⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5471589 | 0.67 | — | — | |
| SCHEMBL3314643 | 0.64 | — | — | |
| SCHEMBL28484724 | 0.63 | TSHR (0.30) | — | |
| SCHEMBL15136162 | 0.62 | — | — | |
| Benzene SCHEMBL29078675 | 0.62 | LMNA (0.43) | — | |
| SCHEMBL28857240 | 0.61 | TSHR (0.33) | — | |
| SCHEMBL29161895 | 0.61 | — | — | |
| SCHEMBL15870353 | 0.61 | APLNR (0.33) | — | |
| SCHEMBL13208981 | 0.61 | APLNR (0.33) | — | |
| SCHEMBL14446952 | 0.61 | APLNR (0.33) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-112795169-B | Resin composition, resin film containing resin composition, prepreg, laminated board, copper-clad plate and printed circuit board | 广东生益科技股份有限公司 | 2022-07-19 | — | — | CN | claimed |
| CN-110218436-B | Low dielectric resin composition and preparation method thereof | 南亚新材料科技股份有限公司 | 2022-04-19 | — | — | CN | claimed |
| CN-113121999-A | Resin composition, and prepreg, laminated board and printed circuit board using same | 广东生益科技股份有限公司 | 2021-07-16 | — | — | CN | claimed |
| CN-112795169-A | Resin composition, resin film containing resin composition, prepreg, laminated board, copper-clad plate and printed circuit board | 广东生益科技股份有限公司 | 2021-05-14 | — | — | CN | claimed |
| CN-111363339-A | Phosphorus-silicon-containing flame retardant, preparation method thereof, flame-retardant resin composition, prepreg and metal-foil-clad laminate | 广东生益科技股份有限公司 | 2020-07-03 | — | — | CN | claimed |
| CN-111117154-A | Flame-retardant thermosetting resin composition, and prepreg, laminated board and printed circuit board manufactured from same | 广东生益科技股份有限公司 | 2020-05-08 | — | — | CN | claimed |
| CN-108148196-B | Styryl siloxy polyphenylene oxide resin and preparation method and application thereof | 广东生益科技股份有限公司 | 2020-01-24 | — | — | CN | claimed |
| US-20230265311-A1 | Cure-on-Demand Coatings | BOARD OF SUPERVISORS OF LOUISIANA STATE UNIVERSITY AND AGRICULTURAL AND MECHANICAL COLLEGE (US) | 2023-08-24 | — | — | US | disclosed |
| CN-112341787-B | Bio-based resin composition, metal foil-clad laminate, and printed wiring board | 南亚新材料科技股份有限公司 | 2022-09-20 | — | — | CN | disclosed |
| CN-112457651-B | Bio-based resin composition, adhesive sheet, metal-clad laminate, and printed wiring board | 南亚新材料科技股份有限公司 | 2022-09-20 | — | — | CN | disclosed |
| CN-112795169-B | Resin composition, resin film containing resin composition, prepreg, laminated board, copper-clad plate and printed circuit board | 广东生益科技股份有限公司 | 2022-07-19 | — | — | CN | disclosed |
| CN-114555660-A | Nitrile group-containing copolymer rubber | 日本瑞翁株式会社 | 2022-05-27 | — | — | CN | disclosed |
| CN-110218436-B | Low dielectric resin composition and preparation method thereof | 南亚新材料科技股份有限公司 | 2022-04-19 | — | — | CN | disclosed |
| CN-111363339-A | Phosphorus-silicon-containing flame retardant, preparation method thereof, flame-retardant resin composition, prepreg and metal-foil-clad laminate | 广东生益科技股份有限公司 | 2020-07-03 | — | — | CN | disclosed |
| CN-111117154-A | Flame-retardant thermosetting resin composition, and prepreg, laminated board and printed circuit board manufactured from same | 广东生益科技股份有限公司 | 2020-05-08 | — | — | CN | disclosed |
| CN-111094371-A | Method for producing nitrile group-containing copolymer rubber | 日本瑞翁株式会社 | 2020-05-01 | — | — | CN | disclosed |
| CN-108148196-B | Styryl siloxy polyphenylene oxide resin and preparation method and application thereof | 广东生益科技股份有限公司 | 2020-01-24 | — | — | CN | disclosed |
| US-5721294-A | BLEND OF CORE, SHELL POLYMER AND ANOTHER POLYMER | AKZO NOBEL NV (NL) | 1998-02-24 | — | — | US | disclosed |
| US-5494980-A | AN ETHYLENICALLY UNSATURATED POLYURETHANE CORE ONTO WHICH AN ADDITION POLYMER SHELL HAS BEEN COVALENTLY BONDED BY THE INCORPORATION OF DIMETHYL-M-ISOPROPENYLBENZYLISOCYANATE INTO THE POLYURETHANE | AKZO NOBEL NV (NL) | 1996-02-27 | — | — | US | disclosed |
| US-5190994-A | Polymers/Shell-Core/ | AKZO N.V. (NL) | 1993-03-02 | — | — | US | disclosed |