JP) | 1988-06-01 | — | — | EP | disclosed |
| US-4738900-A | HEAT RESISTANT DIELECTRIC LAYER OF A POLYMER OF AN AROMATIC DIMALEIMIDE AND AN AROMATIC DICYANAMIDE | HITACHI, LTD. (JP) | 1988-04-19 | — | — | US | disclosed |
| EP-0202498-A2 | Use of a thermo-setting, polymerizable composition and wiring board | HITACHI, LTD. (JP) | 1986-11-26 | — | — | EP | disclosed |
| EP-0078039-B1 | THERMOSETTING RESIN COMPOSITION, PREPOLYMER THEREOF AND CURED ARTICLE THEREOF | Hitachi, Ltd. (JP) | 1986-01-22 | — | — | EP | disclosed |
| US-4546168-A | POLYMERIZABLE EPOXY COMPOUNDS, PHENOLIC COMPOUNDS, AND TRIALLYL ISOCYANURATE COMPOUNDS | HITACHI, LTD. (JP) | 1985-10-08 | — | — | US | disclosed |
| US-4482703-A | Thermosetting resin composition comprising dicyanamide and polyvalent imide | HITACHI, LTD. (JP) | 1984-11-13 | — | — | US | disclosed |
| EP-0123262-A2 | Resin encapsulated semiconductor device and process for producing the same | HITACHI, LTD. (JP) | 1984-10-31 | — | — | EP | disclosed |
| US-4400438-A | MALEIMIDE RESING AND HALOGENATED DIPHENYL ETHER | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1983-08-23 | — | — | US | disclosed |
| EP-0078039-A1 | Thermosetting resin composition, prepolymer thereof and cured article thereof | Hitachi, Ltd. (JP) | 1983-05-04 | — | — | EP | disclosed |