⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10713264 | 0.86 | — | — | |
| SCHEMBL8928195 | 0.84 | — | — | |
| SCHEMBL140952 | 0.79 | — | — | |
| SCHEMBL703870 | 0.77 | TYR (0.31) | — | |
| SCHEMBL29552434 | 0.76 | — | — | |
| SCHEMBL28087600 | 0.76 | — | — | |
| SCHEMBL17065918 | 0.76 | — | — | |
| SCHEMBL151729 | 0.76 | — | — | |
| Ethane SCHEMBL29193627 | 0.74 | SHBG (0.30) | — | |
| SCHEMBL11058141 | 0.74 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0812340-A1 | EPOXY RESIN(S) WITH CURING AGENT AND TOUGHENER | Hexcel Corporation (US) | 1997-12-17 | — | — | EP | claimed |
| WO-1997024398-A1 | EPOXY RESIN(S) WITH CURING AGENT AND TOUGHENER | HEXCEL CORPORATION (US) | 1997-07-10 | — | — | WO | claimed |
| JP-59210018-A | — | — | None | — | — | JP | disclosed |
| CN-112724596-B | Curable composition and cured product | 盛势达技研株式会社 | 2025-04-18 | — | — | CN | disclosed |
| US-20250109324-A1 | CURING AGENT FOR EPOXY RESIN, AND ADHESIVE | SUNSTAR ENGINEERING INC. (JP) | 2025-04-03 | — | — | US | disclosed |
| CN-118679204-A | Curing agent and adhesive for epoxy resin | 盛势达技研株式会社 | 2024-09-20 | — | — | CN | disclosed |
| WO-2023153196-A1 | CURING AGENT FOR EPOXY RESIN, AND ADHESIVE | サンスター技研株式会社 | 2023-08-17 | — | — | WO | disclosed |
| CN-112724596-A | Curable composition and cured product | 盛势达技研株式会社 | 2021-04-30 | — | — | CN | disclosed |
| US-5854313-A | Fine particles of high heat resistant polymer and epoxy esters | TAKEDA CHEMICAL INDUSTRIES, LTD. (JP) | 1998-12-29 | — | — | US | disclosed |
| EP-0812340-A1 | EPOXY RESIN(S) WITH CURING AGENT AND TOUGHENER | Hexcel Corporation (US) | 1997-12-17 | — | — | EP | disclosed |
| WO-1997024398-A1 | EPOXY RESIN(S) WITH CURING AGENT AND TOUGHENER | HEXCEL CORPORATION (US) | 1997-07-10 | — | — | WO | disclosed |
| US-5599612-A | Woven carbon fiber fabric | TORAY INDUSTRIES, INC. (JP) | 1997-02-04 | — | — | US | disclosed |
| EP-0704466-A2 | Fine particles of high-heat resistant polymer and epoxy esters | TAKEDA CHEMICAL INDUSTRIES, LTD. (JP) | 1996-04-03 | — | — | EP | disclosed |
| JP-S59210018-A | ANTIMALIGNANT TUMOR AGENT | NIPPON KASEI KK | 1984-11-28 | — | — | JP | disclosed |