Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 9/20 | 0.44 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.44 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.44 |
| ▸ | MEN1 | O00255 | 1/20 | 0.44 |
| ▸ | HTT | P42858 | 2/20 | 0.41 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.40 |
| ▸ | TSHR | P16473 | 1/20 | 0.40 |
| ▸ | ACHE | P22303 | 1/20 | 0.40 |
| ▸ | KDM1A | O60341 | 1/20 | 0.38 |
| ▸ | MAOB | P27338 | 1/20 | 0.38 |
| ▸ | HPGD | P15428 | 1/20 | 0.38 |
| ▸ | SIGMAR1 | Q99720 | 1/20 | 0.37 |
| ▸ | GAA | P10253 | 1/20 | 0.37 |
| ▸ | LMNA | P02545 | 1/20 | 0.37 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.37 |
| ▸ | CA12 | O43570 | 1/20 | 0.37 |
| ▸ | CA9 | Q16790 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8859243 | 0.86 | SMN1; SMN2 (0.36) | ALDH1A1KMT2AKDM4EMEN1HTT | |
| SCHEMBL567201 | 0.76 | ALDH1A1 (0.51) | ALDH1A1KMT2AKDM4EMEN1HTT | |
| SCHEMBL7746053 | 0.75 | ALDH1A1 (0.50) | ALDH1A1KMT2AKDM4EMEN1HTT | |
| SCHEMBL14616993 | 0.74 | ALDH1A1 (0.49) | ALDH1A1KMT2AKDM4EMEN1HTT | |
| SCHEMBL6424070 | 0.74 | ALDH1A1 (0.54) | ALDH1A1KMT2AKDM4EMEN1HTT | |
| SCHEMBL15969497 | 0.74 | ALDH1A1 (0.48) | ALDH1A1KDM4EHTTL3MBTL1TSHR | |
| SCHEMBL16226094 | 0.73 | ALDH1A1 (0.53) | ALDH1A1KMT2AKDM4EMEN1HTT | |
| SCHEMBL18185041 | 0.73 | ALDH1A1 (0.52) | ALDH1A1KMT2AKDM4EMEN1HTT | |
| SCHEMBL29410360 | 0.73 | ALDH1A1 (0.49) | ALDH1A1KMT2AKDM4EMEN1HTT | |
| SCHEMBL18185005 | 0.73 | ALDH1A1 (0.49) | ALDH1A1KMT2AKDM4EMEN1HTT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240199854-A1 | COMPOSITION, CURED FILM, STRUCTURAL BODY, OPTICAL FILTER, SOLID-STATE IMAGING ELEMENT, IMAGE DISPLAY DEVICE, AND MANUFACTURING METHOD OF CURED FILM | FUJIFLIM CORPORATION (JP) | 2024-06-20 | — | — | US | disclosed |
| WO-2024057999-A1 | COLORING COMPOSITION, CURED FILM, COLOR FILTER, DISPLAY DEVICE AND METHOD FOR PRODUCING CURED FILM | 富士フイルム株式会社 | 2024-03-21 | — | — | WO | disclosed |
| WO-2023032746-A1 | COMPOSITION, CURED FILM, STRUCTURE, OPTICAL FILTER, SOLID-STATE IMAGING ELEMENT, IMAGE DISPLAY DEVICE, AND METHOD FOR PRODUCING CURED FILM | 富士フイルム株式会社 | 2023-03-09 | — | — | WO | disclosed |
| CN-110095941-B | Photosensitive resin composition and method for producing semiconductor element | 东丽株式会社 | 2023-02-17 | — | — | CN | disclosed |
| CN-107077070-B | Photosensitive resin composition, cured film, element provided with cured film, and method for manufacturing semiconductor device | 东丽株式会社 | 2020-06-16 | — | — | CN | disclosed |
| EP-3203320-B9 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | TORAY INDUSTRIES (JP) | 2020-05-06 | — | — | EP | disclosed |
| EP-3203320-B1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | TORAY INDUSTRIES (JP) | 2019-10-23 | — | — | EP | disclosed |
| US-10409163-B2 | Photosensitive resin composition, cured film, element provided with cured film, and method for manufacturing semiconductor device | TORAY INDUSTRIES, INC. (JP) | 2019-09-10 | — | — | US | disclosed |
| EP-2799928-B1 | PHOTOSENSITIVE RESIN COMPOSITION AND PROCESS FOR PRODUCING SEMICONDUCTOR ELEMENT | TORAY INDUSTRIES (JP) | 2019-05-22 | — | — | EP | disclosed |
| US-20170285477-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 2017-10-05 | — | — | US | disclosed |
| EP-3203320-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELEMENT PROVIDED WITH CURED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Toray Industries, Inc. (JP) | 2017-08-09 | — | — | EP | disclosed |
| US-9704724-B2 | Photosensitive resin composition and method for producing semiconductor device | TORAY INDUSTRIES, INC. (JP) | 2017-07-11 | — | — | US | disclosed |
| EP-2799928-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND PROCESS FOR PRODUCING SEMICONDUCTOR ELEMENT | Toray Industries, Inc. (JP) | 2014-11-05 | — | — | EP | disclosed |
| US-20140242787-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 2014-08-28 | — | — | US | disclosed |
| US-5691100-A | SEMICONDUCTORS | HOECHST JAPAN LIMITED (JP) | 1997-11-25 | — | — | US | disclosed |