Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 8/20 | 0.43 |
| ▸ | FAAH | O00519 | 3/20 | 0.43 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.35 |
| ▸ | HSP90AA1 | P07900 | 2/20 | 0.35 |
| ▸ | HPGD | P15428 | 2/20 | 0.35 |
| ▸ | HTT | P42858 | 2/20 | 0.35 |
| ▸ | MEN1 | O00255 | 1/20 | 0.35 |
| ▸ | LMNA | P02545 | 1/20 | 0.35 |
| ▸ | PKM | P14618 | 1/20 | 0.35 |
| ▸ | CCR6 | P51684 | 1/20 | 0.35 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.35 |
| ▸ | ATM | Q13315 | 1/20 | 0.35 |
| ▸ | CACNA1B | Q00975 | 1/20 | 0.34 |
| ▸ | APBA1 | Q02410 | 1/20 | 0.34 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.34 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.34 |
| ▸ | NR1H2 | P55055 | 4/20 | 0.33 |
| ▸ | HTR2A | P28223 | 1/20 | 0.33 |
| ▸ | SLC6A4 | P31645 | 1/20 | 0.33 |
| ▸ | KCNH2 | Q12809 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30394499 | 1.00 | MGLL (0.43) | MGLLFAAHALDH1A1HSP90AA1HPGD | |
| SCHEMBL350368 | 0.93 | MGLL (0.46) | MGLLFAAHALDH1A1HSP90AA1HPGD | |
| SCHEMBL31314481 | 0.93 | MGLL (0.46) | MGLLFAAHALDH1A1HSP90AA1HPGD | |
| SCHEMBL349441 | 0.89 | MGLL (0.46) | MGLLFAAHALDH1A1HSP90AA1HPGD | |
| SCHEMBL8852702 | 0.84 | MGLL (0.56) | MGLLFAAHALDH1A1HSP90AA1HPGD | |
| SCHEMBL8735003 | 0.81 | MGLL (0.43) | MGLLFAAHNR1H2HTR2ASLC6A4 | |
| SCHEMBL8732715 | 0.80 | MGLL (0.49) | MGLLFAAHALDH1A1HSP90AA1HPGD | |
| SCHEMBL8158102 | 0.79 | RAB9A (0.47) | ALDH1A1HPGDLMNAATMTDP1 | |
| SCHEMBL8735708 | 0.78 | MGLL (0.47) | MGLLFAAHALDH1A1HSP90AA1HPGD | |
| SCHEMBL348056 | 0.78 | MGLL (0.47) | MGLLFAAHALDH1A1HSP90AA1HPGD |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 73 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0449292-B1 | Multilayer printed circuit board and production thereof | HITACHI LTD (JP) | 1997-08-20 | — | — | EP | claimed |
| US-20240006183-A1 | RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING AMIDE SOLVENT | NISSAN CHEMICAL CORPORATION (JP) | 2024-01-04 | — | — | US | disclosed |
| US-11798810-B2 | Resist underlayer film-forming composition containing amide solvent | NISSAN CHEMICAL CORPORATION (JP) | 2023-10-24 | — | — | US | disclosed |
| WO-2020184636-A1 | ADHESIVE FILM FOR CIRCUIT CONNECTION, METHOD FOR PRODUCING CIRCUIT CONNECTED STRUCTURE, AND ADHESIVE FILM HOUSING SET | 日立化成株式会社 | 2020-09-17 | — | — | WO | disclosed |
| WO-2020184583-A1 | ADHESIVE FILM FOR CIRCUIT CONNECTION, MANUFACTURING METHOD THEREOF, MANUFACTURING METHOD OF CIRCUIT CONNECTION STRUCTURE, AND ADHESIVE FILM ACCOMMODATING SET | 日立化成株式会社 | 2020-09-17 | — | — | WO | disclosed |
| WO-2020184585-A1 | ADHESIVE FILM FOR CIRCUIT CONNECTION AND METHOD FOR PRODUCING SAME, METHOD FOR PRODUCING CIRCUIT CONNECTED STRUCTURE, AND ADHESIVE FILM HOUSING SET | 日立化成株式会社 | 2020-09-17 | — | — | WO | disclosed |
| WO-2020184584-A1 | CIRCUIT-CONNECTING ADHESIVE FILM AND METHOD FOR MANUFACTURING SAME, CIRCUIT-CONNECTING STRUCTURE MANUFACTURING METHOD, AND ADHESIVE FILM HOUSING SET | 日立化成株式会社 | 2020-09-17 | — | — | WO | disclosed |
| US-20190354018-A1 | RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING AMIDE SOLVENT | NISSAN CHEMICAL CORPORATION (JP) | 2019-11-21 | — | — | US | disclosed |
| US-20190203048-A1 | Maleimide Resin Composition, Prepreg, Cured Product Of Same And Semiconductor Device | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2019-07-04 | — | — | US | disclosed |
| US-10141084-B2 | Electronic device | CHEIL INDUSTRIES, INC. (KR) | 2018-11-27 | — | — | US | disclosed |
| EP-0618269-B1 | Thermosetting resin compositions and their use for making resin articles and thin film wiring boards | HITACHI LTD (JP) | 1998-11-11 | — | — | EP | disclosed |
| EP-0449292-B1 | Multilayer printed circuit board and production thereof | HITACHI LTD (JP) | 1997-08-20 | — | — | EP | disclosed |
| EP-0755979-A2 | Thermosetting resin compositions and their use for thin film wiring boards | HITACHI, LTD. (JP) | 1997-01-29 | — | — | EP | disclosed |
| EP-0476589-B1 | Multi-layer wiring substrate and production thereof | HITACHI LTD (JP) | 1996-06-12 | — | — | EP | disclosed |
| US-5371236-A | Low melting point; excellent solubility in solvent | MITSUBISHI PETROCHEMICAL CO., LTD. (JP) | 1994-12-06 | — | — | US | disclosed |
| EP-0618269-A1 | Thermosetting resin compositions and their use for thin film wiring boards | HITACHI, LTD. (JP) | 1994-10-05 | — | — | EP | disclosed |
| US-5352762-A | Fluorine-containing biscyanamide thermosetting resin, heat resistance, adhesion | HITACHI, LTD. (JP) | 1994-10-04 | — | — | US | disclosed |
| US-5225499-A | Molding materials of epoxy resins and ether imides | HITACHI, LTD. (JP) | 1993-07-06 | — | — | US | disclosed |
| EP-0476589-A2 | Multi-layer wiring substrate and production thereof | HITACHI, LTD. (JP) | 1992-03-25 | — | — | EP | disclosed |
| EP-0449292-A2 | Multilayer printed circuit board and production thereof | HITACHI, LTD. (JP) | 1991-10-02 | — | — | EP | disclosed |