SCHEMBL8621792

SCHEMBL8621792

CCCC(=O)NC(C)O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2186532 0.89 FAAH (0.43)
SCHEMBL8622266 0.88 FAAH (0.61)
SCHEMBL8621683 0.86 FAAH (0.70)
SCHEMBL8623658 0.84 FAAH (0.74)
SCHEMBL10600706 0.84 FAAH (0.74)
SCHEMBL16389868 0.84 FAAH (0.74)
SCHEMBL308684 0.84 FAAH (0.74)
SCHEMBL15281949 0.84 FAAH (0.74)
SCHEMBL8627798 0.84 FAAH (0.74)
SCHEMBL308262 0.84 FAAH (0.74)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025103000-A1 PREPARATION METHOD FOR N-ALKENYL AMIDE 中国石油化工股份有限公司 2025-05-22 WO claimed
CN-120020117-A Process for the preparation of N-vinylamides 中国石油化工股份有限公司 2025-05-20 CN claimed
CN-118335591-A Wafer regeneration method 北京超弦存储器研究院 2024-07-12 CN claimed
CN-113861848-B Regenerated wafer chemical mechanical polishing solution and preparation method thereof 万华化学集团电子材料有限公司 2022-07-12 CN claimed
CN-113861848-A Regenerated wafer chemical mechanical polishing solution and preparation method thereof 万华化学集团电子材料有限公司 2021-12-31 CN claimed
CN-102272093-A N-(1-hydroxyethyl)carboxamide compound and process for producing same 2011-12-07 CN claimed
WO-2025103000-A1 PREPARATION METHOD FOR N-ALKENYL AMIDE 中国石油化工股份有限公司 2025-05-22 WO disclosed
CN-120020117-A Process for the preparation of N-vinylamides 中国石油化工股份有限公司 2025-05-20 CN disclosed
CN-118335591-A Wafer regeneration method 北京超弦存储器研究院 2024-07-12 CN disclosed
CN-113861848-B Regenerated wafer chemical mechanical polishing solution and preparation method thereof 万华化学集团电子材料有限公司 2022-07-12 CN disclosed
CN-113861848-A Regenerated wafer chemical mechanical polishing solution and preparation method thereof 万华化学集团电子材料有限公司 2021-12-31 CN disclosed
WO-2021127586-A1 PROTEIN TYROSINE PHOSPHATASE DEGRADERS AND METHODS OF USE THEREOF CALICO LIFE SCIENCES LLC (US) 2021-06-24 WO disclosed
CN-102272093-A N-(1-hydroxyethyl)carboxamide compound and process for producing same 2011-12-07 CN disclosed
US-5827626-A FORMING A FILM OF COLORED IMAGE FORMING MATERIAL COMPRISING A COPOLYMER OF STYRENE OR DERIVATIVE AND MONO OR DIESTER OF MALEIC ACID, PIGMENTS, PHOTOPOLYMERIZABLE UNSATURATED MONOMER, PHOTOINITIATOR; PHOTOCURING AND DEVELOPING HITACHI CHEMICAL CO., LTD. (JP) 1998-10-27 US disclosed
US-4088500-A AMIDE-ENDCAPPED HYDROPHILIC ALKYLENE OXIDE PREPOLYMER, ACID ACTIVATED CROSSLINKING AGENT WATER, FILLER, CATALYST MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1978-05-09 US disclosed