SCHEMBL869805

SCHEMBL869805

CCC(CO)(CO)CO.CCC(S)CC(=O)O.CCC(S)CC(=O)O.CCC(S)CC(=O)O

nearest known ligand 0.38

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
GPR84 Q9NQS5 4/20 0.32
SLC22A6 Q4U2R8 1/20 0.30
MME P08473 1/20 0.30
ACE P12821 1/20 0.30
CPA1 P15085 1/20 0.30
ACE2 Q9BYF1 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL869290 1.00 GPR84 (0.32) GPR84SLC22A6MMEACECPA1
SCHEMBL869462 0.92 GPR84 (0.34) GPR84SLC22A6MMEACECPA1
SCHEMBL867994 0.92 GPR84 (0.34) GPR84SLC22A6MMEACECPA1
SCHEMBL868663 0.92 GPR84 (0.34) GPR84SLC22A6MMEACECPA1
SCHEMBL1171039 0.92 GPR84 (0.34) GPR84SLC22A6MMEACECPA1
SCHEMBL3101130 0.84 SLC22A6 (0.32) GPR84SLC22A6MMEACECPA1
SCHEMBL1171042 0.84 GPR84 (0.30) GPR84
SCHEMBL869031 0.83
SCHEMBL394575 0.82 GPR84 (0.33) GPR84SLC22A6MMEACECPA1
SCHEMBL98138 0.82 GPR84 (0.33) GPR84SLC22A6MMEACECPA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 121 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2436715-B1 EPOXY RESIN-BASED COATING COMPOSITION SHOWA DENKO KK (JP) 2016-08-24 EP claimed
US-8865801-B2 Epoxy resin-based coating composition SHOWA DENKO K.K. (JP) 2014-10-21 US claimed
US-8242217-B2 Epoxy resin curing agent, process for preparing the same, and epoxy resin composition SHOWA DENKO K.K. (JP) 2012-08-14 US claimed
EP-2226347-B1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO KK (JP) 2012-06-27 EP claimed
US-20120077903-A1 EPOXY RESIN-BASED COATING COMPOSITION SHOWA DENKO K.K. (JP) 2012-03-29 US claimed
US-20100273940-A1 EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO K.K. (JP) 2010-10-28 US claimed
EP-2226347-A1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION Showa Denko K.K. (JP) 2010-09-08 EP claimed
US-12637544-B2 UV curable silicone composition and cured product thereof DUROPTIX MATERIALS KABUSHIKI KAISHA (JP) 2026-05-26 US disclosed
US-12492293-B2 Multi-component systems for preparing foamed products ARKEMA FRANCE (FR) 2025-12-09 US disclosed
US-12378450-B2 Adhesive for endoscope and cured product thereof, and endoscope and method for producing the same FUJIFILM CORPORATION (JP) 2025-08-05 US disclosed
EP-4089143-B1 LATEX COMPOSITION, MOLDED BODY AND METHOD FOR PRODUCING MOLDED BODY RESONAC CORP (JP) 2025-07-23 EP disclosed
US-20250154361-A1 RECESS FILLING MATERIAL KIT, CURED PRODUCT THEREOF, AND RECESS FILLING METHOD RESONAC CORPORATION (JP) 2025-05-15 US disclosed
US-20250064687-A1 DENTAL CURABLE COMPOSITION AND DENTAL PROSTHESIS COMPRISING BASE MATERIAL AND RESIN LAYER KURARAY NORITAKE DENTAL INC. (JP) 2025-02-27 US disclosed
EP-2172509-A1 CURABLE COMPOSITION AND CURED PRODUCT THEREOF Showa Denko K.K. (JP) 2010-04-07 EP disclosed
EP-2143739-A1 URETHANE COMPOUND, CURABLE COMPOSITION CONTAINING THE SAME, AND CURED PRODUCT OF THE COMPOSITION Showa Denko K.K. (JP) 2010-01-13 EP disclosed
EP-2055726-A1 THIOURETHANE COMPOUND AND PHOTOSENSITIVE RESIN COMPOSITION Showa Denko K.K. (JP) 2009-05-06 EP disclosed
US-20090023831-A1 Curable Composition Containing Thiol Compound SHOWA DENKO K.K. (JP) 2009-01-22 US disclosed
EP-1983017-A1 CURABLE COMPOSITION CONTAINING THIOL COMPOUND Showa Denko K.K. (JP) 2008-10-22 EP disclosed
US-7341828-B2 Thiol compound, photopolymerization initiator composition and photosensitive composition SHOWA DENKO K.K. (JP) 2008-03-11 US disclosed
US-20050153231-A1 Thiol compound, photopolymerization initiator composition and photosensitive composition SHOWA DENKO K.K. (JP) 2005-07-14 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12637544-B2 UV curable silicone composition and cured product thereof QSOX1, MGMT, TST GPR84 4467/4885SLC22A6 3997/4885MME 3192/4885
US-20250064687-A1 DENTAL CURABLE COMPOSITION AND DENTAL PROSTHESIS COMPRISING BASE MATERIAL AND RESIN LAYER MGMT, SEM1, CARM1 GPR84 2827/4885SLC22A6 3015/4885MME 4790/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.