SCHEMBL869290

SCHEMBL869290

CCC(CO)(CO)CO.CCC(S)CC(=O)O.CCC(S)CC(=O)O

nearest known ligand 0.38

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
GPR84 Q9NQS5 4/20 0.32
SLC22A6 Q4U2R8 1/20 0.30
MME P08473 1/20 0.30
ACE P12821 1/20 0.30
CPA1 P15085 1/20 0.30
ACE2 Q9BYF1 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL869805 1.00 GPR84 (0.32) GPR84SLC22A6MMEACECPA1
SCHEMBL869462 0.92 GPR84 (0.34) GPR84SLC22A6MMEACECPA1
SCHEMBL867994 0.92 GPR84 (0.34) GPR84SLC22A6MMEACECPA1
SCHEMBL868663 0.92 GPR84 (0.34) GPR84SLC22A6MMEACECPA1
SCHEMBL1171039 0.92 GPR84 (0.34) GPR84SLC22A6MMEACECPA1
SCHEMBL3101130 0.84 SLC22A6 (0.32) GPR84SLC22A6MMEACECPA1
SCHEMBL1171042 0.84 GPR84 (0.30) GPR84
SCHEMBL869031 0.83
SCHEMBL394575 0.82 GPR84 (0.33) GPR84SLC22A6MMEACECPA1
SCHEMBL98138 0.82 GPR84 (0.33) GPR84SLC22A6MMEACECPA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2436715-B1 EPOXY RESIN-BASED COATING COMPOSITION SHOWA DENKO KK (JP) 2016-08-24 EP claimed
US-8865801-B2 Epoxy resin-based coating composition SHOWA DENKO K.K. (JP) 2014-10-21 US claimed
US-8242217-B2 Epoxy resin curing agent, process for preparing the same, and epoxy resin composition SHOWA DENKO K.K. (JP) 2012-08-14 US claimed
EP-2226347-B1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO KK (JP) 2012-06-27 EP claimed
US-20120077903-A1 EPOXY RESIN-BASED COATING COMPOSITION SHOWA DENKO K.K. (JP) 2012-03-29 US claimed
US-20100273940-A1 EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO K.K. (JP) 2010-10-28 US claimed
EP-2226347-A1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION Showa Denko K.K. (JP) 2010-09-08 EP claimed
EP-2436715-B1 EPOXY RESIN-BASED COATING COMPOSITION SHOWA DENKO KK (JP) 2016-08-24 EP disclosed
US-8865801-B2 Epoxy resin-based coating composition SHOWA DENKO K.K. (JP) 2014-10-21 US disclosed
US-8242217-B2 Epoxy resin curing agent, process for preparing the same, and epoxy resin composition SHOWA DENKO K.K. (JP) 2012-08-14 US disclosed
EP-2226347-B1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO KK (JP) 2012-06-27 EP disclosed
US-20120077903-A1 EPOXY RESIN-BASED COATING COMPOSITION SHOWA DENKO K.K. (JP) 2012-03-29 US disclosed
US-20100273940-A1 EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO K.K. (JP) 2010-10-28 US disclosed
EP-2226347-A1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION Showa Denko K.K. (JP) 2010-09-08 EP disclosed