SCHEMBL8770117

SCHEMBL8770117

C=CCC[Si](CC)(CC)CC

nearest known ligand 0.45

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.45
ALDH1A1 P00352 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL235161 0.94 TSHR (0.45) TSHRALDH1A1
SCHEMBL234070 0.94 TSHR (0.45) TSHRALDH1A1
SCHEMBL31097224 0.83 TSHR (0.50) TSHRALDH1A1
SCHEMBL14918646 0.81 TSHR (0.50) TSHRALDH1A1
SCHEMBL236124 0.81 TSHR (0.39) TSHRALDH1A1
SCHEMBL31097218 0.79 TSHR (0.54) TSHRALDH1A1
SCHEMBL6890731 0.79 TSHR (0.54) TSHRALDH1A1
SCHEMBL10840499 0.79 TSHR (0.54) TSHRALDH1A1
SCHEMBL6063307 0.72 TSHR (0.41) TSHRALDH1A1
SCHEMBL28400101 0.72 TSHR (0.41) TSHRALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20140154479-A1 RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, PREPREG AND PRINTED CIRCUIT BOARD SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) 2014-06-05 US claimed
EP-4680675-A1 SILICONE IMPRESSION MATERIAL WITH ACCELERATED CURING Kulzer GmbH (DE) 2026-01-21 EP disclosed
EP-4680676-A1 SILICONE IMPRESSION MATERIAL WITH ACCELERATED CURING Kulzer GmbH (DE) 2026-01-21 EP disclosed
CN-119816783-A Positive photosensitive resin composition 日保丽公司 2025-04-11 CN disclosed
CN-119781249-A Positive photosensitive resin composition, organic EL element barrier wall, organic EL element insulating film, and organic EL element 日保丽公司 2025-04-08 CN disclosed
WO-2024188943-A1 SILICONE IMPRESSION MATERIAL WITH ACCELERATED CURING KULZER GMBH (DE) 2024-09-19 WO disclosed
WO-2024188945-A1 SILICONE IMPRESSION MATERIAL WITH ACCELERATED CURING KULZER GMBH (DE) 2024-09-19 WO disclosed
WO-2024009732-A1 POSITIVE-ACTING PHOTOSENSITIVE RESIN COMPOSITION 日本ポリテック株式会社 2024-01-11 WO disclosed
WO-2023080254-A1 POSITIVE-ACTING PHOTOSENSITIVE RESIN COMPOSITION 株式会社レゾナック 2023-05-11 WO disclosed
CN-103849118-A RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, PREPREG AND PRINTED CIRCUIT BOARD SAMSUNG ELECTRO MECH 2014-06-11 CN disclosed
EP-0604401-B1 Production of a catalyst component for producing crystalline polymers CHISSO CORP (JP) 1997-09-24 EP disclosed
EP-0395391-B1 Catalyst component for producing crystalline polymers and a process for producing the catalyst CHISSO CORP (JP) 1996-09-25 EP disclosed
EP-0564004-B1 A highly stereoregular polypropylene CHISSO CORP (JP) 1996-09-25 EP disclosed
EP-0404519-B1 A process for producing a high-stiffness polypropylene CHISSO CORP (JP) 1996-08-07 EP disclosed
EP-0604401-A2 Production of a catalyst component for producing crystalline polymers CHISSO CORPORATION (JP) 1994-06-29 EP disclosed
EP-0564004-A1 A highly stereoregular polypropylene CHISSO CORPORATION (JP) 1993-10-06 EP disclosed
US-5173540-A Coordination catalyst comprising titanium compound, organo aluminum compound electron donor and a polymer support; transparent, voidless films produced CHISSO CORPORATION (JP) 1992-12-22 US disclosed
US-5077341-A Using coordination catalyst CHISSO CORPORATION (JP) 1991-12-31 US disclosed
EP-0404519-A2 A process for producing a high-stiffness polypropylene CHISSO CORPORATION (JP) 1990-12-27 EP disclosed
EP-0395391-A2 Catalyst component for producing crystalline polymers and a process for producing the catalyst CHISSO CORPORATION (JP) 1990-10-31 EP disclosed