Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.37 |
| ▸ | TP53 | P04637 | 1/20 | 0.37 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.37 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.37 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.37 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL20739973 | 0.98 | ALDH1A1 (0.38) | ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2 | |
| SCHEMBL31483833 | 0.97 | ALDH1A1 (0.37) | ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2 | |
| SCHEMBL31483860 | 0.97 | ALDH1A1 (0.37) | ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2 | |
| SCHEMBL869409 | 0.93 | ALDH1A1 (0.41) | ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2 | |
| SCHEMBL868170 | 0.93 | — | — | |
| SCHEMBL25709316 | 0.90 | ALDH1A1 (0.37) | ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2 | |
| SCHEMBL869642 | 0.90 | ALDH1A1 (0.37) | ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2 | |
| SCHEMBL98537 | 0.88 | MAPK1 (0.31) | MAPK1HIF1A | |
| SCHEMBL10052264 | 0.87 | ALDH1A1 (0.37) | ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2 | |
| SCHEMBL9958476 | 0.87 | ALDH1A1 (0.37) | ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119709079-A | Low-temperature curing epoxy adhesive and preparation method thereof | 亿铖达（深圳）新材料有限公司 | 2025-03-28 | — | — | CN | claimed |
| EP-2436715-B1 | EPOXY RESIN-BASED COATING COMPOSITION | SHOWA DENKO KK (JP) | 2016-08-24 | — | — | EP | claimed |
| US-8865801-B2 | Epoxy resin-based coating composition | SHOWA DENKO K.K. (JP) | 2014-10-21 | — | — | US | claimed |
| US-8242217-B2 | Epoxy resin curing agent, process for preparing the same, and epoxy resin composition | SHOWA DENKO K.K. (JP) | 2012-08-14 | — | — | US | claimed |
| EP-2226347-B1 | EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION | SHOWA DENKO KK (JP) | 2012-06-27 | — | — | EP | claimed |
| US-20120077903-A1 | EPOXY RESIN-BASED COATING COMPOSITION | SHOWA DENKO K.K. (JP) | 2012-03-29 | — | — | US | claimed |
| US-20100273940-A1 | EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION | SHOWA DENKO K.K. (JP) | 2010-10-28 | — | — | US | claimed |
| EP-2226347-A1 | EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION | Showa Denko K.K. (JP) | 2010-09-08 | — | — | EP | claimed |
| CN-119709079-A | Low-temperature curing epoxy adhesive and preparation method thereof | 亿铖达（深圳）新材料有限公司 | 2025-03-28 | — | — | CN | disclosed |
| US-9557444-B2 | Alkali-soluble resin, photosensitive resin composition, color filter, method for manufacturing the same, and liquid crystal display apparatus | CHI MEI CORPORATION (TW) | 2017-01-31 | — | — | US | disclosed |
| EP-2436715-B1 | EPOXY RESIN-BASED COATING COMPOSITION | SHOWA DENKO KK (JP) | 2016-08-24 | — | — | EP | disclosed |
| US-20150060746-A1 | ALKALI-SOLUBLE RESIN, PHOTOSENSITIVE RESIN COMPOSITION, COLOR FILTER AND METHOD FOR MANUFACTURING THE SAME, LIQUID CRYSTAL DISPLAY APPARATUS | CHI MEI CORPORATION (TW) | 2015-03-05 | — | — | US | disclosed |
| US-8865801-B2 | Epoxy resin-based coating composition | SHOWA DENKO K.K. (JP) | 2014-10-21 | — | — | US | disclosed |
| US-8242217-B2 | Epoxy resin curing agent, process for preparing the same, and epoxy resin composition | SHOWA DENKO K.K. (JP) | 2012-08-14 | — | — | US | disclosed |
| EP-2226347-B1 | EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION | SHOWA DENKO KK (JP) | 2012-06-27 | — | — | EP | disclosed |
| US-20120077903-A1 | EPOXY RESIN-BASED COATING COMPOSITION | SHOWA DENKO K.K. (JP) | 2012-03-29 | — | — | US | disclosed |
| US-8053167-B2 | Curable compositions containing hydroxythiol compound, and cured products thereof | SHOWA DENKO K.K. (JP) | 2011-11-08 | — | — | US | disclosed |
| US-20100273940-A1 | EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION | SHOWA DENKO K.K. (JP) | 2010-10-28 | — | — | US | disclosed |
| EP-2226347-A1 | EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION | Showa Denko K.K. (JP) | 2010-09-08 | — | — | EP | disclosed |