SCHEMBL8854355

SCHEMBL8854355

C=CC(Cc1ccccc1)N1C(=O)C2C3C=CC(C3)C2C1=O

nearest known ligand 0.55

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 9/20 0.55
MEN1 O00255 1/20 0.55
KMT2A Q03164 1/20 0.55
TSHR P16473 4/20 0.54
SMN1; SMN2 Q16637 5/20 0.54
HSD11B1 P28845 1/20 0.53
MAPT P10636 2/20 0.48
MAPK1 P28482 2/20 0.48
KDM4E B2RXH2 2/20 0.48
HSP90AA1 P07900 1/20 0.48
GAA P10253 1/20 0.46
LMNA P02545 3/20 0.44
HTT P42858 1/20 0.43
ALPL P05186 1/20 0.41
HPGD P15428 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8971337 0.87 ALDH1A1 (0.46) ALDH1A1MEN1KMT2ATSHRSMN1; SMN2
SCHEMBL8970976 0.82 TSHR (0.55) ALDH1A1MEN1KMT2ATSHRSMN1; SMN2
SCHEMBL8854362 0.79 MEN1 (0.44) ALDH1A1MEN1KMT2ATSHRSMN1; SMN2
SCHEMBL29625364 0.77 TSHR (0.72) ALDH1A1MEN1KMT2ATSHRSMN1; SMN2
SCHEMBL8971533 0.76 TSHR (0.64) ALDH1A1MEN1KMT2ATSHRSMN1; SMN2
SCHEMBL8854361 0.76 ALDH1A1 (0.47) ALDH1A1MEN1KMT2ATSHRSMN1; SMN2
SCHEMBL8971870 0.76 TSHR (0.48) ALDH1A1MEN1KMT2ATSHRSMN1; SMN2
SCHEMBL7789570 0.75 ALDH1A1 (0.55) ALDH1A1MEN1KMT2ASMN1; SMN2MAPT
SCHEMBL7800089 0.73 GSK3A (0.44) ALDH1A1MEN1KMT2AGAA
SCHEMBL8972385 0.73 HTT (0.44) ALDH1A1MEN1KMT2ATSHRSMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5663256-A Thermosetting aqueous-type emulsion of nadimides MARUZEN PETROCHEMICAL CO., LTD. (JP) 1997-09-02 US disclosed
US-5521260-A ALKENYLNADIMIDE, VINYL COMPOUND, PHENOLIC RESIN MARUZEN PETROCHEMICAL CO., LTD. (JP) 1996-05-28 US disclosed
US-4885346-A HEAT CURABLE; MOLDING MATERIALS CIBA-GEIGY CORPORATION (US) 1989-12-05 US disclosed
US-4745166-A Heat-curable mixture containing substituted bicyclo (2.2.1) hept-5-ene-2,3-dicarboximide and polymaleimide, and ethylenically unsaturated phenolic compound CIBA-GEIGY CORPORATION (US) 1988-05-17 US disclosed
US-4678849-A PREPREGS, COMPOSITES, COATINGS CIBA-GEIGY CORPORATION (US) 1987-07-07 US disclosed
US-4579916-A IMPROVED STORAGE STABILITY CIBA-GEIGY CORPORATION (US) 1986-04-01 US disclosed