SCHEMBL863211

SCHEMBL863211

CC1=CN(C)CCC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10211117 0.92
SCHEMBL12889636 0.69
SCHEMBL16692463 0.69 INMT (0.30)
SCHEMBL11122275 0.69
SCHEMBL17885816 0.69
SCHEMBL23109095 0.69
SCHEMBL1119921 0.69 INMT (0.30)
SCHEMBL12885831 0.66 TSHR (0.33)
SCHEMBL3838127 0.66 OAT (0.37)
SCHEMBL1118027 0.65

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117210145-A Antistatic surface protection film 浙江东柔新材料有限公司 2023-12-12 CN disclosed
US-11597817-B2 Thermoplastic resin composition, method of producing thermoplastic resin composition, molded article of cellulose-reinforced resin, and method of producing molded article of cellulose-reinforced resin FURUKAWA ELECTRIC CO., LTD (JP) 2023-03-07 US disclosed
EP-3438186-B1 THERMOPLASTIC RESIN COMPOSITION, THERMOPLASTIC RESIN COMPOSITION PRODUCTION METHOD, CELLULOSE-REINFORCED RESIN MOLDED PRODUCT, AND CELLULOSE-REINFORCED RESIN MOLDED PRODUCT MANUFACTURING METHOD FURUKAWA ELECTRIC CO LTD (JP) 2023-02-22 EP disclosed
EP-3438207-B1 THERMOPLASTIC RESIN COMPOSITION, THERMOPLASTIC RESIN COMPOSITION PRODUCTION METHOD, CELLULOSE-REINFORCED RESIN MOLDED PRODUCT, AND CELLULOSE-REINFORCED RESIN MOLDED PRODUCT MANUFACTURING METHOD FURUKAWA ELECTRIC CO LTD (JP) 2023-02-15 EP disclosed
US-11466140-B2 Thermoplastic resin composition, method of producing thermoplastic resin composition, molded article of cellulose-reinforced resin, and method of producing molded article of cellulose-reinforced resin FURUKAWA ELECTRIC CO., LTD. (JP) 2022-10-11 US disclosed
EP-3438186-A1 THERMOPLASTIC RESIN COMPOSITION, THERMOPLASTIC RESIN COMPOSITION PRODUCTION METHOD, CELLULOSE-REINFORCED RESIN MOLDED PRODUCT, AND CELLULOSE-REINFORCED RESIN MOLDED PRODUCT MANUFACTURING METHOD Furukawa Electric Co., Ltd. (JP) 2019-02-06 EP disclosed
EP-3438207-A1 THERMOPLASTIC RESIN COMPOSITION, THERMOPLASTIC RESIN COMPOSITION PRODUCTION METHOD, CELLULOSE-REINFORCED RESIN MOLDED PRODUCT, AND CELLULOSE-REINFORCED RESIN MOLDED PRODUCT MANUFACTURING METHOD Furukawa Electric Co., Ltd. (JP) 2019-02-06 EP disclosed
US-20190031858-A1 THERMOPLASTIC RESIN COMPOSITION, METHOD OF PRODUCING THERMOPLASTIC RESIN COMPOSITION, MOLDED ARTICLE OF CELLULOSE-REINFORCED RESIN, AND METHOD OF PRODUCING MOLDED ARTICLE OF CELLULOSE-REINFORCED RESIN FURUKAWA ELECTRIC CO., LTD. (JP) 2019-01-31 US disclosed
US-20190023877-A1 THERMOPLASTIC RESIN COMPOSITION, METHOD OF PRODUCING THERMOPLASTIC RESIN COMPOSITION, MOLDED ARTICLE OF CELLULOSE-REINFORCED RESIN, AND METHOD OF PRODUCING MOLDED ARTICLE OF CELLULOSE-REINFORCED RESIN FURUKAWA ELECTRIC CO., LTD. (JP) 2019-01-24 US disclosed
US-9725442-B2 Heterocyclic derivative having PGD2 receptor antagonist activity SHIONOGI & CO., LTD. (JP) 2017-08-08 US disclosed
EP-2698802-A1 Electrolytic capacitor comprising a separtor comprising a conductive polymer containing a p-dopant on its surface Panasonic Corporation (JP) 2014-02-19 EP disclosed
US-8153793-B2 Sulfonamide derivative having PGD2 receptor antagonistic activity SHIONOGI & CO., LTD. (JP) 2012-04-10 US disclosed
US-8143285-B2 Indolecarboxylic acid derivative having PGD2 receptor antagonistic activity SHIONOGI & CO., LTD. (JP) 2012-03-27 US disclosed
US-7956082-B2 Indole derivative having PGD2 receptor antagonist activity SHIONOGI & CO., LTD (JP) 2011-06-07 US disclosed
US-20090030014-A1 Indole Derivative Having Pgd2 Receptor Antagonist Activity SHIONOGI & CO., LTD. (JP) 2009-01-29 US disclosed