SCHEMBL8707

SCHEMBL8707

CCN(CC)C(C)CO

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10673601 1.00
SCHEMBL15317975 1.00
Hydrochloric Acid SCHEMBL10674883 0.97 TSHR (0.37)
Hydrochloric Acid SCHEMBL10594297 0.97 TSHR (0.37)
SCHEMBL28243404 0.97 TSHR (0.37)
SCHEMBL19903775 0.84 TSHR (0.38)
SCHEMBL15133972 0.84 FDPS (0.38)
SCHEMBL29003701 0.84 MAPT (0.33)
SCHEMBL7775089 0.84 FDPS (0.38)
SCHEMBL30353890 0.82 TDP1 (0.41)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 104 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12359125-B2 Silicon etchant composition, pattern formation method and manufacturing method of array substrate using the etchant composition, and array substrate manufactured therefrom DONGWOO FINE-CHEM CO., LTD. (KR) 2025-07-15 US claimed
US-20250026960-A1 POLISHING SLURRY COMPOSITION KCTECH CO.,LTD. (KR) 2025-01-23 US claimed
CN-118339245-A Polishing slurry composition 凯斯科技股份有限公司 2024-07-12 CN claimed
WO-2023121037-A1 POLISHING SLURRY COMPOSITION 주식회사 케이씨텍 2023-06-29 WO claimed
US-11384255-B2 Polishing slurry composition for STI process KCTECH CO., LTD. (KR) 2022-07-12 US claimed
US-20220073819-A1 SILICON ETCHANT COMPOSITION, PATTERN FORMATION METHOD AND MANUFACTURING METHOD OF ARRAY SUBSTRATE USING THE ETCHANT COMPOSITION, AND ARRAY SUBSTRATE MANUFACTURED THEREFROM DONGWOO FINE-CHEM CO., LTD. (KR) 2022-03-10 US claimed
US-20210163785-A1 POLISHING SLURRY COMPOSITION FOR STI PROCESS KCTECH CO., LTD. (KR) 2021-06-03 US claimed
US-20210079262-A1 POLISHING SLURRY COMPOSITION FOR STI PROCESS KCTECH CO., LTD. (KR) 2021-03-18 US claimed
US-20190316003-A1 SLURRY COMPOSITION FOR POLISHING HIGH STEPPED REGION KCTECH CO., LTD. (KR) 2019-10-17 US claimed
CN-101208404-B For the automatic stopping abrasive composition of polishing height ladder height oxide layer TECHNO SEMICHEM Co.,Ltd. (KR) 2016-02-03 CN claimed
US-20110124195-A1 Chemical Mechanical Polishing Composition Containing Polysilicon Polish Finisher TECHNO SEMICHEM CO., LTD. (KR) 2011-05-26 US claimed
US-20110045741-A1 Auto-Stopping Abrasive Composition for Polishing High Step Height Oxide Layer TECHNO SEMICHEM CO., LTD. (KR) 2011-02-24 US claimed
CN-101208404-A Auto-stopping abrasive composition for polishing high step height oxide layer TECHNO SEMICHEM CO LTD (KR) 2008-06-25 CN claimed
WO-2006115393-A1 AUTO-STOPPING ABRASIVE COMPOSITION FOR POLISHING HIGH STEP HEIGHT OXIDE LAYER TECHNO SEMICHEM CO., LTD. (KR) 2006-11-02 WO claimed
US-20030027889-A1 Antimicrobial paste glues CREAVIS GESELLSCHAFT F. TECHN. U. INNOVATION MBH (DE) 2003-02-06 US claimed
US-20030019813-A1 Antimicrobial polymer foams with amino alcohols DE GUSSA AG (DE) 2003-01-30 US claimed
EP-1277820-A2 Antimicrobial adhesives Creavis Gesellschaft für Technologie und Innovation mbH (DE) 2003-01-22 EP claimed
EP-1269843-A1 Antimicrobial polymer foams with aminoalcohols Creavis Gesellschaft für Technologie und Innovation mbH (DE) 2003-01-02 EP claimed
US-20250236792-A1 ETCHANT COMPOSITION FOR ETCHING SILICON AND METHOD OF FORMING PATTERN USING THE SAME DONGWOO FINE-CHEM CO., LTD. (KR) 2025-07-24 US disclosed
US-4128429-A Antifouling quaternary halide salts containing a triorganotin ether moiety SANKYO ORGANIC CHEMICALS COMPANY LIMITED (JP) 1978-12-05 US disclosed