⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1462053 | 0.74 | — | — | |
| SCHEMBL27486419 | 0.74 | — | — | |
| SCHEMBL28876137 | 0.74 | — | — | |
| SCHEMBL31671034 | 0.74 | — | — | |
| SCHEMBL31519524 | 0.72 | NNMT (0.42) | — | |
| Bromide SCHEMBL27792171 | 0.72 | NNMT (0.42) | — | |
| Hydrochloric Acid SCHEMBL27792154 | 0.72 | NNMT (0.42) | — | |
| Oxalic Acid SCHEMBL27792142 | 0.69 | NNMT (0.40) | — | |
| SCHEMBL1961153 | 0.69 | HCAR2 (0.33) | — | |
| SCHEMBL6491510 | 0.68 | P2RX7 (0.31) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-109575317-A | A kind of high intensity hydrogel and preparation method thereof with pH response | 天津大学 | 2019-04-05 | — | — | CN | disclosed |
| CN-102618213-B | Resin composition and semiconductor devices made by using the same | SUMITOMO BAKELITE CO | 2015-05-20 | — | — | CN | disclosed |
| CN-101724354-B | Resin composition and semiconductor devices made by using the same | SUMITOMO BAKELITE CO | 2014-07-09 | — | — | CN | disclosed |
| CN-101778919-B | Adhesive composition for semiconductor and semiconductor device manufactured using the same | SUMITOMO BAKELITE CO | 2012-09-05 | — | — | CN | disclosed |
| CN-102618213-A | Resin composition and semiconductor devices made by using the same | SUMITOMO BAKELITE CO | 2012-08-01 | — | — | CN | disclosed |
| CN-102604592-A | Resin composition and semiconductor devices made by using the same | SUMITOMO BAKELITE | 2012-07-25 | — | — | CN | disclosed |
| CN-102604591-A | Resin composition and semiconductor devices made by using the same | SUMITOMO BAKELITE | 2012-07-25 | — | — | CN | disclosed |
| CN-102585760-A | Resin composition and semiconductor devices made by using the same | SUMITOMO BAKELITE CO | 2012-07-18 | — | — | CN | disclosed |
| CN-101636463-B | Adhesive composition for semiconductor and semicondutor device produced using the adhesive composition | SUMITOMO BAKELITE CO | 2012-07-18 | — | — | CN | disclosed |
| CN-1930263-B | Resin composition and semiconductor device manufactured by using the same | SUMITOMO BAKELITE CO | 2012-02-29 | — | — | CN | disclosed |
| CN-101778919-A | Adhesive composition for semiconductor and semiconductor device manufactured using the same | SUMITOMO BAKELITE CO | 2010-07-14 | — | — | CN | disclosed |
| CN-101724354-A | Resin composition and semiconductor devices made by using the same | SUMITOMO BAKELITE CO | 2010-06-09 | — | — | CN | disclosed |
| CN-101636463-A | Adhesive composition for semiconductor and semicondutor device produced using the adhesive composition | SUMITOMO BAKELITE CO | 2010-01-27 | — | — | CN | disclosed |
| CN-1930263-A | Resin composition and semiconductor device manufactured by using the same | SUMITOMO BAKELITE CO (JP) | 2007-03-14 | — | — | CN | disclosed |
| EP-0705922-B1 | Production of colored silk filament | DAINICHISEIKA COLOR CHEM (JP) | 1998-06-03 | — | — | EP | disclosed |
| US-5538519-A | Production of colored silk filament | DAINICHISEIKA COLOR & CHEMICALS MFG. CO., LTD. (JP) | 1996-07-23 | — | — | US | disclosed |
| EP-0705922-A1 | Production of colored silk filament | DAINICHISEIKA COLOR & CHEMICALS MFG. CO. LTD. (JP) | 1996-04-10 | — | — | EP | disclosed |