Ethylene Glycol

Ethylene Glycol

SCHEMBL8725210

CN(C)Cc1ccccc1.OCCO

nearest known ligand 0.81

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Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.81
ALDH1A1 P00352 1/20 0.81
TAAR1 Q96RJ0 2/20 0.61
AOC3 Q16853 1/20 0.54
HRH3 Q9Y5N1 1/20 0.52
NPC1 O15118 2/20 0.50
RAB9A P51151 2/20 0.50
CA12 O43570 2/20 0.50
CA9 Q16790 2/20 0.50
MGLL Q99685 1/20 0.48
CA1 P00915 1/20 0.48
CA2 P00918 1/20 0.48
TDP1 Q9NUW8 1/20 0.48
CARM1 Q86X55 1/20 0.47
PRMT6 Q96LA8 1/20 0.47
PRMT8 Q9NR22 1/20 0.47
CHRNB2 P17787 1/20 0.47
CHRNA4 P43681 1/20 0.47
KMT2A Q03164 1/20 0.46
ADRA2B P18089 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ethylene Glycol SCHEMBL27773793 0.98 TSHR (0.77) TSHRALDH1A1TAAR1AOC3HRH3
Propanol SCHEMBL10991820 0.91 TSHR (0.74) TSHRALDH1A1TAAR1AOC3HRH3
Alcohol SCHEMBL5151162 0.91 TSHR (0.81) TSHRALDH1A1TAAR1AOC3HRH3
Methyl Alcohol SCHEMBL2647148 0.90 TSHR (0.90) TSHRALDH1A1TAAR1AOC3HRH3
SCHEMBL24735547 0.90 TSHR (1.00) TSHRALDH1A1TAAR1AOC3HRH3
SCHEMBL5014268 0.90 TSHR (1.00) TSHRALDH1A1TAAR1AOC3HRH3
SCHEMBL15900 0.90 TSHR (1.00) TSHRALDH1A1TAAR1AOC3HRH3
SCHEMBL27766437 0.90 TSHR (1.00) TSHRALDH1A1TAAR1AOC3HRH3
Ammonia Solution, Strong SCHEMBL4071832 0.87 TSHR (0.94) TSHRALDH1A1TAAR1AOC3HRH3
SCHEMBL7911439 0.87 TSHR (0.94) TSHRALDH1A1TAAR1AOC3HRH3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-1083872-C Solvent-free epoxy based adhesives for semiconductor chip attachment and process for preparing same IBM (US) 2002-05-01 CN disclosed
EP-0816461-A2 Solvent-free epoxy based adhesives for semiconductor chip attachment and process International Business Machines Corporation (US) 1998-01-07 EP disclosed
CN-1169452-A Solvent-free epoxy based adhesives for semiconductor chip attachment and process for preparing same IBM (US) 1998-01-07 CN disclosed
US-5700581-A Solvent-free epoxy based adhesives for semiconductor chip attachment and process INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 1997-12-23 US disclosed