Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.41 |
| ▸ | TP53 | P04637 | 1/20 | 0.41 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.41 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.41 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.41 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.41 |
| ▸ | PRKCA | P17252 | 2/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL25709316 | 0.96 | ALDH1A1 (0.37) | ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2 | |
| SCHEMBL869642 | 0.96 | ALDH1A1 (0.37) | ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2 | |
| SCHEMBL20739973 | 0.95 | ALDH1A1 (0.38) | ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2 | |
| SCHEMBL31483833 | 0.93 | ALDH1A1 (0.37) | ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2 | |
| SCHEMBL868957 | 0.93 | ALDH1A1 (0.37) | ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2 | |
| SCHEMBL31483860 | 0.93 | ALDH1A1 (0.37) | ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2 | |
| SCHEMBL10052264 | 0.93 | ALDH1A1 (0.37) | ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2 | |
| SCHEMBL9958476 | 0.93 | ALDH1A1 (0.37) | ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2 | |
| SCHEMBL869262 | 0.91 | ALDH1A1 (0.34) | ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2 | |
| SCHEMBL25709446 | 0.91 | ALDH1A1 (0.34) | ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 251 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119709079-A | Low-temperature curing epoxy adhesive and preparation method thereof | 亿铖达（深圳）新材料有限公司 | 2025-03-28 | — | — | CN | claimed |
| CN-118244576-A | Photosensitive resin composition and cured film thereof | 罗门哈斯电子材料韩国有限公司 | 2024-06-25 | — | — | CN | claimed |
| EP-3158578-B1 | ADHESION LAYER COMPOSITION, METHOD FOR FORMING FILM BY NANOIMPRINTING, METHODS FOR MANUFACTURING OPTICAL COMPONENT, CIRCUIT BOARD AND ELECTRONIC APPARATUS | CANON KK (JP) | 2024-01-10 | — | — | EP | claimed |
| EP-3696216-A1 | FOAMABLE, SEAL-LAYER FORMING MULTICOMPONENT COMPOSITION AND ITS USE | Hilti Aktiengesellschaft (LI) | 2020-08-19 | — | — | EP | claimed |
| EP-3158012-B1 | FIRE-RESISTANT COMPOUND AND ITS UTILISATION | HILTI AG (LI) | 2020-02-19 | — | — | EP | claimed |
| US-10392516-B2 | Fire protection composition and use thereof | HILTI AKTIENGESELLSCHAFT (LI) | 2019-08-27 | — | — | US | claimed |
| US-10073341-B2 | Adhesion layer composition, method for forming film by nanoimprinting, methods for manufacturing optical component, circuit board and electronic apparatus | CANON KABUSHIKI KAISHA (JP) | 2018-09-11 | — | — | US | claimed |
| US-10000659-B2 | Insulating layer-forming composition and use thereof | HILTI AKTIENGESELLSCHAFT (LI) | 2018-06-19 | — | — | US | claimed |
| EP-2935475-B1 | INSULATING LAYER-FORMING COMPOSITION AND USE THEREOF | HILTI AG (LI) | 2017-07-19 | — | — | EP | claimed |
| US-20170184959-A1 | ADHESION LAYER COMPOSITION, METHOD FOR FORMING FILM BY NANOIMPRINTING, METHODS FOR MANUFACTURING OPTICAL COMPONENT, CIRCUIT BOARD AND ELECTRONIC APPARATUS | CANON KABUSHIKI KAISHA (JP) | 2017-06-29 | — | — | US | claimed |
| US-20150275031-A1 | INSULATING LAYER-FORMING COMPOSITION AND USE THEREOF | HILTI AKTIENGESELLSCHAFT (LI) | 2015-10-01 | — | — | US | claimed |
| US-8865801-B2 | Epoxy resin-based coating composition | SHOWA DENKO K.K. (JP) | 2014-10-21 | — | — | US | claimed |
| WO-2014095516-A1 | INSULATING LAYER-FORMING COMPOSITION AND THE USE THEREOF | HILTI AKTIENGESELLSCHAFT (LI) | 2014-06-26 | — | — | WO | claimed |
| WO-2014095491-A1 | COMPOSITION THAT FORMS AN INSULATING LAYER AND USE THEREOF | HILTI AKTIENGESELLSCHAFT (LI) | 2014-06-26 | — | — | WO | claimed |
| WO-2014095502-A1 | INSULATING LAYER-FORMING COMPOSITION AND USE THEREOF | HILTI AKTIENGESELLSCHAFT (LI) | 2014-06-26 | — | — | WO | claimed |
| US-8242217-B2 | Epoxy resin curing agent, process for preparing the same, and epoxy resin composition | SHOWA DENKO K.K. (JP) | 2012-08-14 | — | — | US | claimed |
| EP-2226347-B1 | EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION | SHOWA DENKO KK (JP) | 2012-06-27 | — | — | EP | claimed |
| US-20120077903-A1 | EPOXY RESIN-BASED COATING COMPOSITION | SHOWA DENKO K.K. (JP) | 2012-03-29 | — | — | US | claimed |
| US-20100273940-A1 | EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION | SHOWA DENKO K.K. (JP) | 2010-10-28 | — | — | US | claimed |
| EP-2226347-A1 | EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION | Showa Denko K.K. (JP) | 2010-09-08 | — | — | EP | claimed |