SCHEMBL867033

SCHEMBL867033

CC1CC2OC2CC1OC(=O)CCCCC(=O)OC1CC2OC2CC1C

nearest known ligand 0.39

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
PRKCA P17252 6/20 0.39
NAAA Q02083 2/20 0.38
SMN1; SMN2 Q16637 1/20 0.37
BCHE P06276 1/20 0.34
PPP5C P53041 1/20 0.33
DGKA P23743 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27304727 0.94 TSHR (0.38) PRKCANAAASMN1; SMN2PPP5C
SCHEMBL11305517 0.94 TSHR (0.42) PRKCANAAA
SCHEMBL6474644 0.79 PPP5C (0.38) PPP5C
SCHEMBL2407704 0.77 TSHR (0.44) PPP5C
SCHEMBL9070275 0.77 PPP5C (0.41) PPP5C
SCHEMBL9853608 0.76 PPP5C (0.33) PPP5C
SCHEMBL76024 0.75 LPAR1 (0.37) DGKA
SCHEMBL1325625 0.73 LMNA (0.34) PRKCAPPP5C
SCHEMBL258828 0.73 DGKA (0.40) DGKA
Adipic Acid SCHEMBL28589647 0.73 LMNA (0.46) PPP5C

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 235 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-120041182-A Particle size-controllable epoxy resin fracturing propping agent and preparation method thereof 江苏扬农化工集团有限公司 2025-05-27 CN claimed
CN-119752183-A Preparation method of epoxy resin fracturing propping agent with high heat resistance and low breakage rate 江苏扬农化工集团有限公司 2025-04-04 CN claimed
CN-110669182-A Polymer-based dielectric material and preparation method thereof 深圳市峰泳科技有限公司 2020-01-10 CN claimed
EP-2352781-B1 BIODEGRADABLE POLYMER COMPOSITION TRISTANO PTY LTD (AU) 2016-01-06 EP claimed
EP-2473542-B1 POLYMER/THERMOPLASTIC STARCH COMPOSITIONS CO2STARCH PTY LTD (AU) 2015-07-29 EP claimed
US-20120208928-A1 POLYMER/THERMOPLASTIC STARCH COMPOSITIONS CO2Starch Pty Ltd. (AU) 2012-08-16 US claimed
EP-2473542-A1 POLYMER/THERMOPLASTIC STARCH COMPOSITIONS Co2starch Pty Ltd (AU) 2012-07-11 EP claimed
US-20120077905-A1 Biodegradable Polymer Composition CHEN CHANGPING (CN) 2012-03-29 US claimed
EP-2352781-A1 BIODEGRADABLE POLYMER COMPOSITION Tristano Pty Ltd (AU) 2011-08-10 EP claimed
WO-2011026171-A1 POLYMER/THERMOPLASTIC STARCH COMPOSITIONS TRISTANO PTY LTD (AU) 2011-03-10 WO claimed
WO-2010051589-A1 BIODEGRADABLE POLYMER COMPOSITION TRISTANO PTY LTD (AU) 2010-05-14 WO claimed
US-20040082720-A1 Adducts of amine-terminated polyolefins and epoxides FMC CORPORATION 2004-04-29 US claimed
US-20040030048-A1 Heterotelechelic polyolefin polymer adducts with epoxides FMC CORPORATION 2004-02-12 US claimed
US-4448940-A POLYOXAZOLINES BASED ON DINITRILES AND DIEPOXY COMPOUNDS; POLYISOCYANURATE; FLEXIBILITY; PRINTED CIRCUITS HITACHI, LTD. (JP) 1984-05-15 US claimed
US-4384101-A EPOXIDE, ISOCYANATE, TRIALLYL CYANURATE AS CROSSLINKER FOR THERMOSETTING ELECTRICAL INSULATION BBC BROWN, BOVERI & COMPANY, LIMITED (CH) 1983-05-17 US claimed
US-4086293-A CARBOXY MODIFIED POLYCAPROLACTONE, POLYEPOXIDE CROSSLINKING AGENT, CATALYST; INKS UNION CARBIDE CORPORATION (US) 1978-04-25 US claimed
CN-114058044-B Polyimide base film and flexible display panel comprising same SK新技术株式会社 2025-06-24 CN disclosed
CN-120041182-A Particle size-controllable epoxy resin fracturing propping agent and preparation method thereof 江苏扬农化工集团有限公司 2025-05-27 CN disclosed
US-4056579-A Novel thermosetting resin composition and cured product therefrom HITACHI, LTD. (JA) 1977-11-01 US disclosed
US-3984376-A Thermosetting resin compositions prepared from isocyanates and epoxyphenols HITACHI, LTD. (JA) 1976-10-05 US disclosed