Known targets — ChEMBL curated mechanism
ACHEBDKRB2CHRM1CHRM2CHRM3CHRNA1CHRNB1CHRNDCHRNECHRNGGUCY1A1GUCY1A2GUCY1B1GUCY1B2NAMPTPTAFRSLC10A2SLC6A2SLC6A3TACR1dacAdacBdacCftsImrcAmrcBmrdA
The experimentally established mechanism targets of Hydrochloric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydrochloric Acid SCHEMBL316669 | 1.00 | — | — | |
| Hydrochloric Acid SCHEMBL8348609 | 1.00 | — | — | |
| Water SCHEMBL5581926 | 0.87 | — | — | |
| Hydrochloric Acid SCHEMBL9235253 | 0.82 | CYP3A4 (0.33) | — | |
| Hydrochloric Acid SCHEMBL1287 | 0.82 | — | — | |
| Hydrochloric Acid SCHEMBL30275019 | 0.82 | — | — | |
| Hydrochloric Acid SCHEMBL7890326 | 0.82 | — | — | |
| Hydrochloric Acid SCHEMBL2965876 | 0.82 | — | — | |
| Hydrochloric Acid SCHEMBL10772992 | 0.82 | CYP3A4 (0.33) | — | |
| Hydrochloric Acid SCHEMBL11150424 | 0.82 | CYP3A4 (0.33) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3356579-B1 | ELECTROPLATING BATH FOR ELECTROCHEMICAL DEPOSITION OF A CU-SN-ZN-PD ALLOY, METHOD FOR ELECTROCHEMICAL DEPOSITION OF SAID ALLOY, SUBSTRATE COMPRISING SAID ALLOY AND USES OF THE SUBSTRATE | COVENTYA S P A (IT) | 2020-03-11 | — | — | EP | claimed |
| EP-3150744-B1 | ELECTROPLATING BATH FOR ELECTROCHEMICAL DEPOSITION OF A CU-SN-ZN-PD ALLOY LAYER, METHOD FOR ELECTROCHEMICAL DEPOSITION OF SAID ALLOY LAYER, SUBSTRATE COMPRISING SAID ALLOY LAYER AND USES OF THE COATED SUBSTRATE | COVENTYA S P A (IT) | 2020-02-12 | — | — | EP | claimed |
| EP-0693579-B1 | Palladium-silver alloys electroplating bath | HERAEUS GMBH W C (DE) | 1997-08-27 | — | — | EP | claimed |
| EP-0693579-A1 | Palladium-silver alloys electroplating bath | W.C. Heraeus GmbH (DE) | 1996-01-24 | — | — | EP | claimed |
| EP-0693579-B1 | Palladium-silver alloys electroplating bath | HERAEUS GMBH W C (DE) | 1997-08-27 | — | — | EP | disclosed |
| US-5549810-A | AQUEOUS AMMONIACAL BATHS CONTAINING POLYAMINES AND MERCAPTOALKANE CARBOXYLIC ACIDS AND/OR MERCAPTOALKANE SULFONIC ACIDS | W.C. HERAEUS GMBH (DE) | 1996-08-27 | — | — | US | disclosed |
| EP-0693579-A1 | Palladium-silver alloys electroplating bath | W.C. Heraeus GmbH (DE) | 1996-01-24 | — | — | EP | disclosed |
| US-4764498-A | Silica-containing shaped articles and a process for their preparation | BAYER AKTIENGESELLSCHAFT (DE) | 1988-08-16 | — | — | US | disclosed |
| US-4715935-A | OXALATE-CONTAINING BATH | OMI INTERNATIONAL CORPORATION (US) | 1987-12-29 | — | — | US | disclosed |
| EP-0083791-B1 | SHAPED ARTICLES CONTAINING SILICA, PROCESSES FOR THEIR PREPARATION AND THEIR USE | BAYER AG (DE) | 1985-12-04 | — | — | EP | disclosed |
| EP-0083791-A2 | Shaped articles containing silica, processes for their preparation and their use | BAYER AG (DE) | 1983-07-20 | — | — | EP | disclosed |