SCHEMBL887066

SCHEMBL887066

CC(C)C(=O)OCC(=O)O.[Au]

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PAM P19021 3/20 0.39
TSHR P16473 3/20 0.38
ALDH1A1 P00352 3/20 0.38
NPC1 O15118 2/20 0.38
MEN1 O00255 2/20 0.38
MAPT P10636 2/20 0.38
KMT2A Q03164 2/20 0.38
CTH P32929 1/20 0.38
CBS P35520 1/20 0.38
THPO P40225 1/20 0.38
LMNA P02545 1/20 0.38
RAB9A P51151 1/20 0.38
SMN1; SMN2 Q16637 1/20 0.38
TDP1 Q9NUW8 1/20 0.38
L3MBTL1 Q9Y468 1/20 0.38
THRB P10828 1/20 0.36
GABRP O00591 2/20 0.32
GABRD O14764 2/20 0.32
GABRA1 P14867 2/20 0.32
GABRB1 P18505 2/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2909899 0.97 PAM (0.40) PAMTSHRALDH1A1NPC1MEN1
SCHEMBL18232156 0.88 PAM (0.44) PAMTSHRALDH1A1NPC1MEN1
SCHEMBL27483337 0.79 TP53 (0.43) PAMTSHRALDH1A1MEN1KMT2A
SCHEMBL41709 0.79 TP53 (0.43) PAMTSHRALDH1A1MEN1KMT2A
SCHEMBL7810255 0.78 NPC1 (0.38) TSHRALDH1A1NPC1MEN1MAPT
SCHEMBL7120017 0.77 TP53 (0.41) PAMTSHRALDH1A1MEN1KMT2A
SCHEMBL9305155 0.77 PAM (0.38) PAMTSHRALDH1A1CTHCBS
SCHEMBL21582138 0.77 TSHR (0.42) PAMTSHRALDH1A1CTHCBS
SCHEMBL15008849 0.77 TP53 (0.41) PAMTSHRALDH1A1MEN1KMT2A
SCHEMBL25946615 0.77 PAM (0.38) PAMTSHRALDH1A1CTHCBS

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 97 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2954951-B1 Carrier catalyst and method for producing a porous graphitised carbon material coated with metal nanoparticles HERAEUS DEUTSCHLAND GMBH & CO KG (DE) 2023-08-02 EP disclosed
EP-3568444-B1 INK CONTAINING A SECURITY ELEMENT THE ROYAL MINT LTD (GB) 2023-07-05 EP disclosed
US-20210277268-A1 INK CONTAINING A SECURITY ELEMENT THE ROYAL MINT LTD (GB) 2021-09-09 US disclosed
EP-3568444-A1 INK CONTAINING A SECURITY ELEMENT The Royal Mint Limited (GB) 2019-11-20 EP disclosed
EP-3560588-A1 LOW-TEMPERATURE OXIDATION CATALYST Clariant Catalysts (Japan) K.K. (JP) 2019-10-30 EP disclosed
EP-3560590-A1 METHOD FOR MANUFACTURING LOW-TEMPERATURE OXIDATION CATALYST Clariant Catalysts (Japan) K.K. (JP) 2019-10-30 EP disclosed
US-20190314793-A1 METHOD FOR MANUFACTURING LOW-TEMPERATURE OXIDATION CATALYST CLARIANT CATALYSTS (JAPAN) K.K. (JP) 2019-10-17 US disclosed
US-20190314792-A1 LOW-TEMPERATURE OXIDATION CATALYST CLARIANT CATALYSTS (JAPAN) K.K. (JP) 2019-10-17 US disclosed
US-10283779-B2 Catalyst support and method for producing porous graphitized carbon material covered with metal nanoparticles Heraeus Deutschland GmbH & Co. KG (DE) 2019-05-07 US disclosed
WO-2018189588-A1 MICROCAPSULES HAVING METALLIC NANOPARTICLES, METHODS FOR MAKING MICROCAPSULES HAVING METALLIC NANOPARTICLES, AND USES THEREOF RHODIA OPERATIONS (FR) 2018-10-18 WO disclosed
EP-1448725-A2 LOW VISCOSITY PRECURSOR COMPOSITIONS AND METHODS FOR THE DEPOSITION OF CONDUCTIVE ELECTRONIC FEATURES Superior Micropowders LLC (US) 2004-08-25 EP disclosed
EP-1444055-A1 TAPE COMPOSITIONS FOR THE DEPOSITION OF ELECTRONIC FEATURES Superior Micropowders LLC (US) 2004-08-11 EP disclosed
US-20030180451-A1 Low viscosity copper precursor compositions and methods for the deposition of conductive electronic features CABOT CORPORATION 2003-09-25 US disclosed
US-20030175411-A1 Precursor compositions and methods for the deposition of passive electrical components on a substrate CABOT CORPORATION 2003-09-18 US disclosed
US-20030161959-A1 Precursor compositions for the deposition of passive electronic features CABOT CORPORATION 2003-08-28 US disclosed
US-20030148024-A1 Low viscosity precursor compositons and methods for the depositon of conductive electronic features CABOT CORPORATION 2003-08-07 US disclosed
US-20030124259-A1 Metal precursor compound; and agent that reduces the conversion temperature of said precursor by at least 25 degrees C.; viscosity of at least 1000 centipoise CABOT CORPORATION 2003-07-03 US disclosed
US-20030108664-A1 Depositing silver metal precursor into portion of recessed feature, heating to temperature of not greater than 400 degrees C to convert precursor to conductor having resistivity of not greater than 10 times resistivity of metal CABOT CORPORATION 2003-06-12 US disclosed
WO-2003035279-A1 TAPE COMPOSITIONS FOR THE DEPOSITION OF ELECTRONIC FEATURES SUPERIOR MICROPOWDERS LLC (US) 2003-05-01 WO disclosed
WO-2003032084-A2 LOW VISCOSITY PRECURSOR COMPOSITIONS AND METHODS FOR THE DEPOSITION OF CONDUCTIVE ELECTRONIC FEATURES SUPERIOR MICROPOWDERS LLC (US) 2003-04-17 WO disclosed