SCHEMBL870599

SCHEMBL870599

CCC1(O)COC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5759115 1.00
Ethane SCHEMBL1010902 0.97
Methane SCHEMBL1011418 0.97
SCHEMBL4679687 0.88
SCHEMBL17040301 0.78
SCHEMBL17040297 0.78
SCHEMBL11556803 0.78
SCHEMBL5866508 0.77
SCHEMBL25261990 0.75 EPHX1 (0.39)
SCHEMBL16889058 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 130 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117777381-A High-strength and toughness organic silicon photosensitive resin for photo-curing 3D printing and preparation method thereof 浙江科技学院 2024-03-29 CN claimed
EP-4695074-A1 ACETOACETYLATED ALCOHOLS Arxada AG (CH) 2026-02-18 EP disclosed
US-12488909-B2 Oxygen and moisture barrier compositions and related methods UNIVERSITY OF MASSACHUSETTS (US) 2025-12-02 US disclosed
CN-116284683-B Oxygen heterocyclic end-capped resin and adhesive using same 东莞澳中新材料科技股份有限公司 2025-06-10 CN disclosed
CN-119504660-A Method for preparing 3,3' - [1, 4-butyl bis (oxymethylene) ] -bis- (3-ethyl) oxetane 湖北荆洪生物科技股份有限公司 2025-02-25 CN disclosed
WO-2024247968-A1 DISPERSANT, DISPERSION, INK, INK SET, AND PRINTED MATTER artience株式会社 2024-12-05 WO disclosed
WO-2024213528-A1 ACETOACETYLATED ALCOHOLS ARXADA AG (CH) 2024-10-17 WO disclosed
US-20240327760-A1 CLEANING SOLUTION FOR HIGH-YIELD-STRESS CERAMIC MATERIAL 3D PRINTING BLANK, PREPARATION METHOD THEREFOR AND USE THEREOF SOOCHOW UNIVERSITY (CN) 2024-10-03 US disclosed
US-20240327760-A1 CLEANING SOLUTION FOR HIGH-YIELD-STRESS CERAMIC MATERIAL 3D PRINTING BLANK, PREPARATION METHOD THEREFOR AND USE THEREOF SOOCHOW UNIVERSITY (CN) 2024-10-03 US disclosed
EP-3604454-B1 COATED PIGMENT, AQUEOUS PIGMENT DISPERSION, USE THEREOF, AND PRODUCTION METHOD THEREFOR ARTIENCE CO LTD (JP) 2024-08-07 EP disclosed
US-20120107328-A1 GAMMA SECRETASE MODULATORS MERCK SHARP & DOHME CORP. 2012-05-03 US disclosed
US-20120094119-A1 PHOTOCURABLE ADHESIVE COMPOSITION, PHOTOCURABLE ADHESIVE LAYER, AND PHOTOCURABLE ADHESIVE SHEET NITTO DENKO CORPORATION (JP) 2012-04-19 US disclosed
US-20120074360-A1 Organic Electronic Material, Ink Composition Containing Same, and Organic Thin Film, Organic Electronic Element, Organic Electroluminescent Element, Lighting Device, and Display Device Formed Therewith HITACHI CHEMICAL COMPANY (JP) 2012-03-29 US disclosed
US-7048368-B2 Ink-jet image forming method KONICA CORPORATION (JP) 2006-05-23 US disclosed
EP-1003736-B1 SUBSTITUTED 4-BENZOYL-PYRAZOLES BASF AG (DE) 2006-04-12 EP disclosed
US-7014310-B2 Inkjet image forming method and inkjet image forming system KONICA CORPORATION (JP) 2006-03-21 US disclosed
US-20040036753-A1 Ink-jet image forming method KONICA CORPORATION (JP) 2004-02-26 US disclosed
US-20030202079-A1 Inkjet image forming method and inkjet image forming system KONICA CORPORATION (JP) 2003-10-30 US disclosed
EP-0629192-A1 HERBICIDALLY ACTIVE PYRIMIDINYL AND TRIAZINYL COMPOUNDS CIBA-GEIGY AG (CH) 1994-12-21 EP disclosed
WO-1994010156-A1 HERBICIDALLY ACTIVE PYRIMIDINYL AND TRIAZINYL COMPOUNDS CIBA-GEIGY AG (CH) 1994-05-11 WO disclosed