SCHEMBL28087600

SCHEMBL28087600

Nc1c(CC2CO2)c(O)cc(CC2CO2)c1CC1CO1.Nc1c(CC2CO2)c(O)cc(CC2CO2)c1CC1CO1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29552434 1.00
SCHEMBL151729 1.00
SCHEMBL140952 0.86
SCHEMBL93389 0.86
SCHEMBL29413071 0.86
SCHEMBL31651031 0.85 ALDH1A1 (0.31)
SCHEMBL703870 0.84 TYR (0.31)
SCHEMBL5495550 0.83 OPRM1 (0.36)
SCHEMBL17065918 0.83
SCHEMBL4496349 0.82 OPRM1 (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-106170504-B Extended room temperature storage epoxy resins 赫克赛尔公司 2019-02-01 CN disclosed
CN-104704029-B Composite material with polyamide particles 赫克赛尔公司 2018-05-25 CN disclosed
CN-106170504-A Extended room temperature storage epoxy resins 赫克赛尔公司 2016-11-30 CN disclosed
CN-106062051-A Composite material with polyamide particle mixtures 赫克赛尔公司 2016-10-26 CN disclosed