SCHEMBL8733534

SCHEMBL8733534

CC(N)CN1CCNC(C)C1

nearest known ligand 0.44

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
BIRC2 Q13490 11/20 0.44
XIAP P98170 8/20 0.35
KDM4E B2RXH2 1/20 0.31
CHRM1 P11229 2/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23714232 0.84 BIRC2 (0.46) BIRC2XIAPCHRM1
SCHEMBL3101583 0.84 BIRC2 (0.46) BIRC2XIAPCHRM1
SCHEMBL27320502 0.81 BIRC2 (0.47) BIRC2XIAPKDM4E
SCHEMBL8598544 0.80
SCHEMBL3109196 0.79 BIRC2 (0.42) BIRC2XIAPCHRM1
SCHEMBL17906594 0.78 BIRC2 (0.49) BIRC2XIAPCHRM1
SCHEMBL27341041 0.78 BIRC2 (0.49) BIRC2XIAPCHRM1
SCHEMBL3098422 0.78 BIRC2 (0.41) BIRC2XIAP
SCHEMBL8406250 0.78 SIGMAR1 (0.33) KDM4E
SCHEMBL27985173 0.78

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240375396-A1 PHOTOSENSITIVE RESIN PRINTING PLATE PRECURSOR FOR RELIEF PRINTING, AND PRINTING PLATE TOYOBO MC CORPORATION (JP) 2024-11-14 US disclosed
EP-4411479-A1 PRINTING ORIGINAL PLATE FOR PHOTOSENSITIVE RESIN LETTERPRESS, AND PRINTING PLATE TOYOBO MC Corporation (JP) 2024-08-07 EP disclosed
CN-118076923-A Printing original plate for photosensitive resin relief printing plate and printing plate 东洋纺MC株式会社 2024-05-24 CN disclosed
WO-2023054272-A1 PRINTING ORIGINAL PLATE FOR PHOTOSENSITIVE RESIN LETTERPRESS, AND PRINTING PLATE 東洋紡株式会社 2023-04-06 WO disclosed
EP-0470636-B1 A photosensitive resin composition TOYO BOSEKI (JP) 1998-11-18 EP disclosed
US-5204223-A Soluble synthetic polymer, photopolymerizable unsaturated compound and photopolymerization inhibitor TOYO BOSEKI KABUSHIKI KAISHA (JP) 1993-04-20 US disclosed
EP-0470636-A1 A photosensitive resin composition Toyo Boseki Kabushiki Kaisha (JP) 1992-02-12 EP disclosed
US-4220704-A Water soluble photosensitive resin compositions comprising a polyamide or its salt TOYOBO CO., LTD. (JP) 1980-09-02 US disclosed
US-4145222-A Water soluble photosensitive resin composition comprising a polyamide or its ammonium salt TOYOBO CO., LTD. (JP) 1979-03-20 US disclosed