Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 4/20 | 0.43 |
| ▸ | NR1H2 | P55055 | 14/20 | 0.42 |
| ▸ | NR1H3 | Q13133 | 9/20 | 0.40 |
| ▸ | PPARG | P37231 | 1/20 | 0.38 |
| ▸ | PPARD | Q03181 | 1/20 | 0.38 |
| ▸ | PPARA | Q07869 | 1/20 | 0.38 |
| ▸ | HTR2A | P28223 | 1/20 | 0.37 |
| ▸ | SLC6A4 | P31645 | 1/20 | 0.37 |
| ▸ | KCNH2 | Q12809 | 1/20 | 0.37 |
| ▸ | FAAH | O00519 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL14891696 | 0.92 | MGLL (0.43) | MGLLNR1H2HTR2ASLC6A4KCNH2 | |
| SCHEMBL30806244 | 0.92 | MGLL (0.43) | MGLLNR1H2HTR2ASLC6A4KCNH2 | |
| SCHEMBL350368 | 0.87 | MGLL (0.46) | MGLLNR1H2NR1H3PPARGPPARD | |
| SCHEMBL31314481 | 0.87 | MGLL (0.46) | MGLLNR1H2NR1H3PPARGPPARD | |
| SCHEMBL8732314 | 0.85 | NR1H2 (0.39) | NR1H2NR1H3PPARGPPARDPPARA | |
| SCHEMBL8729990 | 0.83 | MGLL (0.46) | MGLLFAAH | |
| SCHEMBL8853344 | 0.81 | MGLL (0.60) | MGLLFAAH | |
| SCHEMBL8732927 | 0.81 | MGLL (0.46) | MGLLFAAH | |
| SCHEMBL194671 | 0.81 | MGLL (0.43) | MGLLNR1H2NR1H3PPARGPPARD | |
| SCHEMBL30394499 | 0.81 | MGLL (0.43) | MGLLNR1H2NR1H3PPARGPPARD |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0618269-B1 | Thermosetting resin compositions and their use for making resin articles and thin film wiring boards | HITACHI LTD (JP) | 1998-11-11 | — | — | EP | disclosed |
| EP-0755979-A2 | Thermosetting resin compositions and their use for thin film wiring boards | HITACHI, LTD. (JP) | 1997-01-29 | — | — | EP | disclosed |
| EP-0618269-A1 | Thermosetting resin compositions and their use for thin film wiring boards | HITACHI, LTD. (JP) | 1994-10-05 | — | — | EP | disclosed |