SCHEMBL8733676

SCHEMBL8733676

OCOc1ccccc1-c1ccccc1

nearest known ligand 0.60

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
MAPK1 P28482 2/20 0.60
TP53 P04637 1/20 0.60
RAB9A P51151 1/20 0.60
TDP1 Q9NUW8 2/20 0.59
L3MBTL1 Q9Y468 2/20 0.59
HTR7 P34969 1/20 0.56
LMNA P02545 4/20 0.54
RXRA P19793 1/20 0.54
RXRB P28702 1/20 0.54
RXRG P48443 1/20 0.54
ADRB2 P07550 4/20 0.53
KDM4E B2RXH2 4/20 0.53
SMN1; SMN2 Q16637 2/20 0.53
ALDH1A1 P00352 1/20 0.53
HTT P42858 2/20 0.51
ADRB1 P08588 1/20 0.50
MEN1 O00255 1/20 0.50
KMT2A Q03164 1/20 0.50
POLB P06746 1/20 0.49

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18617549 0.88 TDP1 (0.46) MAPK1TP53RAB9ATDP1L3MBTL1
SCHEMBL29418129 0.84 TP53 (0.69) MAPK1TP53RAB9ATDP1L3MBTL1
SCHEMBL159005 0.84 TP53 (0.69) MAPK1TP53RAB9ATDP1L3MBTL1
SCHEMBL13739595 0.84 TP53 (0.74) MAPK1TP53RAB9ATDP1L3MBTL1
SCHEMBL14280096 0.84 MAPK1 (0.62) MAPK1TP53RAB9ATDP1L3MBTL1
SCHEMBL7673601 0.84 TDP1 (0.45) MAPK1TP53RAB9ATDP1L3MBTL1
SCHEMBL7258451 0.83 MAOB (0.50) MAPK1TP53RAB9ATDP1L3MBTL1
SCHEMBL7464993 0.82 MAPK1 (0.60) MAPK1TP53RAB9ATDP1L3MBTL1
SCHEMBL13740267 0.82 TP53 (0.71) MAPK1TP53RAB9ATDP1L3MBTL1
SCHEMBL26153467 0.82 BACE1 (0.46) MAPK1TP53RAB9ATDP1L3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0566780-B1 Heat-resistant resin composition KONISHI CO LTD (JP) 1998-03-11 EP claimed
EP-0566780-A1 Heat-resistant resin composition KONISHI CO., LTD. (JP) 1993-10-27 EP claimed
EP-0566780-B1 Heat-resistant resin composition KONISHI CO LTD (JP) 1998-03-11 EP disclosed
EP-0566780-A1 Heat-resistant resin composition KONISHI CO., LTD. (JP) 1993-10-27 EP disclosed