SCHEMBL8809794

SCHEMBL8809794

Nc1ccc(C(c2cccc(O)c2)(C(F)(F)F)C(F)(F)F)cc1

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 2/20 0.52
ESR2 Q92731 2/20 0.52
ALDH1A1 P00352 3/20 0.44
CA14 Q9ULX7 3/20 0.44
CA12 O43570 2/20 0.44
CA2 P00918 2/20 0.44
CA9 Q16790 2/20 0.44
CA1 P00915 1/20 0.44
CA7 P43166 1/20 0.44
TDP1 Q9NUW8 1/20 0.44
TSHR P16473 1/20 0.40
MAPK1 P28482 1/20 0.40
KIF11 P52732 6/20 0.40
MAOB P27338 2/20 0.39
PTGS1 P23219 1/20 0.37
LMNA P02545 2/20 0.37
CYP3A4 P08684 2/20 0.37
HSD17B10 Q99714 2/20 0.37
CA5A P35218 1/20 0.37
CA5B Q9Y2D0 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7940618 0.87 ESR1 (0.69) ESR1ESR2ALDH1A1CA14CA12
SCHEMBL202407 0.87 TSHR (0.47) ESR1ESR2ALDH1A1TDP1TSHR
SCHEMBL30235748 0.87 ESR1 (0.54) ESR1ESR2ALDH1A1CA14CA12
SCHEMBL30912776 0.87 ESR1 (0.54) ESR1ESR2ALDH1A1CA14CA12
SCHEMBL544972 0.87 ESR1 (0.54) ESR1ESR2ALDH1A1CA14CA12
SCHEMBL205041 0.84 TSHR (0.59) ESR1ESR2ALDH1A1CA14CA12
SCHEMBL7637720 0.84 TSHR (0.59) ESR1ESR2ALDH1A1CA14CA12
SCHEMBL9216797 0.83 ESR1 (0.62) ESR1ESR2ALDH1A1CA14CA12
SCHEMBL8466529 0.81 ESR1 (0.78) ESR1ESR2ALDH1A1CA14TSHR
SCHEMBL28280787 0.80 ESR1 (0.75) ESR1ESR2ALDH1A1TSHRKIF11

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0478321-B1 Photosenstive resin composition for forming polyimide film pattern and method of forming polyimide film pattern TOSHIBA KK (JP) 1997-11-12 EP disclosed
US-5518864-A PHOTOSENSITIVE, QUINONE DIAZIDE KABUSHIKI KAISHA TOSHIBA (JP) 1996-05-21 US disclosed
EP-0431971-B1 Photosensitive composition and resin-encapsulated semiconductor device TOSHIBA KK (JP) 1995-07-19 EP disclosed
US-5348835-A Without photoresist KABUSHIKI KAISHA TOSHIBA (JP) 1994-09-20 US disclosed
US-5340684-A Polyimidesiloxane copolymers KABUSHIKI KAISHA TOSHIBA (JP) 1994-08-23 US disclosed
EP-0478321-A1 Photosenstive resin composition for forming polyimide film pattern and method of forming polyimide film pattern KABUSHIKI KAISHA TOSHIBA (JP) 1992-04-01 EP disclosed
EP-0431971-A2 Photosensitive composition and resin-encapsulated semiconductor device KABUSHIKI KAISHA TOSHIBA (JP) 1991-06-12 EP disclosed